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AU2001227246A1 - Liquid crystal polymers for flexible circuits - Google Patents

Liquid crystal polymers for flexible circuits

Info

Publication number
AU2001227246A1
AU2001227246A1 AU2001227246A AU2724601A AU2001227246A1 AU 2001227246 A1 AU2001227246 A1 AU 2001227246A1 AU 2001227246 A AU2001227246 A AU 2001227246A AU 2724601 A AU2724601 A AU 2724601A AU 2001227246 A1 AU2001227246 A1 AU 2001227246A1
Authority
AU
Australia
Prior art keywords
liquid crystal
crystal polymers
flexible circuits
solution
crystal polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001227246A
Inventor
Guoping Mao
Rui Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001227246A1 publication Critical patent/AU2001227246A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249958—Void-containing component is synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249975—Void shape specified [e.g., crushed, flat, round, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y10T428/249979—Specified thickness of void-containing component [absolute or relative] or numerical cell dimension

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Liquid Crystal Substances (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)

Abstract

A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids formed therein using an etchant composition comprising a solution in water of from about 35 wt. % to about 55 wt. % of an alkali metal salt; and from about 10 wt. % to about 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from about 50° C. to about 120° C.
AU2001227246A 2000-07-18 2000-11-16 Liquid crystal polymers for flexible circuits Abandoned AU2001227246A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/618,753 US6403211B1 (en) 2000-07-18 2000-07-18 Liquid crystal polymer for flexible circuits
US09618753 2000-07-18
PCT/US2000/031586 WO2002006423A1 (en) 2000-07-18 2000-11-16 Liquid crystal polymers for flexible circuits

Publications (1)

Publication Number Publication Date
AU2001227246A1 true AU2001227246A1 (en) 2002-01-30

Family

ID=24478996

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001227246A Abandoned AU2001227246A1 (en) 2000-07-18 2000-11-16 Liquid crystal polymers for flexible circuits

Country Status (10)

Country Link
US (1) US6403211B1 (en)
EP (1) EP1303575B1 (en)
JP (1) JP2004504439A (en)
KR (1) KR100780973B1 (en)
CN (1) CN1218015C (en)
AT (1) ATE296336T1 (en)
AU (1) AU2001227246A1 (en)
DE (1) DE60020405T2 (en)
TW (1) TW593633B (en)
WO (1) WO2002006423A1 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040247921A1 (en) * 2000-07-18 2004-12-09 Dodsworth Robert S. Etched dielectric film in hard disk drives
US6923919B2 (en) * 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
US7348045B2 (en) * 2002-09-05 2008-03-25 3M Innovative Properties Company Controlled depth etched dielectric film
US6538211B2 (en) 2000-08-15 2003-03-25 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
AU2001292823A1 (en) 2000-09-20 2002-04-02 World Properties Inc. Electrostatic deposition of high temperature, high performance thermoplastics
AU2002227246A1 (en) 2000-12-14 2002-06-24 World Properties Inc. Liquid crystalline polymer bond plies and circuits formed therefrom
US20030207910A1 (en) 2001-02-02 2003-11-06 Tao Wang Composition and antiviral activity of substituted azaindoleoxoacetic piperazine derivatives
JP3592285B2 (en) * 2001-06-28 2004-11-24 住友電気工業株式会社 Method for etching laminate including polyimide layer
US20050208278A1 (en) * 2001-08-22 2005-09-22 Landi Vincent R Method for improving bonding of circuit substrates to metal and articles formed thereby
US6952046B2 (en) * 2002-06-19 2005-10-04 Foster-Miller, Inc. Electronic and optoelectronic component packaging technique
US20060234042A1 (en) * 2002-09-05 2006-10-19 Rui Yang Etched dielectric film in microfluidic devices
US20040258885A1 (en) * 2002-09-05 2004-12-23 Kreutter Nathan P. Etched dielectric film in microfluidic devices
US7142083B2 (en) 2002-09-17 2006-11-28 Lindsey Raymond A Electronics component and method for fabricating same
US6819180B2 (en) * 2002-11-14 2004-11-16 Motorola, Inc. Radio frequency power amplifier adaptive bias control circuit
ATE346852T1 (en) * 2003-08-21 2006-12-15 3M Innovative Properties Co PERFLUORPOLYETHERAMID BONDED PHOSPHONATES, PHOSPHATES AND DERIVATIVES THEREOF
US20090008133A1 (en) * 2003-12-30 2009-01-08 Bullard Jeffrey W Patterned Circuits and Method for Making Same
US7012017B2 (en) * 2004-01-29 2006-03-14 3M Innovative Properties Company Partially etched dielectric film with conductive features
US20050186404A1 (en) * 2004-02-23 2005-08-25 Guoping Mao Etched polycarbonate films
US7425276B2 (en) * 2004-06-30 2008-09-16 University Of South Florida Method for etching microchannel networks within liquid crystal polymer substrates
US20070120089A1 (en) * 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
WO2008005736A1 (en) * 2006-06-30 2008-01-10 3M Innovative Properties Company Flexible circuit
US8217272B2 (en) * 2009-12-18 2012-07-10 Intel Corporation Apparatus and method for embedding components in small-form-factor, system-on-packages
BR112013001706A2 (en) 2010-07-23 2016-05-31 Syscom Advanced Materials Inc continuous process for preparation and use of electrically conductive metal coated fibers
CN103189470B (en) * 2010-11-03 2015-05-20 3M创新有限公司 Polymeric etchant and method of use thereof
WO2012092505A1 (en) 2010-12-29 2012-07-05 Syscom Advanced Materials Metal and metallized fiber hybrid wire
US10568233B2 (en) 2012-06-28 2020-02-18 3M Innovative Properties Company Thermally conductive substrate article
US9145469B2 (en) 2012-09-27 2015-09-29 Ticona Llc Aromatic polyester containing a biphenyl chain disruptor
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
CN110461920A (en) * 2017-04-06 2019-11-15 三菱制纸株式会社 Etching solution and etching method for resin composition
WO2020085447A1 (en) * 2018-10-24 2020-04-30 三菱製紙株式会社 Etchant and etching method for resin composition
WO2020203563A1 (en) 2019-04-03 2020-10-08 三菱製紙株式会社 Etching liquid for liquid crystal polymer and method for etching liquid crystal polymer
CN111654803A (en) * 2020-04-22 2020-09-11 深圳市信维通信股份有限公司 Preparation method of liquid crystal film, liquid crystal film and earphone diaphragm
CN113038696B (en) * 2021-03-02 2022-06-14 广德新三联电子有限公司 High-bending-resistance circuit board for automobile and preparation method thereof
CN113811084B (en) * 2021-08-27 2024-01-26 安捷利电子科技（苏州）有限公司 Micropore production method suitable for liquid crystal polymer substrates
CN113811085B (en) * 2021-08-27 2026-01-16 青岛科技大学 Electrolyte solution based on etching constraint system and micropore manufacturing method of liquid crystal polymer substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054980B2 (en) * 1980-10-08 1985-12-03 日立化成工業株式会社 Etching liquid for forming through holes in polyimide resin
US5066545A (en) 1987-02-24 1991-11-19 Polyonics Corporation Process for forming polyimide-metal laminates
US4975312A (en) 1988-06-20 1990-12-04 Foster-Miller, Inc. Multiaxially oriented thermotropic polymer substrate for printed wire board
US4995941A (en) * 1989-05-15 1991-02-26 Rogers Corporation Method of manufacture interconnect device
JP3245437B2 (en) 1991-04-05 2002-01-15 株式会社クラレ Manufacturing method of laminate
JPH0677648A (en) 1992-08-20 1994-03-18 Polyplastics Co Composite molded item having three-dimensional multilayer conductive circuit and production thereof
US5614114A (en) 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
JP2939477B2 (en) 1994-08-16 1999-08-25 エイチエヌエイ・ホールディングス・インコーポレーテッド Liquid crystal polymer-metal laminate and method for producing the laminate
US5891528A (en) * 1995-09-15 1999-04-06 M/Wave Printed circuit board process using plasma spraying of conductive metal
US6218022B1 (en) 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3999834B2 (en) 1996-12-12 2007-10-31 三共化成株式会社 Manufacturing of plated parts such as molded circuit parts

Also Published As

Publication number Publication date
CN1479773A (en) 2004-03-03
TW593633B (en) 2004-06-21
EP1303575B1 (en) 2005-05-25
ATE296336T1 (en) 2005-06-15
US6403211B1 (en) 2002-06-11
EP1303575A1 (en) 2003-04-23
CN1218015C (en) 2005-09-07
DE60020405D1 (en) 2005-06-30
JP2004504439A (en) 2004-02-12
KR100780973B1 (en) 2007-11-29
WO2002006423A1 (en) 2002-01-24
DE60020405T2 (en) 2006-01-26
KR20030041961A (en) 2003-05-27

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