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AU2002366673A1 - Mold for used in multi flip-chip underfill encapsulation process - Google Patents

Mold for used in multi flip-chip underfill encapsulation process

Info

Publication number
AU2002366673A1
AU2002366673A1 AU2002366673A AU2002366673A AU2002366673A1 AU 2002366673 A1 AU2002366673 A1 AU 2002366673A1 AU 2002366673 A AU2002366673 A AU 2002366673A AU 2002366673 A AU2002366673 A AU 2002366673A AU 2002366673 A1 AU2002366673 A1 AU 2002366673A1
Authority
AU
Australia
Prior art keywords
mold
encapsulation process
chip underfill
underfill encapsulation
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002366673A
Inventor
Se-Jin Han
Kwang-Sun Kim
Hwa-Il Seo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU2002366673A1 publication Critical patent/AU2002366673A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W74/01—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H10W72/0198—
    • H10W74/016—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AU2002366673A 2001-12-13 2002-12-09 Mold for used in multi flip-chip underfill encapsulation process Abandoned AU2002366673A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2001-0078746A KR100400496B1 (en) 2001-12-13 2001-12-13 Mold for used in multi flip-chip underfill encapsulation process
KR10-2001-0078746 2001-12-13
PCT/KR2002/002307 WO2003050865A1 (en) 2001-12-13 2002-12-09 Mold for used in multi flip-chip underfill encapsulation process

Publications (1)

Publication Number Publication Date
AU2002366673A1 true AU2002366673A1 (en) 2003-06-23

Family

ID=19716973

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002366673A Abandoned AU2002366673A1 (en) 2001-12-13 2002-12-09 Mold for used in multi flip-chip underfill encapsulation process

Country Status (3)

Country Link
KR (1) KR100400496B1 (en)
AU (1) AU2002366673A1 (en)
WO (1) WO2003050865A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7294533B2 (en) * 2003-06-30 2007-11-13 Intel Corporation Mold compound cap in a flip chip multi-matrix array package and process of making same
NL1024248C2 (en) * 2003-09-09 2005-03-10 Fico Bv Method and device for encapsulating electronic components with the aid of a flexible pressure element.
KR100761387B1 (en) 2005-07-13 2007-09-27 서울반도체 주식회사 Mold for forming molding member and molding member forming method using same
JP2014036119A (en) * 2012-08-09 2014-02-24 Apic Yamada Corp Resin molding device
US10276424B2 (en) * 2017-06-30 2019-04-30 Applied Materials, Inc. Method and apparatus for wafer level packaging
CN114156190A (en) * 2021-11-30 2022-03-08 深圳市德明新微电子有限公司 Jig for packaging and packaging method of circuit component

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62122136A (en) * 1985-11-08 1987-06-03 Hitachi Ltd Manufacturing apparatus for resin mold semiconductor
JPH03216309A (en) * 1990-01-22 1991-09-24 Matsushita Electric Ind Co Ltd Method of resin-sealing tab chip
US5817545A (en) * 1996-01-24 1998-10-06 Cornell Research Foundation, Inc. Pressurized underfill encapsulation of integrated circuits
JP3352923B2 (en) * 1997-10-08 2002-12-03 シャープ株式会社 Mold for resin sealing
JPH11121488A (en) * 1997-10-15 1999-04-30 Toshiba Corp Semiconductor device manufacturing method and resin sealing device
JP3130868B2 (en) * 1998-06-30 2001-01-31 山形日本電気株式会社 Resin sealing method for thin package
KR100653607B1 (en) * 1999-11-16 2006-12-05 삼성전자주식회사 Resin molding apparatus for semiconductor chip package having a plurality of sub-runners

Also Published As

Publication number Publication date
KR100400496B1 (en) 2003-10-08
KR20030048743A (en) 2003-06-25
WO2003050865A1 (en) 2003-06-19

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase