AU2002239386A1 - Rapid thermal processing lamp and method for manufacturing the same - Google Patents
Rapid thermal processing lamp and method for manufacturing the sameInfo
- Publication number
- AU2002239386A1 AU2002239386A1 AU2002239386A AU3938602A AU2002239386A1 AU 2002239386 A1 AU2002239386 A1 AU 2002239386A1 AU 2002239386 A AU2002239386 A AU 2002239386A AU 3938602 A AU3938602 A AU 3938602A AU 2002239386 A1 AU2002239386 A1 AU 2002239386A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacturing
- same
- rapid thermal
- thermal processing
- processing lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any of groups F27B1/00 - F27B15/00
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Chamber type furnaces specially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- H10P72/0436—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- General Induction Heating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25457300P | 2000-12-12 | 2000-12-12 | |
| US60/254,573 | 2000-12-12 | ||
| PCT/US2001/044708 WO2002049395A2 (en) | 2000-12-12 | 2001-12-12 | Rapid thermal processing lamp and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002239386A1 true AU2002239386A1 (en) | 2002-06-24 |
Family
ID=22964803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002239386A Abandoned AU2002239386A1 (en) | 2000-12-12 | 2001-12-12 | Rapid thermal processing lamp and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7285758B2 (en) |
| AU (1) | AU2002239386A1 (en) |
| WO (1) | WO2002049395A2 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4431881B2 (en) | 2004-08-25 | 2010-03-17 | ウシオ電機株式会社 | Excimer lamp lighting device |
| US20070251243A1 (en) * | 2004-09-13 | 2007-11-01 | Geary John M | Thermally stabilized sensors for cooled electrical packages |
| FR2887739B1 (en) * | 2005-06-22 | 2007-08-31 | Roctool Soc Par Actions Simpli | INDUCTION HEATING DEVICE AND METHOD FOR MANUFACTURING PARTS USING SUCH A DEVICE |
| US20080092819A1 (en) * | 2006-10-24 | 2008-04-24 | Applied Materials, Inc. | Substrate support structure with rapid temperature change |
| US20080105201A1 (en) * | 2006-11-03 | 2008-05-08 | Applied Materials, Inc. | Substrate support components having quartz contact tips |
| US7932665B2 (en) * | 2008-12-02 | 2011-04-26 | Osram Sylvania Inc. | Dual filament lamp for rapid temperature processing |
| TWM392431U (en) * | 2010-02-04 | 2010-11-11 | Epistar Corp | Systems for epitaxial growth |
| CN101775727A (en) * | 2010-03-01 | 2010-07-14 | 江苏俊峰纺织机械有限公司 | Natural luster finishing machine roller for electromagnetic and resistance heating by using power current |
| KR20120051194A (en) * | 2010-11-12 | 2012-05-22 | 삼성전자주식회사 | Flip Chip Bonding Device and Manufacturing Method Thereof |
| CN102485935B (en) * | 2010-12-06 | 2013-11-13 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Vapor chamber and substrate processing equipment applied with the vapor chamber |
| JP2012151433A (en) * | 2010-12-28 | 2012-08-09 | Tokyo Electron Ltd | Thermal treatment apparatus |
| JP6151080B2 (en) * | 2013-04-26 | 2017-06-21 | 株式会社ニューフレアテクノロジー | Charged particle beam lithography system |
| DE102014106907A1 (en) * | 2014-05-16 | 2015-11-19 | Robert Bosch Automotive Steering Gmbh | Movable induction unit for heat treatment of a workpiece |
| KR101605717B1 (en) * | 2014-07-16 | 2016-03-23 | 세메스 주식회사 | Apparatus and method for treating substrate |
| JP7191504B2 (en) * | 2017-07-14 | 2022-12-19 | 株式会社Screenホールディングス | Heat treatment equipment |
| JP2019021828A (en) * | 2017-07-20 | 2019-02-07 | 株式会社Screenホールディングス | Heat treatment equipment |
| US20220028707A1 (en) * | 2020-07-21 | 2022-01-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Warm wafer after ion cryo-implantation |
| US12324061B2 (en) * | 2021-04-06 | 2025-06-03 | Applied Materials, Inc. | Epitaxial deposition chamber |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3535481A (en) * | 1969-03-24 | 1970-10-20 | Plastics Eng Co | High frequency induction heating of semiconductive plastics |
| US3699298A (en) * | 1971-12-23 | 1972-10-17 | Western Electric Co | Methods and apparatus for heating and/or coating articles |
| US4263336A (en) * | 1979-11-23 | 1981-04-21 | Motorola, Inc. | Reduced pressure induction heated reactor and method |
| US4545327A (en) * | 1982-08-27 | 1985-10-08 | Anicon, Inc. | Chemical vapor deposition apparatus |
| JP2525348B2 (en) * | 1984-02-09 | 1996-08-21 | 富士通株式会社 | Vapor growth method and apparatus |
| GB8811893D0 (en) * | 1988-05-19 | 1988-06-22 | Secr Defence | Heating of thin filaments |
| US4983804A (en) * | 1989-12-21 | 1991-01-08 | At&T Bell Laboratories | Localized soldering by inductive heating |
| US5410132A (en) * | 1991-10-15 | 1995-04-25 | The Boeing Company | Superplastic forming using induction heating |
| US5294778A (en) * | 1991-09-11 | 1994-03-15 | Lam Research Corporation | CVD platen heater system utilizing concentric electric heating elements |
| US5905343A (en) * | 1995-10-10 | 1999-05-18 | Mccamant; Angus J. | Inductively coupled incandescent light bulb |
| US5800621A (en) * | 1997-02-10 | 1998-09-01 | Applied Materials, Inc. | Plasma source for HDP-CVD chamber |
| US6232585B1 (en) * | 1998-05-19 | 2001-05-15 | Thermal Solutions, Inc. | Temperature self-regulating food delivery system |
| JP2000242108A (en) * | 1999-02-19 | 2000-09-08 | Fuji Xerox Co Ltd | Heating belt and image recorder using the same |
| US6731071B2 (en) * | 1999-06-21 | 2004-05-04 | Access Business Group International Llc | Inductively powered lamp assembly |
-
2001
- 2001-12-12 US US10/450,154 patent/US7285758B2/en not_active Expired - Fee Related
- 2001-12-12 AU AU2002239386A patent/AU2002239386A1/en not_active Abandoned
- 2001-12-12 WO PCT/US2001/044708 patent/WO2002049395A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20040099651A1 (en) | 2004-05-27 |
| WO2002049395A2 (en) | 2002-06-20 |
| WO2002049395A3 (en) | 2003-01-23 |
| US7285758B2 (en) | 2007-10-23 |
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