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AU2002259063A1 - Method and apparatus for temperature control of a device during testing - Google Patents

Method and apparatus for temperature control of a device during testing

Info

Publication number
AU2002259063A1
AU2002259063A1 AU2002259063A AU2002259063A AU2002259063A1 AU 2002259063 A1 AU2002259063 A1 AU 2002259063A1 AU 2002259063 A AU2002259063 A AU 2002259063A AU 2002259063 A AU2002259063 A AU 2002259063A AU 2002259063 A1 AU2002259063 A1 AU 2002259063A1
Authority
AU
Australia
Prior art keywords
temperature control
device during
during testing
testing
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002259063A
Inventor
Maxat Touzelbaev
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002259063A1 publication Critical patent/AU2002259063A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AU2002259063A 2001-09-27 2002-04-29 Method and apparatus for temperature control of a device during testing Abandoned AU2002259063A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96517901A 2001-09-27 2001-09-27
US09/965,179 2001-09-27
PCT/US2002/013441 WO2003027686A2 (en) 2001-09-27 2002-04-29 Method and apparatus for temperature control of a device during testing

Publications (1)

Publication Number Publication Date
AU2002259063A1 true AU2002259063A1 (en) 2003-04-07

Family

ID=25509581

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002259063A Abandoned AU2002259063A1 (en) 2001-09-27 2002-04-29 Method and apparatus for temperature control of a device during testing

Country Status (3)

Country Link
AU (1) AU2002259063A1 (en)
TW (1) TW564337B (en)
WO (1) WO2003027686A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794620B1 (en) * 2001-11-07 2004-09-21 Advanced Micro Devices, Inc. Feedforward temperature control of device under test
DE102005001163B3 (en) 2005-01-10 2006-05-18 Erich Reitinger Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
TWI564578B (en) * 2014-12-05 2017-01-01 上海兆芯集成電路有限公司 Test head module and reconditioning method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2180959B (en) * 1985-09-23 1989-09-13 Sharetree Ltd Apparatus for the burn-in of integrated circuits
US6476627B1 (en) * 1996-10-21 2002-11-05 Delta Design, Inc. Method and apparatus for temperature control of a device during testing
US5911897A (en) * 1997-01-13 1999-06-15 Micro Control Company Temperature control for high power burn-in for integrated circuits
JP5000803B2 (en) * 1998-07-14 2012-08-15 デルタ・デザイン・インコーポレイテッド Apparatus and method for performing rapid response temperature repetitive control of electronic device over a wide range using liquid
US6448992B1 (en) * 2001-11-07 2002-09-10 Advanced Micro Devices, Inc. Voltage programmable power dissipater

Also Published As

Publication number Publication date
TW564337B (en) 2003-12-01
WO2003027686A2 (en) 2003-04-03
WO2003027686A3 (en) 2003-12-04

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase