AU2001213610A1 - Method and apparatus for a reticle with purged pellicle-to-reticle gap - Google Patents
Method and apparatus for a reticle with purged pellicle-to-reticle gapInfo
- Publication number
- AU2001213610A1 AU2001213610A1 AU2001213610A AU1361001A AU2001213610A1 AU 2001213610 A1 AU2001213610 A1 AU 2001213610A1 AU 2001213610 A AU2001213610 A AU 2001213610A AU 1361001 A AU1361001 A AU 1361001A AU 2001213610 A1 AU2001213610 A1 AU 2001213610A1
- Authority
- AU
- Australia
- Prior art keywords
- reticle
- gap
- pellicle
- purged
- purged pellicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/501,180 US6507390B1 (en) | 2000-02-10 | 2000-02-10 | Method and apparatus for a reticle with purged pellicle-to-reticle gap |
| US09501180 | 2000-02-10 | ||
| PCT/US2000/030432 WO2001059522A1 (en) | 2000-02-10 | 2000-11-06 | Method and apparatus for a reticle with purged pellicle-to-reticle gap |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001213610A1 true AU2001213610A1 (en) | 2001-08-20 |
Family
ID=23992441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001213610A Abandoned AU2001213610A1 (en) | 2000-02-10 | 2000-11-06 | Method and apparatus for a reticle with purged pellicle-to-reticle gap |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6507390B1 (en) |
| AU (1) | AU2001213610A1 (en) |
| WO (1) | WO2001059522A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6847434B2 (en) * | 2000-02-10 | 2005-01-25 | Asml Holding N.V. | Method and apparatus for a pellicle frame with porous filtering inserts |
| US6710845B2 (en) * | 2000-12-29 | 2004-03-23 | Intel Corporation | Purging gas from a photolithography enclosure between a mask protective device and a patterned mask |
| US6619903B2 (en) * | 2001-08-10 | 2003-09-16 | Glenn M. Friedman | System and method for reticle protection and transport |
| JP4027085B2 (en) * | 2001-12-04 | 2007-12-26 | キヤノン株式会社 | Device manufacturing related apparatus and device manufacturing method |
| JP3958049B2 (en) * | 2002-01-15 | 2007-08-15 | キヤノン株式会社 | Reticle with pellicle, device manufacturing related apparatus, exposure apparatus and device manufacturing method |
| JP4006235B2 (en) * | 2002-02-05 | 2007-11-14 | キヤノン株式会社 | Inert gas replacement method and apparatus, reticle storage, reticle inspection apparatus, reticle transport box, and device manufacturing method |
| US7052809B2 (en) * | 2002-10-02 | 2006-05-30 | Mykrolis Corporation | Membrane and reticle-pellicle apparatus with purged pellicle-to-reticle gap using same |
| US7014961B2 (en) * | 2002-10-02 | 2006-03-21 | Yazaki Corporation | Photomask assembly incorporating a porous frame |
| US7094505B2 (en) | 2002-10-29 | 2006-08-22 | Toppan Photomasks, Inc. | Photomask assembly and method for protecting the same from contaminants generated during a lithography process |
| EP1720070A3 (en) * | 2002-12-09 | 2006-11-22 | ASML Holding N.V. | Pellicle frame with heightened bonding surfaces |
| US6822731B1 (en) * | 2003-06-18 | 2004-11-23 | Asml Holding N.V. | Method and apparatus for a pellicle frame with heightened bonding surfaces |
| US7068347B2 (en) * | 2002-12-20 | 2006-06-27 | Intel Corporation | Apparatus for reducing pellicle darkening |
| US6913654B2 (en) * | 2003-06-02 | 2005-07-05 | Mykrolis Corporation | Method for the removal of airborne molecular contaminants using water gas mixtures |
| US7551265B2 (en) * | 2004-10-01 | 2009-06-23 | Nikon Corporation | Contact material and system for ultra-clean applications |
| US7230673B2 (en) | 2004-12-07 | 2007-06-12 | Asml Netherlands B.V. | Lithographic apparatus, reticle exchange unit and device manufacturing method |
| US20060246234A1 (en) * | 2005-04-20 | 2006-11-02 | Yazaki Corporation | Photomask assembly incorporating a metal/scavenger pellicle frame |
| WO2007019105A1 (en) * | 2005-08-03 | 2007-02-15 | Entegris, Inc. | A transfer container |
| DE102005062430A1 (en) * | 2005-12-23 | 2007-07-05 | Carl Zeiss Smt Ag | Optical arrangement used in microlithography comprises photomask and adsorbing substance arranged in intermediate chamber to bind contaminating gases containing hydrocarbons by physical adsorption and/or chemical adsorption |
| JPWO2007094197A1 (en) * | 2006-02-16 | 2009-07-02 | 株式会社ニコン | Protective device, mask and exposure device |
| DE102012219545A1 (en) * | 2012-10-25 | 2014-04-30 | Carl Zeiss Smt Gmbh | Projection exposure system for EUV lithography and method of operating the projection exposure system |
| US10775694B1 (en) * | 2019-04-30 | 2020-09-15 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus for mounting a pellicle to a photomask and method for mounting a pellicle to a photomask |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4719705A (en) | 1986-06-24 | 1988-01-19 | The Perkin-Elmer Corporation | Reticle transporter |
| US4986007A (en) | 1987-03-25 | 1991-01-22 | Svg Lithography Systems, Inc. | Reticle frame assembly |
| JPH03166545A (en) * | 1989-11-27 | 1991-07-18 | Hitachi Electron Eng Co Ltd | Pellicle frame for protecting ic reticule |
| JPH04196117A (en) * | 1990-11-26 | 1992-07-15 | Seiko Epson Corp | Semiconductor manufacturing device |
| JPH04269752A (en) * | 1991-02-26 | 1992-09-25 | Fujitsu Ltd | pellicle |
| JPH05297572A (en) * | 1992-04-22 | 1993-11-12 | Mitsubishi Electric Corp | Reticle with pellicle film and method for removing foreign matter thereof |
| JP3445685B2 (en) * | 1994-08-11 | 2003-09-08 | 三井化学株式会社 | Mask protection device |
| US5727685A (en) | 1995-10-19 | 1998-03-17 | Svg Lithography Systems, Inc. | Reticle container with corner holding |
| JPH09197652A (en) * | 1996-01-19 | 1997-07-31 | Nec Corp | Pellicle and photomask with pellicle |
| US5814381A (en) * | 1997-04-04 | 1998-09-29 | Inko Industrial Corporation | Pellicle assembly having a vented frame |
| US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
-
2000
- 2000-02-10 US US09/501,180 patent/US6507390B1/en not_active Expired - Fee Related
- 2000-11-06 WO PCT/US2000/030432 patent/WO2001059522A1/en not_active Ceased
- 2000-11-06 AU AU2001213610A patent/AU2001213610A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US6507390B1 (en) | 2003-01-14 |
| WO2001059522A1 (en) | 2001-08-16 |
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