AU2002357301A1 - Scavenging system and method - Google Patents
Scavenging system and methodInfo
- Publication number
- AU2002357301A1 AU2002357301A1 AU2002357301A AU2002357301A AU2002357301A1 AU 2002357301 A1 AU2002357301 A1 AU 2002357301A1 AU 2002357301 A AU2002357301 A AU 2002357301A AU 2002357301 A AU2002357301 A AU 2002357301A AU 2002357301 A1 AU2002357301 A1 AU 2002357301A1
- Authority
- AU
- Australia
- Prior art keywords
- scavenging system
- scavenging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 230000002000 scavenging effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/026,338 | 2001-12-20 | ||
| US10/026,338 US6840425B2 (en) | 2000-05-31 | 2001-12-20 | Scavenging system |
| US10/026,337 | 2001-12-20 | ||
| US10/026,337 US6793852B2 (en) | 2000-05-31 | 2001-12-20 | Scavenging method |
| PCT/US2002/040411 WO2003053628A1 (en) | 2001-12-20 | 2002-12-17 | Scavenging system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002357301A1 true AU2002357301A1 (en) | 2003-07-09 |
Family
ID=26701106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002357301A Abandoned AU2002357301A1 (en) | 2001-12-20 | 2002-12-17 | Scavenging system and method |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU2002357301A1 (en) |
| TW (1) | TW200302689A (en) |
| WO (1) | WO2003053628A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107645850A (en) * | 2017-10-23 | 2018-01-30 | 伟创力电子技术(苏州)有限公司 | One kind is used for wiring board die sinking printing mechanism |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63295057A (en) * | 1987-05-27 | 1988-12-01 | Hitachi Ltd | Solder coating equipment |
| JP3410639B2 (en) * | 1997-07-23 | 2003-05-26 | 株式会社日立製作所 | Paste filling method, soldering method and paste printing machine |
| US6491204B1 (en) * | 1999-11-30 | 2002-12-10 | Gunter Erdmann | Stencil wiping device |
-
2002
- 2002-12-17 AU AU2002357301A patent/AU2002357301A1/en not_active Abandoned
- 2002-12-17 WO PCT/US2002/040411 patent/WO2003053628A1/en not_active Ceased
- 2002-12-20 TW TW91136832A patent/TW200302689A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003053628A1 (en) | 2003-07-03 |
| TW200302689A (en) | 2003-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |