AU2001290903A1 - Multi-layered structures and methods for manufacturing the multi-layered structures - Google Patents
Multi-layered structures and methods for manufacturing the multi-layered structuresInfo
- Publication number
- AU2001290903A1 AU2001290903A1 AU2001290903A AU9090301A AU2001290903A1 AU 2001290903 A1 AU2001290903 A1 AU 2001290903A1 AU 2001290903 A AU2001290903 A AU 2001290903A AU 9090301 A AU9090301 A AU 9090301A AU 2001290903 A1 AU2001290903 A1 AU 2001290903A1
- Authority
- AU
- Australia
- Prior art keywords
- layered structures
- manufacturing
- methods
- layered
- structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0011—Electromagnetic wave shielding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
- B29K2995/002—Coloured
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/005—Layered products coated
- B29L2009/008—Layered products coated metalized, galvanized
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
- Y10T428/265—1 mil or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23325900P | 2000-09-18 | 2000-09-18 | |
| US60233259 | 2000-09-18 | ||
| PCT/US2001/028718 WO2002024431A1 (en) | 2000-09-18 | 2001-09-10 | Multi-layered structures and methods for manufacturing the multi-layered structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001290903A1 true AU2001290903A1 (en) | 2002-04-02 |
Family
ID=22876542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001290903A Abandoned AU2001290903A1 (en) | 2000-09-18 | 2001-09-10 | Multi-layered structures and methods for manufacturing the multi-layered structures |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6768654B2 (en) |
| EP (1) | EP1324867A4 (en) |
| CN (2) | CN1474742A (en) |
| AU (1) | AU2001290903A1 (en) |
| WO (1) | WO2002024431A1 (en) |
Families Citing this family (141)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
| CN1409942A (en) * | 1999-10-12 | 2003-04-09 | 电子设备屏蔽公司 | EMI shielding apparatus |
| US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
| FR2827310B1 (en) * | 2001-07-16 | 2004-07-09 | Cit Alcatel | PROCESS FOR PARTIAL GALVANIZATION OF A PART MADE BY INJECTION MOLDING |
| GB2378582B (en) * | 2001-08-11 | 2005-03-16 | Ubinetics Ltd | A method of providing radio frequency screening for electronic components |
| CN1266991C (en) * | 2001-09-04 | 2006-07-26 | 波零公司 | EMI air filter |
| FR2837741B1 (en) * | 2002-03-29 | 2004-06-11 | Valeo Vision | METHOD FOR MANUFACTURING AN OPTICAL REFLECTOR |
| US7161092B2 (en) * | 2002-04-15 | 2007-01-09 | Visteon Global Technologies, Inc. | Apparatus and method for protecting an electronic circuit |
| US7021112B2 (en) * | 2002-09-02 | 2006-04-04 | Yamaha Corporation | Manufacturing method for metal design panel |
| US6909615B2 (en) * | 2002-09-17 | 2005-06-21 | Wavezero, Inc. | Equipment and methods for producing continuous metallized thermoformable EMI shielding material |
| EP1405707A1 (en) * | 2002-10-01 | 2004-04-07 | DSM IP Assets B.V. | Process for making a plastic moulded article with a metallized surface |
| JP3900063B2 (en) * | 2002-10-30 | 2007-04-04 | 株式会社デンソー | Mobile phone case |
| FR2847433B1 (en) * | 2002-11-25 | 2005-02-25 | Salomon Sa | METHOD FOR DECORATING A SKI SHOE |
| FR2848285B1 (en) * | 2002-12-05 | 2005-12-16 | Valeo Vision | METHOD FOR PRODUCING AN OPTICAL FUNCTION ON A COMPONENT OF A LIGHTING OR AUTOMOTIVE SIGNALING DEVICE |
