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AU2002225663A1 - Methods and systems for positioning substrates - Google Patents

Methods and systems for positioning substrates

Info

Publication number
AU2002225663A1
AU2002225663A1 AU2002225663A AU2566302A AU2002225663A1 AU 2002225663 A1 AU2002225663 A1 AU 2002225663A1 AU 2002225663 A AU2002225663 A AU 2002225663A AU 2566302 A AU2566302 A AU 2566302A AU 2002225663 A1 AU2002225663 A1 AU 2002225663A1
Authority
AU
Australia
Prior art keywords
systems
methods
positioning substrates
substrates
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002225663A
Inventor
Glenn A. Rinne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitive Electronics Inc
Original Assignee
Unitive Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitive Electronics Inc filed Critical Unitive Electronics Inc
Publication of AU2002225663A1 publication Critical patent/AU2002225663A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10484—Obliquely mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07223—
    • H10W72/07236—
    • H10W72/07251—
    • H10W72/251—
    • H10W72/252—
    • H10W72/253—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2002225663A 2000-11-10 2001-11-05 Methods and systems for positioning substrates Abandoned AU2002225663A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24690000P 2000-11-10 2000-11-10
US60/246,900 2000-11-10
PCT/US2001/043426 WO2002039498A2 (en) 2000-11-10 2001-11-05 Methods and systems for positioning substrates

Publications (1)

Publication Number Publication Date
AU2002225663A1 true AU2002225663A1 (en) 2002-05-21

Family

ID=22932714

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002225663A Abandoned AU2002225663A1 (en) 2000-11-10 2001-11-05 Methods and systems for positioning substrates

Country Status (5)

Country Link
US (1) US6666368B2 (en)
EP (1) EP1415336A2 (en)
AU (1) AU2002225663A1 (en)
TW (1) TW564507B (en)
WO (1) WO2002039498A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002228926A1 (en) * 2000-11-10 2002-05-21 Unitive Electronics, Inc. Methods of positioning components using liquid prime movers and related structures
TW559963B (en) * 2001-06-08 2003-11-01 Shibaura Mechatronics Corp Pressuring apparatus of electronic device and its method
US7567257B2 (en) * 2005-12-16 2009-07-28 Microsoft Corporation Partition-based undo of partitioned object graph
FR2905883B1 (en) * 2006-09-14 2008-12-05 Valeo Electronique Sys Liaison METHOD FOR WELDING AN ORGAN ON A SUPPORT BY DELIVERING MATERIAL AND DEVICE FOR ARRANGING TWO ELEMENTS ON ONE ANOTHER
US7841510B2 (en) 2007-01-19 2010-11-30 International Business Machines Corporation Method and apparatus providing fine alignment of a structure relative to a support
US7724992B2 (en) * 2007-10-29 2010-05-25 Corning Incorporated Glass-based micropositioning systems and methods
CN102148202B (en) * 2010-02-09 2016-06-08 精材科技股份有限公司 Chip package and method of forming the same
US8692382B2 (en) * 2010-03-11 2014-04-08 Yu-Lin Yen Chip package
TWI532139B (en) * 2010-03-11 2016-05-01 精材科技股份有限公司 Chip package and method of forming same
US8698316B2 (en) * 2010-03-11 2014-04-15 Yu-Lin Yen Chip package
US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8360303B2 (en) 2010-07-22 2013-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Forming low stress joints using thermal compress bonding
US8104666B1 (en) * 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
US8177862B2 (en) 2010-10-08 2012-05-15 Taiwan Semiconductor Manufacturing Co., Ltd Thermal compressive bond head
JP2014216615A (en) * 2013-04-30 2014-11-17 キヤノン株式会社 Method of mounting electronic component, circuit board, and image formation device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206138A (en) 1989-02-06 1990-08-15 Shimadzu Corp Method of mounting flip-chip
FR2651025B1 (en) 1989-08-18 1991-10-18 Commissariat Energie Atomique ASSEMBLY OF PARTS HAVING AN ANGLE BETWEEN THEM AND METHOD FOR OBTAINING THIS ASSEMBLY
JPH05144874A (en) 1991-11-21 1993-06-11 Sharp Corp Connection method of chip with solder bump
US5289631A (en) 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
JP3194553B2 (en) * 1993-08-13 2001-07-30 富士通株式会社 Method for manufacturing semiconductor device
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
JP2793528B2 (en) * 1995-09-22 1998-09-03 インターナショナル・ビジネス・マシーンズ・コーポレイション Soldering method and soldering device
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
US6117299A (en) 1997-05-09 2000-09-12 Mcnc Methods of electroplating solder bumps of uniform height on integrated circuit substrates
US5968670A (en) 1997-08-12 1999-10-19 International Business Machines Corporation Enhanced ceramic ball grid array using in-situ solder stretch with spring
US6131795A (en) * 1997-11-10 2000-10-17 Matsushita Electric Industrial Co., Ltd. Thermal compression bonding method of electronic part with solder bump
JP3399324B2 (en) 1997-11-10 2003-04-21 松下電器産業株式会社 Thermocompression bonding method for electronic components with solder bumps
US6037192A (en) * 1998-01-22 2000-03-14 Nortel Networks Corporation Process of assembling an integrated circuit and a terminal substrate using solder reflow and adhesive cure
US6138894A (en) * 1998-11-25 2000-10-31 Intermedics Inc. Method for coupling a circuit component to a substrate
US6495397B2 (en) * 2001-03-28 2002-12-17 Intel Corporation Fluxless flip chip interconnection

Also Published As

Publication number Publication date
EP1415336A2 (en) 2004-05-06
US6666368B2 (en) 2003-12-23
WO2002039498A3 (en) 2004-02-26
US20020109000A1 (en) 2002-08-15
WO2002039498A2 (en) 2002-05-16
TW564507B (en) 2003-12-01

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