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AU2002214277A1 - Method for coating electronic parts - Google Patents

Method for coating electronic parts

Info

Publication number
AU2002214277A1
AU2002214277A1 AU2002214277A AU1427702A AU2002214277A1 AU 2002214277 A1 AU2002214277 A1 AU 2002214277A1 AU 2002214277 A AU2002214277 A AU 2002214277A AU 1427702 A AU1427702 A AU 1427702A AU 2002214277 A1 AU2002214277 A1 AU 2002214277A1
Authority
AU
Australia
Prior art keywords
electronic parts
coating electronic
coating
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002214277A
Inventor
Minoru Isshiki
Tomoko Kato
Katsutoshi Mine
Junji Nakanishi
Kimio Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of AU2002214277A1 publication Critical patent/AU2002214277A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H10W72/072—
    • H10W72/241—
    • H10W74/15—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
AU2002214277A 2000-11-27 2001-11-12 Method for coating electronic parts Abandoned AU2002214277A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000359160A JP2002164480A (en) 2000-11-27 2000-11-27 Electronic component coating method
JP2000-359160 2000-11-27
PCT/JP2001/009870 WO2002043136A1 (en) 2000-11-27 2001-11-12 Method for coating electronic parts

Publications (1)

Publication Number Publication Date
AU2002214277A1 true AU2002214277A1 (en) 2002-06-03

Family

ID=18830960

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002214277A Abandoned AU2002214277A1 (en) 2000-11-27 2001-11-12 Method for coating electronic parts

Country Status (4)

Country Link
JP (1) JP2002164480A (en)
AU (1) AU2002214277A1 (en)
TW (1) TW521357B (en)
WO (1) WO2002043136A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103242801B (en) * 2013-05-14 2015-03-11 汕头市骏码凯撒有限公司 Single-component high-refractivity LED (light-emitting diode) packaging adhesive and preparation method thereof
US11830833B2 (en) * 2020-07-24 2023-11-28 Innolux Corporation Electronic substrate and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334469B (en) * 1995-08-04 1998-06-21 Doconitele Silicon Kk Curable organosiloxane compositions and semiconductor devices
JP3420473B2 (en) * 1997-04-30 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 Silicone adhesive sheet, method for producing the same, and semiconductor device
JP3420510B2 (en) * 1998-09-04 2003-06-23 東レ・ダウコーニング・シリコーン株式会社 Silicone adhesive sheet, method for producing the same, and semiconductor device
JP2000119627A (en) * 1998-10-12 2000-04-25 Dow Corning Toray Silicone Co Ltd Process for preserving adhesive cured silicone sheet

Also Published As

Publication number Publication date
WO2002043136A1 (en) 2002-05-30
JP2002164480A (en) 2002-06-07
TW521357B (en) 2003-02-21

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