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AU2002354196A1 - Substrate holding apparatus, exposure apparatus, and device manufacturing method - Google Patents

Substrate holding apparatus, exposure apparatus, and device manufacturing method

Info

Publication number
AU2002354196A1
AU2002354196A1 AU2002354196A AU2002354196A AU2002354196A1 AU 2002354196 A1 AU2002354196 A1 AU 2002354196A1 AU 2002354196 A AU2002354196 A AU 2002354196A AU 2002354196 A AU2002354196 A AU 2002354196A AU 2002354196 A1 AU2002354196 A1 AU 2002354196A1
Authority
AU
Australia
Prior art keywords
device manufacturing
substrate holding
exposure apparatus
holding apparatus
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002354196A
Inventor
Makoto Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2002354196A1 publication Critical patent/AU2002354196A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU2002354196A 2001-12-17 2002-12-17 Substrate holding apparatus, exposure apparatus, and device manufacturing method Abandoned AU2002354196A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-382897 2001-12-17
JP2001382897 2001-12-17
PCT/JP2002/013180 WO2003052804A1 (en) 2001-12-17 2002-12-17 Substrate holding apparatus, exposure apparatus, and device manufacturing method

Publications (1)

Publication Number Publication Date
AU2002354196A1 true AU2002354196A1 (en) 2003-06-30

Family

ID=19187525

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002354196A Abandoned AU2002354196A1 (en) 2001-12-17 2002-12-17 Substrate holding apparatus, exposure apparatus, and device manufacturing method

Country Status (4)

Country Link
JP (1) JPWO2003052804A1 (en)
AU (1) AU2002354196A1 (en)
TW (1) TW200301538A (en)
WO (1) WO2003052804A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10332112A1 (en) * 2003-07-09 2005-01-27 Carl Zeiss Smt Ag Manufacturing semiconductor, other finely-structured components involves setting working distance at least temporarily to less than maximum size of optical near field of emanating projection light
JP2005259870A (en) * 2004-03-10 2005-09-22 Nikon Corp Substrate holding apparatus, stage apparatus, exposure apparatus, and exposure method
US8705008B2 (en) * 2004-06-09 2014-04-22 Nikon Corporation Substrate holding unit, exposure apparatus having same, exposure method, method for producing device, and liquid repellant plate
JP2008140832A (en) * 2006-11-30 2008-06-19 Disco Abrasive Syst Ltd Pin chuck type chuck table and cutting apparatus using the same
JP4826466B2 (en) * 2006-12-26 2011-11-30 大日本印刷株式会社 Exposure method using work stage of exposure machine
US8111406B2 (en) * 2007-11-14 2012-02-07 Nikon Corporation Surface position detecting apparatus, surface position detecting method, exposure apparatus, and device manufacturing method
JP4858636B2 (en) * 2009-09-29 2012-01-18 株式会社デンソー Metal electrode forming method and metal electrode forming apparatus for semiconductor device
KR102818824B1 (en) 2011-08-12 2025-06-16 에베 그룹 에. 탈너 게엠베하 Apparatus and method for bonding substrates
TW201324617A (en) * 2011-12-13 2013-06-16 Metal Ind Res & Dev Ct Heating device with heat expansion gap monitoring function
NL2009874A (en) * 2011-12-23 2013-06-26 Asml Netherlands Bv Support, lithographic apparatus and device manufacturing method.
JP5912654B2 (en) 2012-02-24 2016-04-27 株式会社東芝 Substrate holding device, pattern transfer device, and pattern transfer method
JP6579873B2 (en) * 2015-09-10 2019-09-25 株式会社ディスコ Processing equipment
JP7432354B2 (en) * 2019-12-19 2024-02-16 東京エレクトロン株式会社 heat treatment equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5867026A (en) * 1981-10-19 1983-04-21 Hitachi Ltd Thin plate metamorphosis device
JPS58219735A (en) * 1982-06-16 1983-12-21 Hitachi Ltd Thin plate exposure method and device therefor
JP3487368B2 (en) * 1994-09-30 2004-01-19 株式会社ニコン Scanning exposure equipment
JPH08195335A (en) * 1995-01-13 1996-07-30 Hitachi Ltd Exposure method and exposure apparatus
JPH08321457A (en) * 1995-05-26 1996-12-03 Nikon Corp Exposure equipment

Also Published As

Publication number Publication date
TW200301538A (en) 2003-07-01
WO2003052804A1 (en) 2003-06-26
JPWO2003052804A1 (en) 2005-04-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase