AU2002224581A1 - Temperature-controlled thermal platform for automated testing - Google Patents
Temperature-controlled thermal platform for automated testingInfo
- Publication number
- AU2002224581A1 AU2002224581A1 AU2002224581A AU2458102A AU2002224581A1 AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1 AU 2002224581 A AU2002224581 A AU 2002224581A AU 2458102 A AU2458102 A AU 2458102A AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1
- Authority
- AU
- Australia
- Prior art keywords
- temperature
- automated testing
- controlled thermal
- thermal platform
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H10P72/0432—
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22001600P | 2000-07-21 | 2000-07-21 | |
| US60/220,016 | 2000-07-21 | ||
| US26783001P | 2001-02-09 | 2001-02-09 | |
| US60/267,830 | 2001-02-09 | ||
| PCT/US2001/022574 WO2002009156A1 (en) | 2000-07-21 | 2001-07-18 | Temperature-controlled thermal platform for automated testing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2002224581A1 true AU2002224581A1 (en) | 2002-02-05 |
Family
ID=26914495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2002224581A Abandoned AU2002224581A1 (en) | 2000-07-21 | 2001-07-18 | Temperature-controlled thermal platform for automated testing |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6744270B2 (en) |
| EP (1) | EP1312106A1 (en) |
| JP (1) | JP2004507886A (en) |
| AU (1) | AU2002224581A1 (en) |
| WO (1) | WO2002009156A1 (en) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7147214B2 (en) * | 2000-01-24 | 2006-12-12 | Ut-Battelle, Llc | Humidifier for fuel cell using high conductivity carbon foam |
| US6744270B2 (en) * | 2000-07-21 | 2004-06-01 | Temptronic Corporation | Temperature-controlled thermal platform for automated testing |
| US6891134B2 (en) * | 2003-02-10 | 2005-05-10 | Asml Netherlands B.V. | Integrally formed bake plate unit for use in wafer fabrication system |
| JP2004257980A (en) * | 2003-02-27 | 2004-09-16 | Mire Kk | Semiconductor element test handler |
| US6971793B2 (en) * | 2003-03-21 | 2005-12-06 | Asm Assembly Automation Ltd. | Test handler temperature monitoring system |
| US20050121186A1 (en) * | 2003-11-26 | 2005-06-09 | Temptronic Corporation | Apparatus and method for reducing electrical noise in a thermally controlled chuck |
| US20060066335A1 (en) * | 2004-09-28 | 2006-03-30 | Kang Seung H | Semiconductor test device with heating circuit |
| US7061264B2 (en) * | 2004-09-29 | 2006-06-13 | Agere Systems, Inc. | Test semiconductor device and method for determining Joule heating effects in such a device |
| JP4525571B2 (en) * | 2005-11-24 | 2010-08-18 | 住友電気工業株式会社 | Wafer holder, heater unit on which it is mounted, and wafer prober |
| US7461535B2 (en) * | 2006-03-01 | 2008-12-09 | Memsic, Inc. | Multi-temperature programming for accelerometer |
| US8151872B2 (en) | 2007-03-16 | 2012-04-10 | Centipede Systems, Inc. | Method and apparatus for controlling temperature |
| JP4598093B2 (en) * | 2008-02-15 | 2010-12-15 | 株式会社日立ハイテクノロジーズ | Defect inspection equipment |
| US8087823B2 (en) * | 2008-08-18 | 2012-01-03 | International Business Machines Corporation | Method for monitoring thermal control |
| US20100116788A1 (en) * | 2008-11-12 | 2010-05-13 | Lam Research Corporation | Substrate temperature control by using liquid controlled multizone substrate support |
| US7888951B2 (en) * | 2009-02-10 | 2011-02-15 | Qualitau, Inc. | Integrated unit for electrical/reliability testing with improved thermal control |
| US8779793B2 (en) * | 2010-03-03 | 2014-07-15 | Nvidia Corporation | System and method for temperature cycling |
| US9335080B2 (en) | 2011-10-17 | 2016-05-10 | Temptronic Corporation | Temperature system having an impurity filter |
| WO2014001528A1 (en) | 2012-06-29 | 2014-01-03 | Eles Semiconductor Equipment S.P.A. | Test board with local thermal conditioning elements |
| ITMI20121157A1 (en) * | 2012-06-29 | 2013-12-30 | Eles Semiconductor Equipment S P A | TESTING OF ELECTRONIC DEVICES WITH HEATERS AVAILABLE BETWEEN TEST CARDS AND ELECTRONIC DEVICES TO TEST |
| ITMI20131086A1 (en) * | 2013-06-28 | 2014-12-29 | Eles Semiconductor Equipment S P A | TEST CARD WITH LOCAL THERMAL CONDITIONING ELEMENTS |
| KR101468984B1 (en) * | 2013-04-29 | 2014-12-05 | (주) 예스티 | Apparatus for testing led component |
| KR20160025863A (en) * | 2014-08-28 | 2016-03-09 | 삼성전자주식회사 | Contact structure for a test handler, test handler having contact structure and method of testing integrated circuit devices using the test handler |
| JP2018523122A (en) * | 2015-07-21 | 2018-08-16 | デルタ・デザイン・インコーポレイテッドDelta Design, Inc. | Continuous fluid thermal interface material distribution |
| CN106990268B (en) * | 2017-04-21 | 2023-11-17 | 湖南人文科技学院 | Electrochemical comprehensive tester |