| WO2004093506A2 (en) * | 2003-04-15 | 2004-10-28 | Wavezero, Inc. | Electomagnetic interference shielding for a printed circuit board |
| US20040231211A1 (en) * | 2003-05-02 | 2004-11-25 | Johnson John R. | Three-dimensional automobile badge |
| JP4377157B2 (en) * | 2003-05-20 | 2009-12-02 | Necエレクトロニクス株式会社 | Package for semiconductor devices |
| TW592021B (en) * | 2003-08-15 | 2004-06-11 | Quanta Comp Inc | Door lid of electronic device casing |
| WO2005027610A2 (en) * | 2003-09-12 | 2005-03-24 | Sony Ericsson Mobile Communications Ab | Shield for circuit board and method of manufacturing same |
| EP1515598B1 (en) | 2003-09-12 | 2008-09-10 | Sony Ericsson Mobile Communications AB | Shield for circuit board and method of manufacturing same |
| KR100671739B1 (en) * | 2003-10-31 | 2007-01-22 | 장상호 | EML vacuum deposition method and jig of mobile phone case using evaporation jig |
| CH696997A5 (en) * | 2004-03-11 | 2008-03-14 | Lange Int Sa | sports shoe with decoration. |
| JP4454388B2 (en) * | 2004-05-20 | 2010-04-21 | 日本電気株式会社 | Semiconductor module |
| JP2006087523A (en) * | 2004-09-21 | 2006-04-06 | Olympus Corp | Electronic device and in-subject introduction system |
| US20060080825A1 (en) * | 2004-10-14 | 2006-04-20 | Pille James D | Methods related to electromagnetic interference shielding |
| US20060081389A1 (en) * | 2004-10-14 | 2006-04-20 | Pille James D | Aesthetically colored EMI shields |
| US20060086519A1 (en) * | 2004-10-26 | 2006-04-27 | Fu-Chi Tsai | Casing of an electronic apparatus and manufacturing method for the same |
| KR100607002B1 (en) * | 2004-11-09 | 2006-08-02 | 하재기 | Apparatus for the selective application of electromagnetic shielding paint having a jig that forms a plurality of cores that can be detachably attached. |
| DE102004062477A1 (en) * | 2004-12-24 | 2006-07-06 | Bayer Materialscience Ag | Process for producing a composite molded part from plastic and its use |
| US7147812B2 (en) * | 2005-02-01 | 2006-12-12 | Intel Corporation | Input/output access shield member for computer housing |
| US20060245951A1 (en) * | 2005-04-13 | 2006-11-02 | Par Technologies, Llc | Multilayer valve structures, methods of making, and pumps using same |
| US20060245949A1 (en) * | 2005-04-13 | 2006-11-02 | Par Technologies, Llc | Electromagnetically bonded pumps and pump subassemblies and methods of fabrication |
| JP2007026421A (en) * | 2005-06-15 | 2007-02-01 | Toshiba Corp | Portable storage device |
| RU2434254C2 (en) * | 2005-06-16 | 2011-11-20 | Эвери Деннисон Копэрейшн | Retroreflective sheet component, film for making said component, method of making transparent film layer, stamping matrix for forming transparent film layer, method of making said matrix, article having retroreflective sheet component and method of making said article |
| DE102006023257B4 (en) * | 2005-07-09 | 2011-05-12 | Atmel Automotive Gmbh | Apparatus for hot testing semiconductor integrated circuits on wafers |
| CN101605156B (en) * | 2005-08-25 | 2013-01-09 | 日本电气株式会社 | Casing for portable device, portable device, and method of manufacturing casing for portable device |
| CN101292387B (en) * | 2005-10-20 | 2010-12-01 | 丰田自动车株式会社 | Fuel cell stack case |
| CN1972587B (en) * | 2005-11-25 | 2011-11-16 | 深圳富泰宏精密工业有限公司 | Shielding component and casing assembly of electronic device |
| US20070257398A1 (en) * | 2006-05-04 | 2007-11-08 | Moncrieff Scott E | Laminated electronic components for insert molding |
| US20070264496A1 (en) * | 2006-05-12 | 2007-11-15 | Wavezero, Inc. | Solderable Plastic EMI Shielding |
| CN100446954C (en) * | 2006-06-29 | 2008-12-31 | 沈华强 | Metallizing treatment process of resin product surface |
| US8007704B2 (en) * | 2006-07-20 | 2011-08-30 | Honeywell International Inc. | Insert molded actuator components |
| US7733659B2 (en) * | 2006-08-18 | 2010-06-08 | Delphi Technologies, Inc. | Lightweight audio system for automotive applications and method |
| US8004860B2 (en) * | 2006-08-29 | 2011-08-23 | Texas Instruments Incorporated | Radiofrequency and electromagnetic interference shielding |
| KR100797627B1 (en) * | 2006-09-01 | 2008-01-24 | 주식회사 이엠따블유안테나 | Uninterrupted Deposition of Mobile Phone Components |
| US7742309B2 (en) * | 2006-12-29 | 2010-06-22 | Nokia Corporation | Electronic device and method of assembling an electronic device |
| US7672142B2 (en) * | 2007-01-05 | 2010-03-02 | Apple Inc. | Grounded flexible circuits |
| US7729131B2 (en) * | 2007-01-05 | 2010-06-01 | Apple Inc. | Multiple circuit board arrangements in electronic devices |
| WO2008083524A1 (en) * | 2007-01-12 | 2008-07-17 | Xiamen Hualian Electronics Co., Ltd. | Method for manufactureing infrared remote-control receiving-amplifier |
| US20080175986A1 (en) * | 2007-01-24 | 2008-07-24 | Kenneth Crouse | Second surface metallization |
| CN101274505B (en) * | 2007-03-28 | 2012-05-30 | 中良工业股份有限公司 | Method for manufacturing air-permeable granular foaming bonding material |
| JP5218396B2 (en) * | 2007-04-11 | 2013-06-26 | 戸田工業株式会社 | Electromagnetic interference suppression sheet, high-frequency signal flat cable, flexible printed circuit board, and electromagnetic interference suppression sheet manufacturing method |
| US8198979B2 (en) | 2007-04-20 | 2012-06-12 | Ink-Logix, Llc | In-molded resistive and shielding elements |
| KR101549455B1 (en) | 2007-04-20 | 2015-09-03 | 티+잉크, 인코포레이티드 | In-molded capacitive switch |
| EP2014440A1 (en) * | 2007-07-13 | 2009-01-14 | Hueck Folien Ges.m.b.H. | Directly coated insert moulding - decorative films and laminates |
| US8031485B2 (en) | 2007-09-07 | 2011-10-04 | Autosplice, Inc. | Electronic shielding apparatus and methods |
| CN101420829B (en) * | 2007-10-25 | 2011-09-21 | 深圳富泰宏精密工业有限公司 | Metal case and manufacturing method therefor |
| US20090153989A1 (en) * | 2007-12-14 | 2009-06-18 | Samsung Corning Precision Glass Co., Ltd. | Optical filter for display device |
| JP5213106B2 (en) * | 2008-01-17 | 2013-06-19 | デクセリアルズ株式会社 | Flat cable |
| US8315043B2 (en) * | 2008-01-24 | 2012-11-20 | Apple Inc. | Methods and systems for forming housings from multi-layer materials |
| TWI365695B (en) | 2008-04-02 | 2012-06-01 | Pegatron Corp | Case of an electronic device and method of fabricating the same |
| TW200944101A (en) * | 2008-04-10 | 2009-10-16 | Delta Electronics Inc | Buffering component and electronic device using the same |
| DE102009016194A1 (en) * | 2008-04-23 | 2009-10-29 | Heidelberger Druckmaschinen Ag | Method for producing a security feature on a flat substrate |
| TWI331084B (en) * | 2008-05-12 | 2010-10-01 | Asustek Comp Inc | In-mold decoration device and manufacturing method thereof |
| CN101746069A (en) * | 2008-12-04 | 2010-06-23 | 和硕联合科技股份有限公司 | Fiber-reinforced polymer shell and manufacturing method thereof |
| FR2940588B1 (en) * | 2008-12-19 | 2011-01-07 | St Microelectronics Grenoble | SURFACE ASSEMBLED MULTICOMPONENT ASSEMBLY |
| US20100157566A1 (en) * | 2008-12-19 | 2010-06-24 | Robert Bogursky | Electronic shield assembly and methods |
| KR101559785B1 (en) * | 2009-01-20 | 2015-10-13 | 엘지전자 주식회사 | METHOD FOR MANUFACTURING STRUCTURE WITH MICROPATIC PATTERN FOR HOME ELECTRONIC APPLIANCE AND CE ELECTRONIC APPLIANCE |
| US7928326B2 (en) * | 2009-02-27 | 2011-04-19 | Hewlett-Packard Development Company, L.P. | Thermoformed EMI shield |
| IT1393462B1 (en) * | 2009-03-23 | 2012-04-20 | Angelo Peruzza Di Paolo Peruzza & C S A S Ora A Peruzza S R L | FILM FOR THE PRODUCTION OF COMPOSITE MATERIALS, A PRODUCTION METHOD OF THAT FILM, AND A METHOD FOR THE PRODUCTION OF COMPOSITE MATERIALS USING THIS FILM |
| TW201038170A (en) * | 2009-04-02 | 2010-10-16 | Hon Hai Prec Ind Co Ltd | Housing |
| US8668860B2 (en) * | 2009-04-02 | 2014-03-11 | Hon Hai Precision Industry Co., Ltd. | Plastic article and method of manufacturing the same |
| US20120012382A1 (en) * | 2009-05-13 | 2012-01-19 | Laird Technologies, Inc. | Conductive Films for EMI Shielding Applications |
| JP2011018873A (en) * | 2009-05-22 | 2011-01-27 | Sony Ericsson Mobilecommunications Japan Inc | Electromagnetic shielding method and electromagnetic shielding film |
| US8218324B2 (en) * | 2009-06-16 | 2012-07-10 | Continental Automotive Systems, Inc. | Module for housing electronic components and method of manufacturing the same |
| CN101945546A (en) * | 2009-07-06 | 2011-01-12 | 深圳富泰宏精密工业有限公司 | Manufacturing method of shell and shell obtained by same |
| US20120155684A1 (en) * | 2009-08-28 | 2012-06-21 | James Edward De Finis | Hearing Aid Device and Method of Producing a Hearing Aid Device |
| US8224006B2 (en) * | 2009-08-28 | 2012-07-17 | Siemens Medical Instruments Pte. Ltd. | Hearing aid device and a method of manufacturing a hearing aid device |
| US8254608B2 (en) * | 2009-08-28 | 2012-08-28 | Siemens Medical Instruments Pte. Ltd. | Hearing aid device and method of producing a hearing aid device |
| JP2011077266A (en) * | 2009-09-30 | 2011-04-14 | Nec Personal Products Co Ltd | Method for manufacturing cabinet, cabinet, and electronic apparatus |
| US8681485B2 (en) * | 2009-12-22 | 2014-03-25 | Flextronics Ap, Llc | Enclosure of anodized multi-layer metallic shell with molded plastic scaffolding and method of manufacture |
| TWI393667B (en) * | 2010-02-04 | 2013-04-21 | Unimicron Technology Corp | Method for forming a lid member on mems device |
| US8858854B2 (en) | 2010-04-01 | 2014-10-14 | Flextronics Ap, Llc | System and method for plastic overmolding on a metal surface |
| KR101736862B1 (en) * | 2010-06-29 | 2017-05-17 | 엘지전자 주식회사 | Mobile terminal case, mobile terminal having the same and method for manufacturing mobile terminal case |
| CN102338898A (en) * | 2010-07-28 | 2012-02-01 | 盛玉林 | Reflector plate and processing process thereof |
| KR101161321B1 (en) * | 2010-10-01 | 2012-07-02 | 서동진 | PCB Conneting cable and Thereof manufacture method |
| US8730656B2 (en) | 2010-11-12 | 2014-05-20 | Apple Inc. | Unitary housing for electronic device |
