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AU2001236098A1 - Solder resist ink - Google Patents

Solder resist ink

Info

Publication number
AU2001236098A1
AU2001236098A1 AU2001236098A AU3609801A AU2001236098A1 AU 2001236098 A1 AU2001236098 A1 AU 2001236098A1 AU 2001236098 A AU2001236098 A AU 2001236098A AU 3609801 A AU3609801 A AU 3609801A AU 2001236098 A1 AU2001236098 A1 AU 2001236098A1
Authority
AU
Australia
Prior art keywords
solder resist
resist ink
ink
solder
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001236098A
Inventor
Teruo Furukawa
Soichi Hashimoto
Toshikazu Oda
Noriaki Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goo Chemical Industries Co Ltd
Original Assignee
Goo Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Industries Co Ltd filed Critical Goo Chemical Industries Co Ltd
Publication of AU2001236098A1 publication Critical patent/AU2001236098A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0269Marks, test patterns or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/161Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Architecture (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Materials For Photolithography (AREA)
AU2001236098A 2000-03-06 2001-03-06 Solder resist ink Abandoned AU2001236098A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2000060988 2000-03-06
JP2000-60988 2000-03-06
JP2000061036 2000-03-06
JP2000-61036 2000-03-06
JP2000069376 2000-03-13
JP2000069260 2000-03-13
JP2000-69260 2000-03-13
JP2000-69376 2000-03-13
PCT/JP2001/001715 WO2001067178A1 (en) 2000-03-06 2001-03-06 Solder resist ink

Publications (1)

Publication Number Publication Date
AU2001236098A1 true AU2001236098A1 (en) 2001-09-17

Family

ID=27481099

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001236098A Abandoned AU2001236098A1 (en) 2000-03-06 2001-03-06 Solder resist ink

Country Status (3)

Country Link
AU (1) AU2001236098A1 (en)
TW (1) TW517503B (en)
WO (1) WO2001067178A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007003807A (en) * 2005-06-23 2007-01-11 Sumitomo Bakelite Co Ltd Photosensitive resin composition and solder resist using the composition
WO2015033880A1 (en) * 2013-09-04 2015-03-12 富士フイルム株式会社 Resin composition, method for producing cured film, cured film, liquid crystal display device and organic el display device
CN107710074B (en) * 2015-06-24 2019-07-16 互应化学工业株式会社 Solder resist composition, film, covered printed wiring board, method for producing film, and method for producing covered printed wiring board
CN115197632A (en) * 2021-09-16 2022-10-18 广东硕成科技股份有限公司 Film layer for high-copper-thickness circuit board and application thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4038838B2 (en) * 1997-08-12 2008-01-30 東レ株式会社 Color paste for color filter, method for producing the same, and color filter
JP3219052B2 (en) * 1997-10-31 2001-10-15 東レ株式会社 Color paste for color filter, method for producing the same, and color filter
JP3721770B2 (en) * 1998-03-10 2005-11-30 住友化学株式会社 Colored photosensitive resin composition
JP4523679B2 (en) * 1998-06-22 2010-08-11 太陽インキ製造株式会社 Green resist ink composition for printed wiring board using halogen-free color pigment
JP4502427B2 (en) * 1998-12-09 2010-07-14 互応化学工業株式会社 Photo solder resist ink

Also Published As

Publication number Publication date
WO2001067178A1 (en) 2001-09-13
TW517503B (en) 2003-01-11

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