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AU2002357301A1 - Scavenging system and method - Google Patents

Scavenging system and method

Info

Publication number
AU2002357301A1
AU2002357301A1 AU2002357301A AU2002357301A AU2002357301A1 AU 2002357301 A1 AU2002357301 A1 AU 2002357301A1 AU 2002357301 A AU2002357301 A AU 2002357301A AU 2002357301 A AU2002357301 A AU 2002357301A AU 2002357301 A1 AU2002357301 A1 AU 2002357301A1
Authority
AU
Australia
Prior art keywords
scavenging system
scavenging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002357301A
Inventor
Jesse Pedigo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TTM Advanced Circuits Inc
Original Assignee
Honeywell Advanced Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/026,338 external-priority patent/US6840425B2/en
Priority claimed from US10/026,337 external-priority patent/US6793852B2/en
Application filed by Honeywell Advanced Circuits Inc filed Critical Honeywell Advanced Circuits Inc
Publication of AU2002357301A1 publication Critical patent/AU2002357301A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/0959Plated through-holes or plated blind vias filled with insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139Blade or squeegee, e.g. for screen printing or filling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0094Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2002357301A 2001-12-20 2002-12-17 Scavenging system and method Abandoned AU2002357301A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/026,338 2001-12-20
US10/026,338 US6840425B2 (en) 2000-05-31 2001-12-20 Scavenging system
US10/026,337 2001-12-20
US10/026,337 US6793852B2 (en) 2000-05-31 2001-12-20 Scavenging method
PCT/US2002/040411 WO2003053628A1 (en) 2001-12-20 2002-12-17 Scavenging system and method

Publications (1)

Publication Number Publication Date
AU2002357301A1 true AU2002357301A1 (en) 2003-07-09

Family

ID=26701106

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002357301A Abandoned AU2002357301A1 (en) 2001-12-20 2002-12-17 Scavenging system and method

Country Status (3)

Country Link
AU (1) AU2002357301A1 (en)
TW (1) TW200302689A (en)
WO (1) WO2003053628A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107645850A (en) * 2017-10-23 2018-01-30 伟创力电子技术(苏州)有限公司 One kind is used for wiring board die sinking printing mechanism

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63295057A (en) * 1987-05-27 1988-12-01 Hitachi Ltd Solder coating equipment
JP3410639B2 (en) * 1997-07-23 2003-05-26 株式会社日立製作所 Paste filling method, soldering method and paste printing machine
US6491204B1 (en) * 1999-11-30 2002-12-10 Gunter Erdmann Stencil wiping device

Also Published As

Publication number Publication date
WO2003053628A1 (en) 2003-07-03
TW200302689A (en) 2003-08-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase