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AU2002224581A1 - Temperature-controlled thermal platform for automated testing - Google Patents

Temperature-controlled thermal platform for automated testing

Info

Publication number
AU2002224581A1
AU2002224581A1 AU2002224581A AU2458102A AU2002224581A1 AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1 AU 2002224581 A AU2002224581 A AU 2002224581A AU 2458102 A AU2458102 A AU 2458102A AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1
Authority
AU
Australia
Prior art keywords
temperature
automated testing
controlled thermal
thermal platform
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002224581A
Inventor
William M Stone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Temptronic Corp
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of AU2002224581A1 publication Critical patent/AU2002224581A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P72/0432
AU2002224581A 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing Abandoned AU2002224581A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22001600P 2000-07-21 2000-07-21
US60/220,016 2000-07-21
US26783001P 2001-02-09 2001-02-09
US60/267,830 2001-02-09
PCT/US2001/022574 WO2002009156A1 (en) 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing

Publications (1)

Publication Number Publication Date
AU2002224581A1 true AU2002224581A1 (en) 2002-02-05

Family

ID=26914495

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002224581A Abandoned AU2002224581A1 (en) 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing

Country Status (5)

Country Link
US (2) US6744270B2 (en)
EP (1) EP1312106A1 (en)
JP (1) JP2004507886A (en)
AU (1) AU2002224581A1 (en)
WO (1) WO2002009156A1 (en)

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US6744270B2 (en) * 2000-07-21 2004-06-01 Temptronic Corporation Temperature-controlled thermal platform for automated testing
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
JP2004257980A (en) * 2003-02-27 2004-09-16 Mire Kk Semiconductor element test handler
US6971793B2 (en) * 2003-03-21 2005-12-06 Asm Assembly Automation Ltd. Test handler temperature monitoring system
US20050121186A1 (en) * 2003-11-26 2005-06-09 Temptronic Corporation Apparatus and method for reducing electrical noise in a thermally controlled chuck
US20060066335A1 (en) * 2004-09-28 2006-03-30 Kang Seung H Semiconductor test device with heating circuit
US7061264B2 (en) * 2004-09-29 2006-06-13 Agere Systems, Inc. Test semiconductor device and method for determining Joule heating effects in such a device
JP4525571B2 (en) * 2005-11-24 2010-08-18 住友電気工業株式会社 Wafer holder, heater unit on which it is mounted, and wafer prober
US7461535B2 (en) * 2006-03-01 2008-12-09 Memsic, Inc. Multi-temperature programming for accelerometer
US8151872B2 (en) 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
JP4598093B2 (en) * 2008-02-15 2010-12-15 株式会社日立ハイテクノロジーズ Defect inspection equipment
US8087823B2 (en) * 2008-08-18 2012-01-03 International Business Machines Corporation Method for monitoring thermal control
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
US7888951B2 (en) * 2009-02-10 2011-02-15 Qualitau, Inc. Integrated unit for electrical/reliability testing with improved thermal control
US8779793B2 (en) * 2010-03-03 2014-07-15 Nvidia Corporation System and method for temperature cycling
US9335080B2 (en) 2011-10-17 2016-05-10 Temptronic Corporation Temperature system having an impurity filter
WO2014001528A1 (en) 2012-06-29 2014-01-03 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements
ITMI20121157A1 (en) * 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A TESTING OF ELECTRONIC DEVICES WITH HEATERS AVAILABLE BETWEEN TEST CARDS AND ELECTRONIC DEVICES TO TEST
ITMI20131086A1 (en) * 2013-06-28 2014-12-29 Eles Semiconductor Equipment S P A TEST CARD WITH LOCAL THERMAL CONDITIONING ELEMENTS
KR101468984B1 (en) * 2013-04-29 2014-12-05 (주) 예스티 Apparatus for testing led component
KR20160025863A (en) * 2014-08-28 2016-03-09 삼성전자주식회사 Contact structure for a test handler, test handler having contact structure and method of testing integrated circuit devices using the test handler
JP2018523122A (en) * 2015-07-21 2018-08-16 デルタ・デザイン・インコーポレイテッドDelta Design, Inc. Continuous fluid thermal interface material distribution
CN106990268B (en) * 2017-04-21 2023-11-17 湖南人文科技学院 Electrochemical comprehensive tester
CN111584389B (en) * 2020-06-12 2025-02-07 苏州震坤科技有限公司 Automatic burn-in test equipment
CN114260039B (en) * 2021-12-31 2025-08-26 松山湖材料实验室 Rotating heating stage and two-dimensional material transfer device

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US6489793B2 (en) * 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
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JP3539662B2 (en) * 1997-11-10 2004-07-07 オリオン機械株式会社 Temperature control plate for semiconductor wafer
US5983711A (en) * 1997-12-29 1999-11-16 Arizona Instrument Corporation Temperature controlled gravimetric moisture analyzer and method therefor
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6070413A (en) * 1998-07-01 2000-06-06 Temptronic Corporation Condensation-free apparatus and method for transferring low-temperature fluid
JP2000031253A (en) * 1998-07-10 2000-01-28 Komatsu Ltd Substrate processing apparatus and method
JP5000803B2 (en) * 1998-07-14 2012-08-15 デルタ・デザイン・インコーポレイテッド Apparatus and method for performing rapid response temperature repetitive control of electronic device over a wide range using liquid
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
US6545494B1 (en) * 2000-07-10 2003-04-08 Temptronic Corporation Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
US6744270B2 (en) * 2000-07-21 2004-06-01 Temptronic Corporation Temperature-controlled thermal platform for automated testing
US6518782B1 (en) * 2000-08-29 2003-02-11 Delta Design, Inc. Active power monitoring using externally located current sensors

Also Published As

Publication number Publication date
WO2002009156A1 (en) 2002-01-31
US20020047702A1 (en) 2002-04-25
EP1312106A1 (en) 2003-05-21
US6744270B2 (en) 2004-06-01
WO2002009156A8 (en) 2003-03-13
JP2004507886A (en) 2004-03-11
US6867611B2 (en) 2005-03-15
US20040174181A1 (en) 2004-09-09

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