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AU2002340492A1 - Method for the treatment of electrically conductive substrates and printed circuit boards and the like - Google Patents

Method for the treatment of electrically conductive substrates and printed circuit boards and the like

Info

Publication number
AU2002340492A1
AU2002340492A1 AU2002340492A AU2002340492A AU2002340492A1 AU 2002340492 A1 AU2002340492 A1 AU 2002340492A1 AU 2002340492 A AU2002340492 A AU 2002340492A AU 2002340492 A AU2002340492 A AU 2002340492A AU 2002340492 A1 AU2002340492 A1 AU 2002340492A1
Authority
AU
Australia
Prior art keywords
treatment
printed circuit
circuit boards
electrically conductive
conductive substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002340492A
Inventor
Heidi Fauser
Renate Freudenberger
Volker Rogoll
Christian Schmid
Andreas Zielonka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gebrueder Schmid GmbH and Co
Original Assignee
Gebrueder Schmid GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gebrueder Schmid GmbH and Co filed Critical Gebrueder Schmid GmbH and Co
Publication of AU2002340492A1 publication Critical patent/AU2002340492A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Saccharide Compounds (AREA)

Abstract

The invention relates to a method for the treatment of printed circuit boards, printed circuits and the like, wherein a metal, especially copper, is removed initially by pulsed electrochemical etching and is subsequently removed by chemical etching. As a result, anisotropic removal of the metal is possible and structures which are deeper than the width thereof are obtained.
AU2002340492A 2001-11-05 2002-10-31 Method for the treatment of electrically conductive substrates and printed circuit boards and the like Abandoned AU2002340492A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10154886.9 2001-11-05
DE10154886A DE10154886A1 (en) 2001-11-05 2001-11-05 Process for treating electrically conductive substrates such as printed circuit boards and the like
PCT/EP2002/012153 WO2003041462A2 (en) 2001-11-05 2002-10-31 Method for the treatment of electrically conductive substrates and printed circuit boards and the like

Publications (1)

Publication Number Publication Date
AU2002340492A1 true AU2002340492A1 (en) 2003-05-19

Family

ID=7705054

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002340492A Abandoned AU2002340492A1 (en) 2001-11-05 2002-10-31 Method for the treatment of electrically conductive substrates and printed circuit boards and the like

Country Status (6)

Country Link
EP (1) EP1442155B1 (en)
AT (1) ATE451487T1 (en)
AU (1) AU2002340492A1 (en)
DE (2) DE10154886A1 (en)
TW (1) TWI241153B (en)
WO (1) WO2003041462A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006018111U1 (en) * 2006-07-25 2007-02-08 Lang, Marcus Wet-chemical treatment device for raw material e.g., for circuit board, wafer, has sprayed jet interruption device positioned to be guided discontinuously onto raw material
DE102020122903A1 (en) 2020-09-02 2022-03-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Process for structuring metal layers by electrochemical removal
DE102020127452B4 (en) 2020-10-19 2024-01-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Process for structuring metal layers by electrochemical removal
DE102024111115A1 (en) 2024-04-19 2025-10-23 Christian-Albrechts-Universität zu Kiel, Körperschaft des öffentlichen Rechts Pulsed anodic etching process for producing gear structures on surfaces of copper and/or copper alloys, copper and/or copper alloys

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US512799A (en) * 1894-01-16 Pressure-gage register
US3418227A (en) * 1966-03-31 1968-12-24 Texas Instruments Inc Process for fabricating multiple layer circuit boards
JPS591699A (en) * 1982-06-26 1984-01-07 Mitsubishi Alum Co Ltd Formation of aluminum or aluminum alloy surface film
GB2131454B (en) * 1982-12-07 1986-06-25 Jury Ivanovich Naumov Process for regeneration of iron-copper chloride etching solution
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
JP2975487B2 (en) * 1992-09-14 1999-11-10 東京応化工業株式会社 Method for producing a lithographic printing plate support
US5374338A (en) * 1993-10-27 1994-12-20 International Business Machines Corporation Selective electroetch of copper and other metals
DE19831330C1 (en) * 1998-07-13 1999-11-11 Ko Chien Hsin Electrolytic etching of copper e.g. from printed circuits or circuit boards
US6365057B1 (en) * 1999-11-01 2002-04-02 Bmc Industries, Inc. Circuit manufacturing using etched tri-metal media

Also Published As

Publication number Publication date
EP1442155A2 (en) 2004-08-04
EP1442155B1 (en) 2009-12-09
ATE451487T1 (en) 2009-12-15
TWI241153B (en) 2005-10-01
WO2003041462A2 (en) 2003-05-15
DE10154886A1 (en) 2003-07-31
TW200300325A (en) 2003-05-16
DE50214079D1 (en) 2010-01-21
WO2003041462A3 (en) 2003-10-09

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase