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AU2001214037A1 - Lead-free solders - Google Patents

Lead-free solders

Info

Publication number
AU2001214037A1
AU2001214037A1 AU2001214037A AU1403701A AU2001214037A1 AU 2001214037 A1 AU2001214037 A1 AU 2001214037A1 AU 2001214037 A AU2001214037 A AU 2001214037A AU 1403701 A AU1403701 A AU 1403701A AU 2001214037 A1 AU2001214037 A1 AU 2001214037A1
Authority
AU
Australia
Prior art keywords
lead
free solders
bismuth
antimony
indium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001214037A
Inventor
Zhenfeng Guo
Jennie S. Hwang
Alan Leonard Meddle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Singapore Asahi Chemical and Solder Industries Pte Ltd
H Technologies Group Inc
Original Assignee
Singapore Asahi Chemical and Solder Industries Pte Ltd
H Technologies Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical and Solder Industries Pte Ltd, H Technologies Group Inc filed Critical Singapore Asahi Chemical and Solder Industries Pte Ltd
Publication of AU2001214037A1 publication Critical patent/AU2001214037A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Conductive Materials (AREA)
  • Materials For Medical Uses (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Products (AREA)

Abstract

Disclosed is a high strength, high fatigue resistance, and high wetting lead-free solder alloy comprising effective amounts of tin, copper silver, bismuth, indium, and antimony and having a melting temperature between 175-215 DEG C.
AU2001214037A 2000-11-16 2000-11-16 Lead-free solders Abandoned AU2001214037A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (1)

Publication Number Publication Date
AU2001214037A1 true AU2001214037A1 (en) 2002-05-27

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001214037A Abandoned AU2001214037A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Country Status (14)

Country Link
EP (1) EP1333957B1 (en)
AT (1) ATE293513T1 (en)
AU (1) AU2001214037A1 (en)
CY (1) CY1105145T1 (en)
CZ (1) CZ297089B6 (en)
DE (1) DE60019651T2 (en)
DK (1) DK1333957T3 (en)
ES (1) ES2241671T3 (en)
HU (1) HU228577B1 (en)
NO (1) NO333677B1 (en)
PL (1) PL195528B1 (en)
PT (1) PT1333957E (en)
RU (1) RU2254971C2 (en)
WO (1) WO2002040213A1 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US20050199323A1 (en) 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
EP1465468B1 (en) * 2003-03-31 2007-11-14 SANYO ELECTRIC Co., Ltd. Metal mask and method of printing lead-free solder paste using same
EP1672685B1 (en) * 2003-08-26 2010-11-03 Tokuyama Corporation Substrate for device bonding, device bonded substrate, and method for producing same
FR2867469A1 (en) 2004-03-15 2005-09-16 Alliant Techsystems Inc Reactive composition, useful in military and industrial explosives, comprises a metallic material defining a continuous phase and having an energetic material, which comprises oxidant and/or explosive of class 1.1
CZ300575B6 (en) * 2005-01-04 2009-06-17 Jeník@Jan Lead-free solder
TWI465312B (en) * 2005-07-19 2014-12-21 日本斯倍利亞股份有限公司 Method for adjusting Cu concentration and Ni concentration in additional lead-free solder and solder bath
EP1780494A3 (en) 2005-10-04 2008-02-27 Alliant Techsystems Inc. Reactive material enhanced projectiles and related methods
CN100453244C (en) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 Lead-free tin solder
CN101357421B (en) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 Lead-free tin solder
RU2335385C1 (en) * 2006-12-25 2008-10-10 Государственное образовательное учреждение высшего профессионального образования "Государственный университет цветных металлов и золота" Solder on silver base
JP4962570B2 (en) * 2007-07-18 2012-06-27 千住金属工業株式会社 In-containing lead-free solder for automotive electronic circuits
RU2367551C2 (en) * 2007-10-29 2009-09-20 Государственное образовательное учреждение высшего профессионального образования "Воронежский государственный технический университет" Lead-free solder
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
CN103962744B (en) 2009-04-20 2016-05-18 松下知识产权经营株式会社 Soldering tin material and electronic unit conjugant
JP2014527466A (en) * 2011-08-02 2014-10-16 アルファ・メタルズ・インコーポレイテッドＡｌｐｈａ Ｍｅｔａｌｓ，Ｉｎｃ． Solder composition
JP2013252548A (en) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd Solder paste for joining micro component
CN103042315B (en) * 2013-01-22 2015-05-27 马莒生 Heat-resistant and moisture-resistant low-melting-point lead-free solder alloy
JP2015077601A (en) * 2013-04-02 2015-04-23 千住金属工業株式会社 Lead-free solder alloy
EP3138658B1 (en) * 2014-04-30 2020-11-04 Nihon Superior Co., Ltd. Lead-free solder alloy
US9956649B2 (en) * 2014-06-24 2018-05-01 Harima Chemicals, Incorporated Solder alloy, solder paste, and electronic circuit board
JP6730999B2 (en) * 2015-05-05 2020-07-29 インディウム コーポレーション Highly reliable lead-free solder alloy for electronic applications in harsh environments
JP6135885B2 (en) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 Solder alloy and mounting structure using the same
WO2016185674A1 (en) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 Solder alloy and package structure using same
JP6745453B2 (en) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 Solder alloy and mounting structure using the same
JP6230737B1 (en) * 2017-03-10 2017-11-15 株式会社タムラ製作所 Lead-free solder alloy, solder paste and electronic circuit board
JP6397079B1 (en) * 2017-04-07 2018-09-26 株式会社ケーヒン Solder material
CN109894768B (en) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 Preparation method of low-temperature lead-free alloy solder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (en) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 Low cost phase locked motor control method and structure
JP3736819B2 (en) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 Lead-free solder alloy
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (en) * 1999-02-02 2000-10-17 Nippon Genma:Kk Lead-free solder

Also Published As

Publication number Publication date
PL361336A1 (en) 2004-10-04
HUP0301858A3 (en) 2005-05-30
CY1105145T1 (en) 2009-11-04
DK1333957T3 (en) 2005-06-20
PL195528B1 (en) 2007-09-28
PT1333957E (en) 2005-09-30
EP1333957A1 (en) 2003-08-13
EP1333957B1 (en) 2005-04-20
CZ297089B6 (en) 2006-09-13
RU2003114304A (en) 2005-01-20
HUP0301858A2 (en) 2003-08-28
NO333677B1 (en) 2013-08-05
CZ20031348A3 (en) 2004-04-14
ATE293513T1 (en) 2005-05-15
ES2241671T3 (en) 2005-11-01
NO20032185D0 (en) 2003-05-14
HU228577B1 (en) 2013-04-29
WO2002040213A1 (en) 2002-05-23
DE60019651D1 (en) 2005-05-25
RU2254971C2 (en) 2005-06-27
NO20032185L (en) 2003-05-14
DE60019651T2 (en) 2005-09-22

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