| CN111584389B (en) * | 2020-06-12 | 2025-02-07 | 苏州震坤科技有限公司 | Automatic burn-in test equipment |
| CN114260039B (en) * | 2021-12-31 | 2025-08-26 | 松山湖材料实验室 | Rotating heating stage and two-dimensional material transfer device |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE234748C (en) | ||||
| JPS59150434A (en) | 1983-02-07 | 1984-08-28 | Toshiba Corp | Manufacture and apparatus of semiconductor device |
| DD234748A1 (en) * | 1985-02-14 | 1986-04-09 | Erfurt Mikroelektronik | DEVICE FOR CARRYING OUT THERMAL PROCESSES IN SEMICONDUCTOR MANUFACTURING |
| US4734872A (en) | 1985-04-30 | 1988-03-29 | Temptronic Corporation | Temperature control for device under test |
| JPH0752749B2 (en) | 1986-02-19 | 1995-06-05 | 富士通株式会社 | Wafer holding mechanism |
| US5198752A (en) * | 1987-09-02 | 1993-03-30 | Tokyo Electron Limited | Electric probing-test machine having a cooling system |
| US4848090A (en) * | 1988-01-27 | 1989-07-18 | Texas Instruments Incorporated | Apparatus for controlling the temperature of an integrated circuit package |
| JPH02148715A (en) * | 1988-11-29 | 1990-06-07 | Canon Inc | Apparatus for forming semiconductor device continuously |
| US5278495A (en) * | 1991-11-08 | 1994-01-11 | Ncr Corporation | Memory and apparatus for a thermally accelerated reliability testing |
| US5205132A (en) * | 1992-06-12 | 1993-04-27 | Thermonics Incorporated | Computer-implemented method and system for precise temperature control of a device under test |
| JPH06349938A (en) * | 1993-06-11 | 1994-12-22 | Tokyo Electron Ltd | Vacuum processing device |
| US5451884A (en) * | 1993-08-04 | 1995-09-19 | Transat Corp. | Electronic component temperature test system with flat ring revolving carriage |
| CN1137296A (en) * | 1993-12-17 | 1996-12-04 | 布鲁克斯自动化公司 | Apparatus for heating or cooling wafers |
| JP2809595B2 (en) | 1994-11-28 | 1998-10-08 | シーケーディ株式会社 | Plate heat treatment apparatus and heat treatment method |
| US5977785A (en) * | 1996-05-28 | 1999-11-02 | Burward-Hoy; Trevor | Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment |
| JPH1092914A (en) * | 1996-09-09 | 1998-04-10 | Orion Mach Co Ltd | Humidity adjuster |
| US6489793B2 (en) * | 1996-10-21 | 2002-12-03 | Delta Design, Inc. | Temperature control of electronic devices using power following feedback |
| US5847927A (en) | 1997-01-27 | 1998-12-08 | Raytheon Company | Electronic assembly with porous heat exchanger and orifice plate |
| JP3539662B2 (en) * | 1997-11-10 | 2004-07-07 | オリオン機械株式会社 | Temperature control plate for semiconductor wafer |
| US5983711A (en) * | 1997-12-29 | 1999-11-16 | Arizona Instrument Corporation | Temperature controlled gravimetric moisture analyzer and method therefor |
| US6415858B1 (en) * | 1997-12-31 | 2002-07-09 | Temptronic Corporation | Temperature control system for a workpiece chuck |
| US6070413A (en) * | 1998-07-01 | 2000-06-06 | Temptronic Corporation | Condensation-free apparatus and method for transferring low-temperature fluid |
| JP2000031253A (en) * | 1998-07-10 | 2000-01-28 | Komatsu Ltd | Substrate processing apparatus and method |
| JP5000803B2 (en) * | 1998-07-14 | 2012-08-15 | デルタ・デザイン・インコーポレイテッド | Apparatus and method for performing rapid response temperature repetitive control of electronic device over a wide range using liquid |
| US6445202B1 (en) * | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
| US6399926B2 (en) * | 2000-04-03 | 2002-06-04 | Sigmameltec Ltd. | Heat-treating apparatus capable of high temperature uniformity |
| US6545494B1 (en) * | 2000-07-10 | 2003-04-08 | Temptronic Corporation | Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode |
| US6552561B2 (en) * | 2000-07-10 | 2003-04-22 | Temptronic Corporation | Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode |
| US6744270B2 (en) * | 2000-07-21 | 2004-06-01 | Temptronic Corporation | Temperature-controlled thermal platform for automated testing |
| US6518782B1 (en) * | 2000-08-29 | 2003-02-11 | Delta Design, Inc. | Active power monitoring using externally located current sensors |
-
2001
- 2001-07-18 US US09/908,149 patent/US6744270B2/en not_active Expired - Fee Related
- 2001-07-18 EP EP01984365A patent/EP1312106A1/en not_active Withdrawn
- 2001-07-18 AU AU2002224581A patent/AU2002224581A1/en not_active Abandoned
- 2001-07-18 WO PCT/US2001/022574 patent/WO2002009156A1/en not_active Ceased
- 2001-07-18 JP JP2002514767A patent/JP2004507886A/en active Pending
-
2004
- 2004-03-16 US US10/802,961 patent/US6867611B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002009156A1 (en) | 2002-01-31 |
| US20020047702A1 (en) | 2002-04-25 |
| EP1312106A1 (en) | 2003-05-21 |
| US6744270B2 (en) | 2004-06-01 |
| WO2002009156A8 (en) | 2003-03-13 |
| JP2004507886A (en) | 2004-03-11 |
| US6867611B2 (en) | 2005-03-15 |
| US20040174181A1 (en) | 2004-09-09 |
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