| JP2012124466A (en) * | 2010-11-18 | 2012-06-28 | Nitto Denko Corp | Adhesive film for semiconductor device and semiconductor device |
| US8493732B2 (en) | 2010-12-22 | 2013-07-23 | Kara Lineal | Shielded heat-dissipating lap cushion |
| US9062386B2 (en) * | 2011-03-01 | 2015-06-23 | Srg Global, Inc. | Methods of multi-shot injection molding and metal-plated polymeric articles made therefrom |
| TW201240560A (en) * | 2011-03-24 | 2012-10-01 | Hon Hai Prec Ind Co Ltd | Electronic device housing and method of manufacturing the same |
| WO2011137756A2 (en) * | 2011-05-06 | 2011-11-10 | 华为终端有限公司 | Composite material and electron device |
| CN102815066B (en) * | 2011-06-08 | 2016-03-02 | 联想(北京)有限公司 | The preparation method of workpiece and electronic equipment |
| WO2013016695A2 (en) | 2011-07-27 | 2013-01-31 | Flextronics Ap, Llc | Temperature controlled molding of composite components |
| CN102958300B (en) * | 2011-08-29 | 2017-02-08 | 深圳富泰宏精密工业有限公司 | Resin and fibre compound body and manufacturing method thereof |
| ITTO20110876A1 (en) * | 2011-09-30 | 2013-03-31 | Stmicroelectronics Malta Ltd | WELDING METHOD OF A HOOD WITH A SUPPORT LAYER |
| CN103171061B (en) * | 2011-12-23 | 2015-06-17 | 明安国际企业股份有限公司 | Method of manufacturing an angled fiber reinforced shell |
| CN103188895A (en) * | 2011-12-29 | 2013-07-03 | 深圳富泰宏精密工业有限公司 | Shell body and manufacturing method thereof |
| JP5693515B2 (en) * | 2012-01-10 | 2015-04-01 | エイチズィーオー・インコーポレーテッド | Electronic device with internal water-resistant coating |
| TWI484897B (en) * | 2012-01-20 | 2015-05-11 | Lite On Technology Corp | Heat dissipation structure and electronic device having the same |
| US10098242B2 (en) * | 2012-03-29 | 2018-10-09 | Taiwan Green Point Enterprises Co., Ltd. | Double-sided circuit board and method for preparing the same |
| US8987871B2 (en) * | 2012-05-31 | 2015-03-24 | Stmicroelectronics Pte Ltd. | Cap for a microelectromechanical system device with electromagnetic shielding, and method of manufacture |
| JP6198079B2 (en) * | 2012-06-04 | 2017-09-20 | アモグリーンテク カンパニー,リミテッド | Electromagnetic wave shielding sheet, method for producing the same, and interior antenna provided with the same |
| WO2014002119A2 (en) * | 2012-06-28 | 2014-01-03 | Jain Irrigation Systems Limited | On and off tube weight for drip irrigation |
| CN103624919A (en) * | 2012-08-24 | 2014-03-12 | 纬创资通股份有限公司 | Manufacturing method of casing and casing of portable electronic device |
| CN103635040B (en) * | 2012-08-24 | 2014-12-10 | 国家电网公司 | Housing of power carrier product and application method thereof |
| GB2519264A (en) * | 2012-08-27 | 2015-04-15 | Motorola Solutions Inc | Housing for electrostatic discharge protection of a portable communication device |
| US8927881B2 (en) * | 2012-09-07 | 2015-01-06 | Apple Inc. | Insert molded cowling structures |
| EP2708571A1 (en) * | 2012-09-12 | 2014-03-19 | ETH Zürich | Composite materials and their uses as well as methods for the preparation thereof |
| EP2743786B1 (en) * | 2012-12-17 | 2018-10-31 | The Swatch Group Research and Development Ltd. | Portable electronic device and method for manufacturing such a device |
| US8879249B1 (en) * | 2012-12-28 | 2014-11-04 | Google Inc. | Reinforced enclosure |
| US20140284095A1 (en) * | 2013-01-25 | 2014-09-25 | Scott Behuniak | Device for eliminating cell phone tracking |
