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AU2002220882A1 - Electrostatic clamping - Google Patents

Electrostatic clamping

Info

Publication number
AU2002220882A1
AU2002220882A1 AU2002220882A AU2088202A AU2002220882A1 AU 2002220882 A1 AU2002220882 A1 AU 2002220882A1 AU 2002220882 A AU2002220882 A AU 2002220882A AU 2088202 A AU2088202 A AU 2088202A AU 2002220882 A1 AU2002220882 A1 AU 2002220882A1
Authority
AU
Australia
Prior art keywords
electrostatic clamping
electrostatic
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002220882A
Inventor
David Andrew Tossell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aviza Europe Ltd
Original Assignee
Aviza Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aviza Europe Ltd filed Critical Aviza Europe Ltd
Publication of AU2002220882A1 publication Critical patent/AU2002220882A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P72/72—
AU2002220882A 2000-12-05 2001-12-04 Electrostatic clamping Abandoned AU2002220882A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB0029570.9A GB0029570D0 (en) 2000-12-05 2000-12-05 Electrostatic clamp
GB0029570 2000-12-05
PCT/GB2001/005357 WO2002047126A1 (en) 2000-12-05 2001-12-04 Electrostatic clamping

Publications (1)

Publication Number Publication Date
AU2002220882A1 true AU2002220882A1 (en) 2002-06-18

Family

ID=9904419

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002220882A Abandoned AU2002220882A1 (en) 2000-12-05 2001-12-04 Electrostatic clamping

Country Status (5)

Country Link
US (1) US6876534B2 (en)
AU (1) AU2002220882A1 (en)
DE (1) DE10195142T1 (en)
GB (2) GB0029570D0 (en)
WO (1) WO2002047126A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358411B2 (en) 2003-06-30 2008-04-15 Shell Oil Company Hydrocracking of diphenylalkanes
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
US8599531B2 (en) * 2009-01-11 2013-12-03 Applied Materials, Inc. Electrostatic end effector apparatus, systems and methods
US10896842B2 (en) 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
JP5628507B2 (en) * 2009-10-20 2014-11-19 東京エレクトロン株式会社 Sample stage and microwave plasma processing equipment
US9428833B1 (en) 2015-05-29 2016-08-30 Lam Research Corporation Method and apparatus for backside deposition reduction by control of wafer support to achieve edge seal
US10056453B2 (en) 2016-07-22 2018-08-21 Globalfoundries Inc. Semiconductor wafers with reduced bow and warpage
US11302557B2 (en) * 2020-05-01 2022-04-12 Applied Materials, Inc. Electrostatic clamping system and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
US5325261A (en) 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
KR100188454B1 (en) * 1991-05-28 1999-06-01 이노우에 아키라 Substrate processing equipment
US5421401A (en) * 1994-01-25 1995-06-06 Applied Materials, Inc. Compound clamp ring for semiconductor wafers
JPH08130207A (en) 1994-10-31 1996-05-21 Matsushita Electric Ind Co Ltd Plasma processing device
CH692000A5 (en) * 1995-11-13 2001-12-31 Unaxis Balzers Ag Coating chamber, substrate carrier therefor, method of vacuum deposition and coating methods.
GB9618620D0 (en) 1996-09-06 1996-10-16 Electrotech Equipments Ltd A method of forming a layer
JPH11145265A (en) 1997-11-11 1999-05-28 Nissin Electric Co Ltd Electrostatic chuck
US6228208B1 (en) * 1998-08-12 2001-05-08 Applied Materials, Inc. Plasma density and etch rate enhancing semiconductor processing chamber
US6162336A (en) * 1999-07-12 2000-12-19 Chartered Semiconductor Manufacturing Ltd. Clamping ring design to reduce wafer sticking problem in metal deposition

Also Published As

Publication number Publication date
GB2375432B (en) 2005-06-08
WO2002047126A1 (en) 2002-06-13
GB2375432A (en) 2002-11-13
US20030002237A1 (en) 2003-01-02
GB0029570D0 (en) 2001-01-17
GB0216711D0 (en) 2002-08-28
DE10195142T1 (en) 2003-10-23
US6876534B2 (en) 2005-04-05

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