AU2001296655A1 - Process control methods for use with e-beam fabrication technology - Google Patents
Process control methods for use with e-beam fabrication technologyInfo
- Publication number
- AU2001296655A1 AU2001296655A1 AU2001296655A AU9665501A AU2001296655A1 AU 2001296655 A1 AU2001296655 A1 AU 2001296655A1 AU 2001296655 A AU2001296655 A AU 2001296655A AU 9665501 A AU9665501 A AU 9665501A AU 2001296655 A1 AU2001296655 A1 AU 2001296655A1
- Authority
- AU
- Australia
- Prior art keywords
- process control
- control methods
- fabrication technology
- beam fabrication
- technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005516 engineering process Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000004886 process control Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
- H01J37/3005—Observing the objects or the point of impact on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/171—Systems in which incident light is modified in accordance with the properties of the material investigated with calorimetric detection, e.g. with thermal lens detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8472—Investigation of composite materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0231—Composite or layered materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02881—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2445—Photon detectors for X-rays, light, e.g. photomultipliers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/248—Components associated with the control of the tube
- H01J2237/2482—Optical means
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Optics & Photonics (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09707444 | 2000-11-06 | ||
| US09/707,444 US6696692B1 (en) | 2000-11-06 | 2000-11-06 | Process control methods for use with e-beam fabrication technology |
| PCT/US2001/031282 WO2002037085A1 (en) | 2000-11-06 | 2001-10-04 | Process control methods for use with e-beam fabrication technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001296655A1 true AU2001296655A1 (en) | 2002-05-15 |
Family
ID=24841718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001296655A Abandoned AU2001296655A1 (en) | 2000-11-06 | 2001-10-04 | Process control methods for use with e-beam fabrication technology |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6696692B1 (en) |
| AU (1) | AU2001296655A1 (en) |
| WO (1) | WO2002037085A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7330583B2 (en) * | 2002-08-19 | 2008-02-12 | Photon Dynamics, Inc. | Integrated visual imaging and electronic sensing inspection systems |
| JP2005177763A (en) * | 2003-12-16 | 2005-07-07 | Disco Abrasive Syst Ltd | Laser-processed altered layer confirmation device |
| KR100741110B1 (en) * | 2006-02-15 | 2007-07-19 | 삼성에스디아이 주식회사 | Electrode Formation Method of Optical Fiber and Plasma Display Panel |
| US7516663B2 (en) * | 2006-11-03 | 2009-04-14 | General Electric Company | Systems and method for locating failure events in samples under load |
| US7605924B2 (en) * | 2006-12-06 | 2009-10-20 | Lockheed Martin Corporation | Laser-ultrasound inspection using infrared thermography |
| US7966883B2 (en) * | 2006-12-06 | 2011-06-28 | Lockheed Martin Corporation | Non-destructive inspection using laser-ultrasound and infrared thermography |
| AU2007361989B2 (en) * | 2007-12-06 | 2013-10-03 | Lockheed Martin Corporation | Non-destructive inspection using laser- ultrasound and infrared thermography |
| US8440974B2 (en) * | 2009-09-16 | 2013-05-14 | Siemens Energy, Inc. | System and method for analysis of ultrasonic power coupling during acoustic thermography |
| US20110122459A1 (en) * | 2009-11-24 | 2011-05-26 | International Business Machines Corporation | Scanning and Capturing digital Images Using Document Characteristics Detection |
