AU2002356823A1 - Method of manufacture of a multi-layered substrate with a thin single crystalline layer - Google Patents
Method of manufacture of a multi-layered substrate with a thin single crystalline layerInfo
- Publication number
- AU2002356823A1 AU2002356823A1 AU2002356823A AU2002356823A AU2002356823A1 AU 2002356823 A1 AU2002356823 A1 AU 2002356823A1 AU 2002356823 A AU2002356823 A AU 2002356823A AU 2002356823 A AU2002356823 A AU 2002356823A AU 2002356823 A1 AU2002356823 A1 AU 2002356823A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacture
- single crystalline
- crystalline layer
- layered substrate
- thin single
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10P72/0442—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/005—Bulk micromachining
- B81C1/00507—Formation of buried layers by techniques other than deposition, e.g. by deep implantation of elements
-
- H10P90/1916—
-
- H10P95/405—
-
- H10W10/181—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Element Separation (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/202,566 | 2002-07-24 | ||
| US10/202,566 US6696352B1 (en) | 2001-09-11 | 2002-07-24 | Method of manufacture of a multi-layered substrate with a thin single crystalline layer and a versatile sacrificial layer |
| PCT/US2002/033278 WO2004010481A1 (en) | 2002-07-24 | 2002-10-18 | Method of manufacture of a multi-layered substrate with a thin single crystalline layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002356823A1 true AU2002356823A1 (en) | 2004-02-09 |
Family
ID=30769855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002356823A Abandoned AU2002356823A1 (en) | 2002-07-24 | 2002-10-18 | Method of manufacture of a multi-layered substrate with a thin single crystalline layer |
Country Status (2)
| Country | Link |
|---|---|
| AU (1) | AU2002356823A1 (en) |
| WO (1) | WO2004010481A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004007060B3 (en) | 2004-02-13 | 2005-07-07 | Thallner, Erich, Dipl.-Ing. | Semiconductor wafer bonding device using application of adhesive before alignment and contacting of corresponding surfaces of semiconductor wafers |
| FR2905801B1 (en) * | 2006-09-12 | 2008-12-05 | Soitec Silicon On Insulator | METHOD FOR TRANSFERRING A HIGH TEMPERATURE LAYER |
| US8324031B2 (en) | 2008-06-24 | 2012-12-04 | Globalfoundries Singapore Pte. Ltd. | Diffusion barrier and method of formation thereof |
| FR2978603B1 (en) | 2011-07-28 | 2013-08-23 | Soitec Silicon On Insulator | METHOD FOR TRANSFERRING A MONOCRYSTALLINE SEMICONDUCTOR LAYER TO A SUPPORT SUBSTRATE |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3112106B2 (en) * | 1991-10-11 | 2000-11-27 | キヤノン株式会社 | Manufacturing method of semiconductor substrate |
| US5877070A (en) * | 1997-05-31 | 1999-03-02 | Max-Planck Society | Method for the transfer of thin layers of monocrystalline material to a desirable substrate |
| JPH1126733A (en) * | 1997-07-03 | 1999-01-29 | Seiko Epson Corp | Transfer method of thin film device, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display device, and electronic equipment |
| US6423614B1 (en) * | 1998-06-30 | 2002-07-23 | Intel Corporation | Method of delaminating a thin film using non-thermal techniques |
-
2002
- 2002-10-18 AU AU2002356823A patent/AU2002356823A1/en not_active Abandoned
- 2002-10-18 WO PCT/US2002/033278 patent/WO2004010481A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004010481A1 (en) | 2004-01-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2002337877A1 (en) | A method of producing a coated substrate | |
| AU2002313948A1 (en) | A wire structure, a thin film transistor substrate of using the wire structure and a method of manufacturing the same | |
| AU2003232469A1 (en) | Method for the production of structured layers on substrates | |
| AU2002329945A1 (en) | Process for forming a fragile layer inside of a single crystalline substrate | |
| AU2003231077A1 (en) | Process for forming a patterned thin film conductive structure on a substrate | |
| GB0325748D0 (en) | A method of forming a patterned layer on a substrate | |
| AU2003304218A1 (en) | Method and system for fabricating multi layer devices on a substrate | |
| AU2003270040A1 (en) | Fabrication method for a monocrystalline semiconductor layer on a substrate | |
| AU2003269886A1 (en) | Method of forming a raised contact for a substrate | |
| AU2003240782A1 (en) | Transparent substrate comprising a conductive layer | |
| AU2002336689A1 (en) | Bonding of a fluoropolymer layer to a substrate | |
| AU2003291733A1 (en) | Method for modifying the surface of a polymeric substrate | |
| AU2003237399A1 (en) | Methods for transferring a layer onto a substrate | |
| AU2002307578A1 (en) | A method of wafer/substrate bonding | |
| AU2003275583A1 (en) | Substrate having multilayer film and method for manufacturing the same | |
| AU2002243473A1 (en) | Method of manufacturing thin film photovoltaic modules | |
| AU2003274477A1 (en) | Formation of a relaxed useful layer from a wafer with no buffer layer | |
| AU2003291419A1 (en) | Method of manufacturing a multi-layered piezoelectric actuator | |
| AU2003287156A1 (en) | Two-step atomic layer deposition of copper layers | |
| AU2002367724A1 (en) | Method of carrying substrate | |
| AU2003262956A1 (en) | Method for electroless deposition of a metal layer on selected portions of a substrate | |
| AU2003263069A1 (en) | A method for depositing a film on a substrate | |
| AU2003213424A1 (en) | Method of depositing cvd thin film | |
| AU2003292089A1 (en) | Self-adhesive article with at least one layer of a thermally-conducting adhesive mass and method for production thereof | |
| AU2002321342A1 (en) | A manufacturing substrate and a method for forming it |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |