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AU2002224066A1 - Aligner, aligning method and method for fabricating device - Google Patents

Aligner, aligning method and method for fabricating device

Info

Publication number
AU2002224066A1
AU2002224066A1 AU2002224066A AU2406602A AU2002224066A1 AU 2002224066 A1 AU2002224066 A1 AU 2002224066A1 AU 2002224066 A AU2002224066 A AU 2002224066A AU 2406602 A AU2406602 A AU 2406602A AU 2002224066 A1 AU2002224066 A1 AU 2002224066A1
Authority
AU
Australia
Prior art keywords
aligner
fabricating device
aligning
aligning method
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002224066A
Inventor
Naomasa Shiraishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2002224066A1 publication Critical patent/AU2002224066A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • H10P76/00—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AU2002224066A 2000-11-22 2001-11-21 Aligner, aligning method and method for fabricating device Abandoned AU2002224066A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000355447 2000-11-22
JP2000-355447 2000-11-22
PCT/JP2001/010184 WO2002043123A1 (en) 2000-11-22 2001-11-21 Aligner, aligning method and method for fabricating device

Publications (1)

Publication Number Publication Date
AU2002224066A1 true AU2002224066A1 (en) 2002-06-03

Family

ID=18827858

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002224066A Abandoned AU2002224066A1 (en) 2000-11-22 2001-11-21 Aligner, aligning method and method for fabricating device

Country Status (7)

Country Link
US (1) US20030197848A1 (en)
EP (1) EP1341221A1 (en)
JP (1) JPWO2002043123A1 (en)
KR (1) KR20030051624A (en)
CN (1) CN1476629A (en)
AU (1) AU2002224066A1 (en)
WO (1) WO2002043123A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1341046A3 (en) * 2002-03-01 2004-12-15 ASML Netherlands B.V. Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
TW594431B (en) 2002-03-01 2004-06-21 Asml Netherlands Bv Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
JP4235392B2 (en) * 2002-03-08 2009-03-11 キヤノン株式会社 Position detection apparatus, surface shape estimation apparatus, exposure apparatus, and device manufacturing method
SG141416A1 (en) * 2003-04-30 2008-04-28 Asml Netherlands Bv Lithographic apparatus,device manufacturing methods, mask and method of characterising a mask and/or pellicle
US6809794B1 (en) * 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP2005051055A (en) * 2003-07-29 2005-02-24 Tokyo Electron Ltd Lamination method and laminating apparatus
JP2005085991A (en) * 2003-09-09 2005-03-31 Canon Inc Exposure apparatus and device manufacturing method using the apparatus
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
EP1689171A1 (en) * 2005-02-03 2006-08-09 Sony Ericsson Mobile Communications AB LED flash control
US7221434B2 (en) 2005-03-01 2007-05-22 Canon Kabushiki Kaisha Exposure method and apparatus
US20080073596A1 (en) * 2006-08-24 2008-03-27 Asml Netherlands B.V. Lithographic apparatus and method
US20080233487A1 (en) * 2007-03-21 2008-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and System for Optimizing Lithography Focus and/or Energy Using a Specially-Designed Optical Critical Dimension Pattern
WO2008116886A1 (en) * 2007-03-27 2008-10-02 Carl Zeiss Smt Ag Correction of optical elements by means of correction light emitted in a flat manner
WO2013152031A1 (en) 2012-04-04 2013-10-10 Kla-Tencor Corporation Protective fluorine-doped silicon oxide film for optical components
CN104977809B (en) * 2014-04-08 2017-06-27 上海微电子装备有限公司 A method for calibrating vertical control parameters of a lithography machine
KR20160141861A (en) * 2014-04-23 2016-12-09 라이테큐 비.브이. Photolithography apparatus comprising projection system for control of image size
CN105652598B (en) * 2014-11-11 2018-03-02 上海微电子装备（集团）股份有限公司 A kind of device and method for measuring mask aligner mask platform gradient and vertical degree
US10459354B2 (en) 2015-04-23 2019-10-29 Asml Netherlands B.V. Lithographic apparatus and lithographic projection method
JP6815477B2 (en) * 2017-02-27 2021-01-20 富士フイルム株式会社 Microscope device and observation method and microscope device control program
CN111480113A (en) * 2017-12-12 2020-07-31 Asml荷兰有限公司 Apparatus and method for determining pellicle-related status
EP3628990B1 (en) 2018-09-26 2021-08-25 ams International AG Integrated optical transducer and method for detecting dynamic pressure changes
CN116068848A (en) * 2021-11-03 2023-05-05 长鑫存储技术有限公司 Photomask inspection system and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3139023B2 (en) * 1991-01-30 2001-02-26 株式会社日立製作所 Electron beam apparatus and focus adjustment method for electron beam apparatus
JP3036081B2 (en) * 1990-12-01 2000-04-24 株式会社日立製作所 Electron beam drawing apparatus and method, and sample surface height measuring apparatus thereof
US5209813A (en) * 1990-10-24 1993-05-11 Hitachi, Ltd. Lithographic apparatus and method
JP3391409B2 (en) * 1993-07-14 2003-03-31 株式会社ニコン Projection exposure method and apparatus, and element manufacturing method
US5581324A (en) * 1993-06-10 1996-12-03 Nikon Corporation Thermal distortion compensated projection exposure method and apparatus for manufacturing semiconductors
JPH09180989A (en) * 1995-12-26 1997-07-11 Toshiba Corp Exposure apparatus and exposure method
US6549271B2 (en) * 1997-01-28 2003-04-15 Nikon Corporation Exposure apparatus and method
JPH1145846A (en) * 1997-07-25 1999-02-16 Nikon Corp Scanning exposure method and apparatus

Also Published As

Publication number Publication date
US20030197848A1 (en) 2003-10-23
CN1476629A (en) 2004-02-18
KR20030051624A (en) 2003-06-25
JPWO2002043123A1 (en) 2004-04-02
EP1341221A1 (en) 2003-09-03
WO2002043123A1 (en) 2002-05-30

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