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AU2001293214A1 - Heatsink retainer - Google Patents

Heatsink retainer

Info

Publication number
AU2001293214A1
AU2001293214A1 AU2001293214A AU9321401A AU2001293214A1 AU 2001293214 A1 AU2001293214 A1 AU 2001293214A1 AU 2001293214 A AU2001293214 A AU 2001293214A AU 9321401 A AU9321401 A AU 9321401A AU 2001293214 A1 AU2001293214 A1 AU 2001293214A1
Authority
AU
Australia
Prior art keywords
heatsink retainer
heatsink
retainer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001293214A
Inventor
Stephen Nicholas Siu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of AU2001293214A1 publication Critical patent/AU2001293214A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
AU2001293214A 2000-08-24 2001-08-23 Heatsink retainer Abandoned AU2001293214A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22730400P 2000-08-24 2000-08-24
US60227304 2000-08-24
US09929682 2001-08-14
US09/929,682 US6490162B2 (en) 2000-08-24 2001-08-14 Heatsink retainer
PCT/US2001/041848 WO2002021889A1 (en) 2000-08-24 2001-08-23 Heatsink retainer

Publications (1)

Publication Number Publication Date
AU2001293214A1 true AU2001293214A1 (en) 2002-03-22

Family

ID=26921349

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001293214A Abandoned AU2001293214A1 (en) 2000-08-24 2001-08-23 Heatsink retainer

Country Status (4)

Country Link
US (1) US6490162B2 (en)
AU (1) AU2001293214A1 (en)
TW (1) TW561813B (en)
WO (1) WO2002021889A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831835B2 (en) * 2002-12-24 2004-12-14 Ault, Inc. Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
US7193307B2 (en) 2004-03-25 2007-03-20 Ault Incorporated Multi-layer FET array and method of fabricating
CN101626674B (en) * 2008-07-11 2015-07-01 清华大学 Radiating structure and preparation method thereof
US8567483B2 (en) * 2009-11-06 2013-10-29 International Business Machines Corporation Heatsink with flexible base and height-adjusted cooling fins
KR101228841B1 (en) * 2011-10-04 2013-02-04 엘에스산전 주식회사 A springy clip type apparatus for fastening power semiconductor
US9674990B2 (en) * 2015-01-23 2017-06-06 Rockwell Automation Technoloies, Inc. Devices and methods for cooling bus capacitors
EP3297140A1 (en) 2016-09-19 2018-03-21 Black & Decker Inc. Control and power module for brushless motor
KR102916841B1 (en) * 2020-07-29 2026-01-22 현대자동차주식회사 Structure incorporating powermodue and gate board
TWI792659B (en) * 2021-11-04 2023-02-11 新加坡商光寶科技新加坡私人有限公司 Power module
US12256514B2 (en) * 2021-11-30 2025-03-18 Infineon Technologies Ag Power module with integrated gate driver and functional components within a single power module housing

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
DE69326318T2 (en) 1992-07-17 2000-02-03 Vlt Corp., San Antonio PACKING FOR ELECTRONIC COMPONENTS
US5329426A (en) * 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
JP3458530B2 (en) * 1995-06-02 2003-10-20 株式会社デンソー Rectifier voltage regulator for AC generator
UA32456C2 (en) * 1996-01-25 2000-12-15 Сіменс Аг РПаЎ±б
US5847929A (en) * 1996-06-28 1998-12-08 International Business Machines Corporation Attaching heat sinks directly to flip chips and ceramic chip carriers
US5994774A (en) 1997-10-30 1999-11-30 Stmicroelectronics, Inc. Surface mountable integrated circuit package with detachable module and interposer
US5909358A (en) 1997-11-26 1999-06-01 Todd Engineering Sales, Inc. Snap-lock heat sink clip
US5926370A (en) 1998-10-29 1999-07-20 Hewlett-Packard Company Method and apparatus for a modular integrated apparatus for multi-function components

Also Published As

Publication number Publication date
TW561813B (en) 2003-11-11
US6490162B2 (en) 2002-12-03
WO2002021889A1 (en) 2002-03-14
US20020080586A1 (en) 2002-06-27

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