| US8610924B2 (en) * | 2009-11-24 | 2013-12-17 | International Business Machines Corporation | Scanning and capturing digital images using layer detection |
| US8522614B2 (en) * | 2010-05-26 | 2013-09-03 | General Electric Company | In-line inspection methods and closed loop processes for the manufacture of prepregs and/or laminates comprising the same |
| CN114770829A (en) * | 2022-01-05 | 2022-07-22 | 南京航空航天大学 | Composite material electron beam repair and repair process detection integrated device and method |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4468136A (en) * | 1982-02-12 | 1984-08-28 | The Johns Hopkins University | Optical beam deflection thermal imaging |
| JPS59177846A (en) | 1983-03-28 | 1984-10-08 | Fujitsu Ltd | Electron beam device |
| US4752140A (en) * | 1983-12-02 | 1988-06-21 | Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee | Pulsed dilatometric method and device for the detection of delaminations |
| US4589783A (en) * | 1984-04-04 | 1986-05-20 | Wayne State University | Thermal wave imaging apparatus |
| US4636088A (en) * | 1984-05-21 | 1987-01-13 | Therma-Wave, Inc. | Method and apparatus for evaluating surface conditions of a sample |
| US4579463A (en) * | 1984-05-21 | 1986-04-01 | Therma-Wave Partners | Detecting thermal waves to evaluate thermal parameters |
| US4710030A (en) | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
| IE58049B1 (en) | 1985-05-21 | 1993-06-16 | Tekscan Ltd | Surface analysis microscopy apparatus |
| NO164133C (en) | 1985-07-15 | 1993-10-26 | Svein Otto Kanstad | PROCEDURE AND APPARATUS FOR CHARACTERIZATION AND CONTROL OF SUBSTANCES, MATERIALS AND OBJECTS |
| US4799392A (en) * | 1987-08-06 | 1989-01-24 | Motorola Inc. | Method for determining silicon (mass 28) beam purity prior to implantation of gallium arsenide |
| US5020920A (en) * | 1989-11-03 | 1991-06-04 | The United States Of America As Represented By The United States Department Of Energy | Method and apparatus for millimeter-wave detection of thermal waves for materials evaluation |
| JP3117836B2 (en) * | 1993-03-02 | 2000-12-18 | セイコーインスツルメンツ株式会社 | Focused ion beam equipment |
| US5376793A (en) * | 1993-09-15 | 1994-12-27 | Stress Photonics, Inc. | Forced-diffusion thermal imaging apparatus and method |
| US5483068A (en) * | 1994-01-07 | 1996-01-09 | Moulton; Russell D. | Use of IR (thermal) imaging for determining cell diagnostics |
| US5432119A (en) | 1994-01-31 | 1995-07-11 | Hughes Aircraft Company | High yield electron-beam gate fabrication method for sub-micron gate FETS |
| JP3221797B2 (en) * | 1994-06-14 | 2001-10-22 | 株式会社日立製作所 | Sample preparation method and apparatus |
| EP0731490A3 (en) * | 1995-03-02 | 1998-03-11 | Ebara Corporation | Ultra-fine microfabrication method using an energy beam |
| JPH09115861A (en) * | 1995-10-20 | 1997-05-02 | Hitachi Ltd | Equipment for processing samples |
| US5760904A (en) | 1996-07-26 | 1998-06-02 | General Electric Company | Method and system for inspecting a surface of an object with laser ultrasound |
| US5966626A (en) * | 1996-11-07 | 1999-10-12 | Mosel Vitelic, Inc. | Method for stabilizing a silicon structure after ion implantation |
| FR2760528B1 (en) * | 1997-03-05 | 1999-05-21 | Framatome Sa | METHOD AND DEVICE FOR PHOTOTHERMAL EXAMINATION OF A MATERIAL |
| US5900935A (en) | 1997-12-22 | 1999-05-04 | Klein; Marvin B. | Homodyne interferometer and method of sensing material |
| US6049220A (en) * | 1998-06-10 | 2000-04-11 | Boxer Cross Incorporated | Apparatus and method for evaluating a wafer of semiconductor material |
-
2000
- 2000-11-06 US US09/707,444 patent/US6696692B1/en not_active Expired - Fee Related
-
2001
- 2001-10-04 WO PCT/US2001/031282 patent/WO2002037085A1/en not_active Ceased
- 2001-10-04 AU AU2001296655A patent/AU2001296655A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002037085A1 (en) | 2002-05-10 |
| US6696692B1 (en) | 2004-02-24 |
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