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AU2002211237A1 - Transparent substrate and hinged optical assembly - Google Patents

Transparent substrate and hinged optical assembly

Info

Publication number
AU2002211237A1
AU2002211237A1 AU2002211237A AU1123702A AU2002211237A1 AU 2002211237 A1 AU2002211237 A1 AU 2002211237A1 AU 2002211237 A AU2002211237 A AU 2002211237A AU 1123702 A AU1123702 A AU 1123702A AU 2002211237 A1 AU2002211237 A1 AU 2002211237A1
Authority
AU
Australia
Prior art keywords
transparent substrate
optical assembly
hinged optical
hinged
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002211237A
Inventor
David Barneson
John Greene
Bryan Gregory
Daniel C. Mansur
Gary O'connor
Randy Wickman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corona Optical Systems Inc
Original Assignee
Corona Optical Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corona Optical Systems Inc filed Critical Corona Optical Systems Inc
Publication of AU2002211237A1 publication Critical patent/AU2002211237A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259—Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
AU2002211237A 2000-10-05 2001-09-17 Transparent substrate and hinged optical assembly Abandoned AU2002211237A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23905800P 2000-10-05 2000-10-05
US60239058 2000-10-05
US09951646 2001-09-13
US09/951,646 US6450704B1 (en) 2000-10-05 2001-09-13 Transparent substrate and hinged optical assembly
PCT/US2001/029018 WO2002029465A1 (en) 2000-10-05 2001-09-17 Transparent substrate and hinged optical assembly

Publications (1)

Publication Number Publication Date
AU2002211237A1 true AU2002211237A1 (en) 2002-04-15

Family

ID=26932231

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002211237A Abandoned AU2002211237A1 (en) 2000-10-05 2001-09-17 Transparent substrate and hinged optical assembly

Country Status (6)

Country Link
US (3) US6450704B1 (en)
EP (1) EP1334393A1 (en)
JP (1) JP2004518156A (en)
AU (1) AU2002211237A1 (en)
CA (1) CA2424945A1 (en)
WO (1) WO2002029465A1 (en)

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US6526205B1 (en) * 2000-10-13 2003-02-25 Agilent Technologies, Inc. Method and apparatus for the passive alignment of optical components
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US6768826B2 (en) * 2001-07-30 2004-07-27 Infineon Technologies Ag Delivering data optically to an integrated circuit
US7023705B2 (en) * 2001-08-03 2006-04-04 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US7269027B2 (en) * 2001-08-03 2007-09-11 National Semiconductor Corporation Ceramic optical sub-assembly for optoelectronic modules
US6973225B2 (en) * 2001-09-24 2005-12-06 National Semiconductor Corporation Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic package
US7128474B2 (en) * 2001-11-13 2006-10-31 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical device, enclosure and method of fabricating
US20040021214A1 (en) * 2002-04-16 2004-02-05 Avner Badehi Electro-optic integrated circuits with connectors and methods for the production thereof
JP2005523466A (en) * 2002-04-16 2005-08-04 エクスルーム フォトニクス リミテッド Electro-optic circuit having integrated connector and method of manufacturing the same
US6757308B1 (en) * 2002-05-22 2004-06-29 Optical Communication Products, Inc. Hermetically sealed transmitter optical subassembly
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US6860028B2 (en) * 2003-04-30 2005-03-01 Sun Microsystems, Inc. Alignment device and method of connecting a circuit card to a mid plane
US6963119B2 (en) * 2003-05-30 2005-11-08 International Business Machines Corporation Integrated optical transducer assembly
US7156562B2 (en) * 2003-07-15 2007-01-02 National Semiconductor Corporation Opto-electronic module form factor having adjustable optical plane height
US6985668B2 (en) * 2003-07-15 2006-01-10 National Semiconductor Corporation Multi-purpose optical light pipe
US20050061539A1 (en) * 2003-09-19 2005-03-24 Mirov Russell Norman Mechanism for disabling an electronic assembly
EP1676160A4 (en) * 2003-10-15 2008-04-09 Xloom Photonics Ltd ELECTRO-OPTICAL CIRCUITRY HAVING AN INTEGRATED CONNECTOR AND METHODS OF PRODUCING THE SAME
US7084496B2 (en) * 2004-01-14 2006-08-01 International Business Machines Corporation Method and apparatus for providing optoelectronic communication with an electronic device
US20060002666A1 (en) * 2004-06-30 2006-01-05 Ice Donald A Shaped lead assembly for optoelectronic devices
US7068892B1 (en) * 2005-03-29 2006-06-27 Intel Corporation Passively aligned optical-electrical interface
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JP2007271998A (en) 2006-03-31 2007-10-18 Nec Corp Optical connector and optical module
JP4821419B2 (en) * 2006-04-25 2011-11-24 日本電気株式会社 Photoelectric composite module and optical input / output device
CA2685971C (en) * 2006-05-05 2017-02-07 Reflex Photonics Inc. Optically-enabled integrated circuit package
US9250399B2 (en) * 2006-08-31 2016-02-02 Optogig, Inc. High density active modular optoelectronic device for use with push-release mechanism and method for using same
JP2008263122A (en) * 2007-04-13 2008-10-30 Oki Electric Ind Co Ltd Optical module apparatus
US20090093137A1 (en) * 2007-10-08 2009-04-09 Xloom Communications, (Israel) Ltd. Optical communications module
US7539366B1 (en) 2008-01-04 2009-05-26 International Business Machines Corporation Optical transceiver module
US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
WO2010054180A1 (en) * 2008-11-07 2010-05-14 Beckman Coulter, Inc. High sensitivity parameters for the detection of vitamin b12 and/or folate deficiencies and methods of use
WO2010149445A1 (en) * 2009-06-24 2010-12-29 International Business Machines Corporation Optical module and installation method
CN102162885A (en) * 2011-05-03 2011-08-24 苏州旭创科技有限公司 Parallel optical transceiving component for high-speed transmission
CN102169216A (en) * 2011-05-18 2011-08-31 苏州旭创科技有限公司 Parallel light transceiver component for broadband high-speed transmission
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US10348146B2 (en) * 2012-07-13 2019-07-09 Lcdrives Corp. Liquid cooled high efficiency permanent magnet machine with glycol cooling
CN102841413A (en) * 2012-08-27 2012-12-26 苏州旭创科技有限公司 Parallel optical transceiving component used for broadband high speed transmission
CN104181653B (en) 2013-05-23 2016-03-23 富士康(昆山)电脑接插件有限公司 Cable Connector Assembly
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Also Published As

Publication number Publication date
WO2002029465A1 (en) 2002-04-11
US20040208461A1 (en) 2004-10-21
US6729776B2 (en) 2004-05-04
CA2424945A1 (en) 2002-04-11
US6843608B2 (en) 2005-01-18
US20020197024A1 (en) 2002-12-26
US6450704B1 (en) 2002-09-17
US20020041740A1 (en) 2002-04-11
EP1334393A1 (en) 2003-08-13
JP2004518156A (en) 2004-06-17

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