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AU2002211648A1 - Anti-tombstoning solder alloys for surface mount applications - Google Patents

Anti-tombstoning solder alloys for surface mount applications

Info

Publication number
AU2002211648A1
AU2002211648A1 AU2002211648A AU1164802A AU2002211648A1 AU 2002211648 A1 AU2002211648 A1 AU 2002211648A1 AU 2002211648 A AU2002211648 A AU 2002211648A AU 1164802 A AU1164802 A AU 1164802A AU 2002211648 A1 AU2002211648 A1 AU 2002211648A1
Authority
AU
Australia
Prior art keywords
surface mount
solder alloys
mount applications
tombstoning
tombstoning solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211648A
Inventor
Benlih Huang
Ning C. Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Indium Corp of America Inc
Original Assignee
Indium Corp of America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp of America Inc filed Critical Indium Corp of America Inc
Publication of AU2002211648A1 publication Critical patent/AU2002211648A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H05K3/346—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU2002211648A 2000-10-18 2001-10-12 Anti-tombstoning solder alloys for surface mount applications Abandoned AU2002211648A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US24149800P 2000-10-18 2000-10-18
US60241498 2000-10-18
US09/957,196 US6783057B2 (en) 2000-10-18 2001-09-20 Anti-tombstoning solder alloys for surface mount applications
US09957196 2001-09-20
PCT/US2001/031820 WO2002032615A1 (en) 2000-10-18 2001-10-12 Anti-tombstoning solder alloys for surface mount applications

Publications (1)

Publication Number Publication Date
AU2002211648A1 true AU2002211648A1 (en) 2002-04-29

Family

ID=26934334

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211648A Abandoned AU2002211648A1 (en) 2000-10-18 2001-10-12 Anti-tombstoning solder alloys for surface mount applications

Country Status (3)

Country Link
US (1) US6783057B2 (en)
AU (1) AU2002211648A1 (en)
WO (1) WO2002032615A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2201545B (en) * 1987-01-30 1991-09-11 Tanaka Electronics Ind Method for connecting semiconductor material
EP0652072A1 (en) * 1993-11-09 1995-05-10 Matsushita Electric Industrial Co., Ltd. Solder
JP3177197B2 (en) 1996-10-18 2001-06-18 昭和電工株式会社 Solder paste
JPH10146690A (en) 1996-11-14 1998-06-02 Senju Metal Ind Co Ltd Solder paste for soldering chip part
JPH11207493A (en) 1998-01-23 1999-08-03 Sumitomo Metal Mining Co Ltd Solder ball and manufacturing method thereof.
US6054653A (en) * 1998-01-28 2000-04-25 Hansen; Gregory Robert Apparatus for attaching a surface mount component
JPH11340005A (en) * 1998-05-28 1999-12-10 Murata Mfg Co Ltd Chip type electronic components

Also Published As

Publication number Publication date
US6783057B2 (en) 2004-08-31
US20020063147A1 (en) 2002-05-30
WO2002032615A1 (en) 2002-04-25

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