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AU2002221064A1 - Ultraviolet-curable resin composition and photosolder resist ink containing the composition - Google Patents

Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Info

Publication number
AU2002221064A1
AU2002221064A1 AU2002221064A AU2106402A AU2002221064A1 AU 2002221064 A1 AU2002221064 A1 AU 2002221064A1 AU 2002221064 A AU2002221064 A AU 2002221064A AU 2106402 A AU2106402 A AU 2106402A AU 2002221064 A1 AU2002221064 A1 AU 2002221064A1
Authority
AU
Australia
Prior art keywords
composition
ultraviolet
curable resin
ink containing
resist ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002221064A
Inventor
Soichi Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of AU2002221064A1 publication Critical patent/AU2002221064A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/12—Polymers provided for in subclasses C08C or C08F
    • C08F290/126—Polymers of unsaturated carboxylic acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/142—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
    • C08F2800/20—Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2810/00—Chemical modification of a polymer
    • C08F2810/30—Chemical modification of a polymer leading to the formation or introduction of aliphatic or alicyclic unsaturated groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
AU2002221064A 2000-12-14 2001-12-06 Ultraviolet-curable resin composition and photosolder resist ink containing the composition Abandoned AU2002221064A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-381110 2000-12-14
JP2000381110 2000-12-14
JP2000-398458 2000-12-27
JP2000398458 2000-12-27
PCT/JP2001/010657 WO2002048226A1 (en) 2000-12-14 2001-12-06 Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Publications (1)

Publication Number Publication Date
AU2002221064A1 true AU2002221064A1 (en) 2002-06-24

Family

ID=26605867

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002221064A Abandoned AU2002221064A1 (en) 2000-12-14 2001-12-06 Ultraviolet-curable resin composition and photosolder resist ink containing the composition

Country Status (8)

Country Link
US (1) US6964813B2 (en)
EP (1) EP1359172B1 (en)
JP (1) JP4095441B2 (en)
CN (1) CN1233679C (en)
AU (1) AU2002221064A1 (en)
DE (1) DE60138836D1 (en)
TW (1) TW562834B (en)
WO (1) WO2002048226A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT504465A1 (en) * 2002-10-21 2008-05-15 Surface Specialties Austria AQUEOUS NONTIONICALLY STABILIZED EPOXY RESINS
JP2004263142A (en) * 2003-03-04 2004-09-24 Goo Chemical Co Ltd Polyester resin, ultraviolet hardenable resin composition, hardened product and printed circuit board
TW200602427A (en) * 2004-03-30 2006-01-16 Taiyo Ink Mfg Co Ltd Thermosetting resin composition and multilayered printed wiring board comprising the same
WO2006001171A1 (en) * 2004-06-09 2006-01-05 Bridgestone Corporation Developing roller, electrostatic roller, conductive roller and method for manufacture thereof
CN101410757A (en) * 2006-03-29 2009-04-15 太阳油墨制造株式会社 Photocurable/thermosetting resin composition, cured product thereof and printed wiring board obtained by using same
CN102662304B (en) * 2007-01-25 2016-12-14 新应材股份有限公司 A double-sided lithographic etching process
JP5154915B2 (en) * 2007-12-26 2013-02-27 株式会社日本触媒 Alkali-soluble resin having main chain ring structure and use thereof
JP5412357B2 (en) * 2010-04-01 2014-02-12 株式会社フジクラ Membrane wiring board
TWI442181B (en) * 2010-12-02 2014-06-21 Ind Tech Res Inst Photosensitive composition and photoresist
US9081275B2 (en) 2010-12-02 2015-07-14 Industrial Technology Research Institute Photosensitive composition and photoresist
KR20120082169A (en) * 2011-01-13 2012-07-23 삼성전자주식회사 Photosensitive adhesive composition having alkali soluble epoxy resin, and patternable adhesive film using the same
CN102654731B (en) * 2011-09-02 2014-04-02 京东方科技集团股份有限公司 Color photoresist, color filter and display device containing same
JP5970185B2 (en) * 2011-12-27 2016-08-17 株式会社タムラ製作所 Resin and photosensitive composition containing the resin
EP2907833A4 (en) * 2012-10-15 2016-10-05 Daicel Corp Curable resin composition, and cured product thereof
JP6184087B2 (en) * 2012-12-07 2017-08-23 日本化薬株式会社 Active energy ray curable resin composition, and display element spacer and / or color filter protective film using the same
CN103235484B (en) * 2013-04-25 2016-04-06 京东方科技集团股份有限公司 Light resistance composition and preparation method thereof and display device
CN104714365A (en) * 2014-07-01 2015-06-17 广东丹邦科技有限公司 Photosensitive composition and photoresist
CN105330829A (en) * 2015-10-29 2016-02-17 苏州市博来特油墨有限公司 Preparation method of connecting material prepolymer in ink for printing PE materials
JP6753305B2 (en) * 2016-12-22 2020-09-09 Dic株式会社 Aqueous epoxy resin compositions, fiber sizing agents, fiber materials, molding materials, and coating agents
JP6996284B2 (en) * 2016-12-28 2022-01-17 荒川化学工業株式会社 Resin and its manufacturing method, active energy ray-curable resin composition, cured product, active energy ray-curable printing ink, and printed matter.
WO2018191237A1 (en) * 2017-04-12 2018-10-18 Sun Chemical Corporation Stable photoresist compositions comprising organosulphur compounds
JP2024518795A (en) * 2021-05-18 2024-05-02 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン Photocurable composition

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (en) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk Resist ink composition
JPH0823694B2 (en) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 Liquid photosensitive resin composition
US5124234A (en) * 1989-01-20 1992-06-23 Fuji Photo Film Co., Ltd. Liquid light-sensitive resin composition
JPH04151158A (en) 1990-05-18 1992-05-25 Arakawa Chem Ind Co Ltd Alkali development type liquid photosolder-resist ink composition
JPH04166944A (en) 1990-10-31 1992-06-12 Mitsubishi Kasei Corp Photosensitive resin composition
JPH0767008B2 (en) 1991-09-21 1995-07-19 太陽インキ製造株式会社 Solder resist pattern forming method
US5306744A (en) 1992-12-18 1994-04-26 Rohm And Haas Company Functionalized multistage polymers
EP0750025B1 (en) 1995-06-23 1999-02-03 Ems-Inventa Ag Heat curable powder coating composition
DE19614008C2 (en) 1995-06-23 1997-05-22 Inventa Ag Thermosetting powder coating material
JP4081217B2 (en) * 1999-03-17 2008-04-23 互応化学工業株式会社 UV curable resin composition, photo solder resist ink, pre-dried film, substrate and printed wiring board
CN1210620C (en) * 2000-09-16 2005-07-13 互応化学工业株式会社 Ultraviolet curable resin composition and photo-solder resist ink containing the same

Also Published As

Publication number Publication date
EP1359172B1 (en) 2009-05-27
CN1496377A (en) 2004-05-12
DE60138836D1 (en) 2009-07-09
JP4095441B2 (en) 2008-06-04
US6964813B2 (en) 2005-11-15
EP1359172A1 (en) 2003-11-05
US20040044102A1 (en) 2004-03-04
JPWO2002048226A1 (en) 2004-04-15
CN1233679C (en) 2005-12-28
TW562834B (en) 2003-11-21
WO2002048226A1 (en) 2002-06-20
EP1359172A4 (en) 2005-03-30

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