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AU2002236589A1 - Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles - Google Patents

Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Info

Publication number
AU2002236589A1
AU2002236589A1 AU2002236589A AU3658902A AU2002236589A1 AU 2002236589 A1 AU2002236589 A1 AU 2002236589A1 AU 2002236589 A AU2002236589 A AU 2002236589A AU 3658902 A AU3658902 A AU 3658902A AU 2002236589 A1 AU2002236589 A1 AU 2002236589A1
Authority
AU
Australia
Prior art keywords
microelectronic
substrates
microelectronic substrates
oriented relative
acute angles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002236589A
Inventor
Glenn A. Rinne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitive Electronics Inc
Original Assignee
Unitive Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitive Electronics Inc filed Critical Unitive Electronics Inc
Publication of AU2002236589A1 publication Critical patent/AU2002236589A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H10W90/00—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/834—
    • H10W90/20—
    • H10W90/721—
    • H10W90/724—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2002236589A 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles Abandoned AU2002236589A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/714,311 US6418033B1 (en) 2000-11-16 2000-11-16 Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles
US09/714,311 2000-11-16
PCT/US2001/047372 WO2002041398A2 (en) 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Publications (1)

Publication Number Publication Date
AU2002236589A1 true AU2002236589A1 (en) 2002-05-27

Family

ID=24869523

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002236589A Abandoned AU2002236589A1 (en) 2000-11-16 2001-11-07 Microelectronic packages and packaging methods in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles

Country Status (5)

Country Link
US (1) US6418033B1 (en)
AU (1) AU2002236589A1 (en)
MY (1) MY126102A (en)
TW (1) TW519741B (en)
WO (1) WO2002041398A2 (en)

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Publication number Priority date Publication date Assignee Title
US20010042910A1 (en) * 2000-01-06 2001-11-22 Eng Klan Teng Vertical ball grid array integrated circuit package
AU2002228926A1 (en) 2000-11-10 2002-05-21 Unitive Electronics, Inc. Methods of positioning components using liquid prime movers and related structures
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
JP2002204053A (en) * 2001-01-04 2002-07-19 Mitsubishi Electric Corp Circuit mounting method, circuit mounting substrate, and semiconductor device
US6734538B1 (en) * 2001-04-12 2004-05-11 Bae Systems Information & Electronic Systems Integration, Inc. Article comprising a multi-layer electronic package and method therefor
US7007835B2 (en) * 2001-05-21 2006-03-07 Jds Uniphase Corporation Solder bonding technique for assembling a tilted chip or substrate
US6635960B2 (en) * 2001-08-30 2003-10-21 Micron Technology, Inc. Angled edge connections for multichip structures
DE10203112B4 (en) * 2002-01-25 2005-03-10 Infineon Technologies Ag Method for improving the quality of solder joints
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
WO2004001837A2 (en) 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
TWI225899B (en) 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
EP1471778A1 (en) * 2003-04-24 2004-10-27 Infineon Technologies AG Memory module having space-saving arrangement of memory chips and memory chip therefor
US7049216B2 (en) * 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
WO2005101499A2 (en) 2004-04-13 2005-10-27 Unitive International Limited Methods of forming solder bumps on exposed metal pads and related structures
US20060205170A1 (en) * 2005-03-09 2006-09-14 Rinne Glenn A Methods of forming self-healing metal-insulator-metal (MIM) structures and related devices
SG130055A1 (en) * 2005-08-19 2007-03-20 Micron Technology Inc Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
SG130066A1 (en) 2005-08-26 2007-03-20 Micron Technology Inc Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7566866B2 (en) * 2007-09-10 2009-07-28 Gennum Corporation Systems and methods for a tilted optical receiver assembly
US8476749B2 (en) * 2009-07-22 2013-07-02 Oracle America, Inc. High-bandwidth ramp-stack chip package
GB0912981D0 (en) * 2009-07-27 2009-09-02 St Microelectronics Res & Dev Imaging system and method
KR20120005341A (en) * 2010-07-08 2012-01-16 주식회사 하이닉스반도체 Semiconductor Chips & Packages
US8971676B1 (en) * 2013-10-07 2015-03-03 Oracle International Corporation Hybrid-integrated photonic chip package
DE102015108909B4 (en) * 2015-06-05 2021-02-18 Infineon Technologies Ag Arrangement of several power semiconductor chips and method for producing the same
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
US9825002B2 (en) * 2015-07-17 2017-11-21 Invensas Corporation Flipped die stack
US9508691B1 (en) 2015-12-16 2016-11-29 Invensas Corporation Flipped die stacks with multiple rows of leadframe interconnects
US10566310B2 (en) 2016-04-11 2020-02-18 Invensas Corporation Microelectronic packages having stacked die and wire bond interconnects
US9728524B1 (en) 2016-06-30 2017-08-08 Invensas Corporation Enhanced density assembly having microelectronic packages mounted at substantial angle to board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266282A (en) 1979-03-12 1981-05-05 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
JPS6399558A (en) 1986-10-15 1988-04-30 Mitsubishi Electric Corp Semiconductor device
JP2509969B2 (en) * 1988-02-26 1996-06-26 株式会社日立製作所 Electronic equipment
US5227664A (en) * 1988-02-26 1993-07-13 Hitachi, Ltd. Semiconductor device having particular mounting arrangement
US5019943A (en) * 1990-02-14 1991-05-28 Unisys Corporation High density chip stack having a zigzag-shaped face which accommodates connections between chips
US5239447A (en) * 1991-09-13 1993-08-24 International Business Machines Corporation Stepped electronic device package
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
US5347428A (en) 1992-12-03 1994-09-13 Irvine Sensors Corporation Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
WO1994026083A1 (en) 1993-04-23 1994-11-10 Irvine Sensors Corporation Electronic module comprising a stack of ic chips
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
US5793116A (en) 1996-05-29 1998-08-11 Mcnc Microelectronic packaging using arched solder columns
JPH10335580A (en) * 1997-06-02 1998-12-18 Mitsubishi Electric Corp Semiconductor package and semiconductor module using the same
US5990472A (en) 1997-09-29 1999-11-23 Mcnc Microelectronic radiation detectors for detecting and emitting radiation signals
JP3718039B2 (en) * 1997-12-17 2005-11-16 株式会社日立製作所 Semiconductor device and electronic device using the same
US6134120A (en) * 1998-09-04 2000-10-17 American Standard Inc. Low profile circuit board mounting arrangement
DE10034081A1 (en) * 2000-07-13 2001-10-18 Infineon Technologies Ag Semiconducting component has semiconducting chips mounted on bearer substrate at angle to main surface of substrate so only lateral edge of each chip is in direct contact with substrate

Also Published As

Publication number Publication date
US6418033B1 (en) 2002-07-09
TW519741B (en) 2003-02-01
WO2002041398A3 (en) 2003-04-10
WO2002041398A9 (en) 2003-10-02
WO2002041398A2 (en) 2002-05-23
MY126102A (en) 2006-09-29

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