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AU2002240098A1 - Method of controlling the thickness of layers of photoresist - Google Patents

Method of controlling the thickness of layers of photoresist

Info

Publication number
AU2002240098A1
AU2002240098A1 AU2002240098A AU2002240098A AU2002240098A1 AU 2002240098 A1 AU2002240098 A1 AU 2002240098A1 AU 2002240098 A AU2002240098 A AU 2002240098A AU 2002240098 A AU2002240098 A AU 2002240098A AU 2002240098 A1 AU2002240098 A1 AU 2002240098A1
Authority
AU
Australia
Prior art keywords
photoresist
layers
thickness
controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002240098A
Inventor
Scott G. Bushman
Curtis W. Doss
Anthony J. Toprac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2002240098A1 publication Critical patent/AU2002240098A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
AU2002240098A 2001-02-23 2002-01-25 Method of controlling the thickness of layers of photoresist Abandoned AU2002240098A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US79199701A 2001-02-23 2001-02-23
US09/791,997 2001-02-23
PCT/US2002/002268 WO2002071152A2 (en) 2001-02-23 2002-01-25 Method of controlling the thickness of layers of photoresist

Publications (1)

Publication Number Publication Date
AU2002240098A1 true AU2002240098A1 (en) 2002-09-19

Family

ID=25155481

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002240098A Abandoned AU2002240098A1 (en) 2001-02-23 2002-01-25 Method of controlling the thickness of layers of photoresist

Country Status (2)

Country Link
AU (1) AU2002240098A1 (en)
WO (1) WO2002071152A2 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3516195B2 (en) * 1996-05-28 2004-04-05 東京エレクトロン株式会社 Method and apparatus for forming coating film
TW383414B (en) * 1997-03-05 2000-03-01 Tokyo Electron Ltd Photoresist agent processing method and photoresist agent processing system and evaluation method and processing apparatus for photoresist agent film
US6221787B1 (en) * 1998-04-20 2001-04-24 Tokyo Electron Limited Apparatus and method of forming resist film
JP3641162B2 (en) * 1998-04-20 2005-04-20 東京エレクトロン株式会社 Coating film forming apparatus and method, and pattern forming method
JPH11340134A (en) * 1998-05-22 1999-12-10 Dainippon Screen Mfg Co Ltd Substrate processing equipment

Also Published As

Publication number Publication date
WO2002071152A3 (en) 2002-12-27
WO2002071152A2 (en) 2002-09-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase