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AU2002216661A1 - Method for cleaning etcher parts - Google Patents

Method for cleaning etcher parts

Info

Publication number
AU2002216661A1
AU2002216661A1 AU2002216661A AU1666102A AU2002216661A1 AU 2002216661 A1 AU2002216661 A1 AU 2002216661A1 AU 2002216661 A AU2002216661 A AU 2002216661A AU 1666102 A AU1666102 A AU 1666102A AU 2002216661 A1 AU2002216661 A1 AU 2002216661A1
Authority
AU
Australia
Prior art keywords
cleaning
etcher
parts
etcher parts
cleaning etcher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002216661A
Inventor
Daryl W. Peters
Roberto J. Rovito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ashland Inc
Original Assignee
Ashland Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ashland Inc filed Critical Ashland Inc
Publication of AU2002216661A1 publication Critical patent/AU2002216661A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66—Non-ionic compounds
    • C11D1/835—Mixtures of non-ionic with cationic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • C11D7/30—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5013—Organic solvents containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/46—Specific cleaning or washing processes applying energy, e.g. irradiation
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3263—Amides or imides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3281—Heterocyclic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU2002216661A 2000-12-07 2001-12-03 Method for cleaning etcher parts Abandoned AU2002216661A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/732,414 US6656894B2 (en) 2000-12-07 2000-12-07 Method for cleaning etcher parts
US09732414 2000-12-07
PCT/US2001/043171 WO2002046344A1 (en) 2000-12-07 2001-12-03 Method for cleaning etcher parts

Publications (1)

Publication Number Publication Date
AU2002216661A1 true AU2002216661A1 (en) 2002-06-18

Family

ID=24943433

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002216661A Abandoned AU2002216661A1 (en) 2000-12-07 2001-12-03 Method for cleaning etcher parts

Country Status (6)

Country Link
US (1) US6656894B2 (en)
EP (1) EP1341883A4 (en)
KR (1) KR20030070055A (en)
CN (1) CN1266262C (en)
AU (1) AU2002216661A1 (en)
WO (1) WO2002046344A1 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030022800A1 (en) * 2001-06-14 2003-01-30 Peters Darryl W. Aqueous buffered fluoride-containing etch residue removers and cleaners
US7521366B2 (en) * 2001-12-12 2009-04-21 Lg Display Co., Ltd. Manufacturing method of electro line for liquid crystal display device
US6943142B2 (en) * 2002-01-09 2005-09-13 Air Products And Chemicals, Inc. Aqueous stripping and cleaning composition
KR100455503B1 (en) * 2002-06-17 2004-11-06 동부전자 주식회사 Rinsing method of contact hole in semiconductor
US6677286B1 (en) * 2002-07-10 2004-01-13 Air Products And Chemicals, Inc. Compositions for removing etching residue and use thereof
JP4352880B2 (en) * 2003-12-02 2009-10-28 セイコーエプソン株式会社 Cleaning method and cleaning device
US7148072B2 (en) * 2004-05-28 2006-12-12 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for oxidizing conductive redeposition in TMR sensors
US7442114B2 (en) * 2004-12-23 2008-10-28 Lam Research Corporation Methods for silicon electrode assembly etch rate and etch uniformity recovery
US7507670B2 (en) * 2004-12-23 2009-03-24 Lam Research Corporation Silicon electrode assembly surface decontamination by acidic solution
US7247579B2 (en) 2004-12-23 2007-07-24 Lam Research Corporation Cleaning methods for silicon electrode assembly surface contamination removal
WO2006124201A2 (en) * 2005-05-13 2006-11-23 Sachem, Inc. Selective wet etching of oxides
TWI339780B (en) * 2005-07-28 2011-04-01 Rohm & Haas Elect Mat Stripper
TW200722505A (en) * 2005-09-30 2007-06-16 Rohm & Haas Elect Mat Stripper
CN1966636B (en) * 2005-11-15 2011-08-03 安集微电子（上海）有限公司 Cleaning liquid composition
US7534753B2 (en) * 2006-01-12 2009-05-19 Air Products And Chemicals, Inc. pH buffered aqueous cleaning composition and method for removing photoresist residue
KR100678482B1 (en) 2006-01-17 2007-02-02 삼성전자주식회사 Cleaning solution of silicon surface and manufacturing method of semiconductor device using same
WO2008012231A2 (en) * 2006-07-27 2008-01-31 Basf Se Use of 1,5-dimethylpyrrolidone
KR100823714B1 (en) * 2006-08-24 2008-04-21 삼성전자주식회사 Cleaning solution for polymer removal and polymer removal method using same
US7879783B2 (en) 2007-01-11 2011-02-01 Air Products And Chemicals, Inc. Cleaning composition for semiconductor substrates
US20080234162A1 (en) * 2007-03-21 2008-09-25 General Chemical Performance Products Llc Semiconductor etch residue remover and cleansing compositions
US10391526B2 (en) 2013-12-12 2019-08-27 Lam Research Corporation Electrostatic chuck cleaning fixture
US10894935B2 (en) 2015-12-04 2021-01-19 Samsung Electronics Co., Ltd. Composition for removing silicone resins and method of thinning substrate by using the same
CN107034028B (en) * 2015-12-04 2021-05-25 三星电子株式会社 Composition for removing silicone resin, method for thinning a substrate using the same, and manufacturing a semiconductor package, and system using the same
CN106890816A (en) * 2015-12-21 2017-06-27 东莞新科技术研究开发有限公司 Vacuum pump cleaning method
CN106289913A (en) * 2016-09-24 2017-01-04 中海油常州涂料化工研究院有限公司 A kind of liquid parting for inorganic zinc-rich coating surface corrosion product and preparation method thereof and using method
CN106833962A (en) * 2016-12-26 2017-06-13 上海申和热磁电子有限公司 Cleaning agent and its preparation and application for removing conductor etching cavity ceramic coating part pollutant
CN106959590A (en) * 2017-04-11 2017-07-18 安徽高芯众科半导体有限公司 A kind of gold-tinted processing procedure litho machine parts bear photoresistance renovation process
JP7384332B2 (en) * 2018-01-05 2023-11-21 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド Surface treatment composition and surface treatment method
CN113667552A (en) * 2020-05-15 2021-11-19 安集微电子科技（上海）股份有限公司 Cleaning solution for copper damascene process

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5279771A (en) 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5571447A (en) * 1995-03-20 1996-11-05 Ashland Inc. Stripping and cleaning composition
JPH1055993A (en) * 1996-08-09 1998-02-24 Hitachi Ltd Cleaning solution for manufacturing semiconductor device and method for manufacturing semiconductor device using the same
US5698503A (en) * 1996-11-08 1997-12-16 Ashland Inc. Stripping and cleaning composition
US6828289B2 (en) * 1999-01-27 2004-12-07 Air Products And Chemicals, Inc. Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature
US6248704B1 (en) * 1999-05-03 2001-06-19 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductors devices
US6235693B1 (en) * 1999-07-16 2001-05-22 Ekc Technology, Inc. Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices
ID29396A (en) * 1999-08-19 2001-08-30 Ashland Inc STRENGTHENING OF CLEANING AND CLEANING
US6194366B1 (en) * 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition

Also Published As

Publication number Publication date
EP1341883A4 (en) 2004-06-02
EP1341883A1 (en) 2003-09-10
US20020107158A1 (en) 2002-08-08
US6656894B2 (en) 2003-12-02
CN1479780A (en) 2004-03-03
CN1266262C (en) 2006-07-26
KR20030070055A (en) 2003-08-27
WO2002046344A1 (en) 2002-06-13

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