| JP6092674B2 (en) * | 2013-03-22 | 2017-03-08 | シャープ株式会社 | Structure, wireless communication device, and method of manufacturing structure |
| DE102013205884A1 (en) * | 2013-04-03 | 2014-10-09 | Mahle International Gmbh | Modular system of a control unit |
| KR102070279B1 (en) * | 2013-04-26 | 2020-01-28 | 엘지전자 주식회사 | Mobile terminal and manufacturing method of case included therein |
| KR102124047B1 (en) * | 2013-06-04 | 2020-06-18 | 삼성디스플레이 주식회사 | Cover window |
| DE102013109616A1 (en) * | 2013-09-03 | 2015-03-05 | Thyssenkrupp Steel Europe Ag | Semi-finished product and method for producing a three-dimensionally shaped hybrid component in the metal / plastic composite and use of such a semi-finished product |
| CN104470297B (en) * | 2013-09-22 | 2018-08-07 | 富钰精密组件(昆山)有限公司 | It is coated with the shell of silica gel and the electronic device using the shell |
| US9468118B1 (en) * | 2013-12-20 | 2016-10-11 | Amazon Technologies, Inc. | Reinforced structural composite |
| WO2015145355A1 (en) * | 2014-03-24 | 2015-10-01 | Sabic Global Technologies B.V. | Transparent articles including electromagnetic radiation shielding |
| CN104608317B (en) * | 2015-02-03 | 2017-09-26 | 东莞市慧泽凌化工科技有限公司 | Preparation method of metal and resin combination and product |
| CN105050335A (en) * | 2015-06-12 | 2015-11-11 | 上海安费诺永亿通讯电子有限公司 | Methods for connecting double-surface printed circuit board and welding electronic components by employing ultrasonic waves |
| WO2017020294A1 (en) * | 2015-08-06 | 2017-02-09 | Hewlett-Packard Development Company, L.P. | Manufacturing housings |
| DE102015217744A1 (en) * | 2015-09-16 | 2017-03-16 | Nanogate PD Systems GmbH | Radom |
| US9871005B2 (en) | 2016-01-07 | 2018-01-16 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| US20170260638A1 (en) * | 2016-03-14 | 2017-09-14 | J. T. Labs Limited | Method for manufacturing composite part of polymer and metal |
| WO2018102630A1 (en) * | 2016-12-01 | 2018-06-07 | Avery Dennison Retail Information Services, Llc | Systems and methods for improving performance of rfid tags |
| CN108541152A (en) * | 2017-03-06 | 2018-09-14 | 中兴通讯股份有限公司 | A kind of shell and its manufacturing method |
| US10477738B2 (en) * | 2017-03-06 | 2019-11-12 | Laird Technologies, Inc. | Board level shields and systems and methods of applying board level shielding |
| CN107018648A (en) * | 2017-06-02 | 2017-08-04 | 深圳天珑无线科技有限公司 | Radome and preparation method thereof, electronic installation |
| TW201902654A (en) * | 2017-06-09 | 2019-01-16 | 宏碁股份有限公司 | Housing structure and manufacturing method thereof |
| US10433048B2 (en) | 2017-08-31 | 2019-10-01 | Apple Inc. | Micro speaker having a hermetically sealed acoustic chamber with increased volume |
| DE102018105523A1 (en) * | 2018-03-09 | 2019-09-12 | Leonhard Kurz Stiftung & Co. Kg | Process for the preparation of a decorated molded part |
| US11090876B2 (en) | 2018-09-18 | 2021-08-17 | Flex Ltd. | Assembly of sub-components by compression molding |
| CN110113865A (en) * | 2019-05-28 | 2019-08-09 | 苏州福莱盈电子有限公司 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
| CN110341365A (en) * | 2019-06-19 | 2019-10-18 | 福建省锐驰电子科技有限公司 | The manufacture craft and decoration panel of a kind of nanometer of texture transfer decorative panel |
| CN110346622A (en) * | 2019-07-17 | 2019-10-18 | 山东电亮亮信息科技有限公司 | A kind of interference-free power power end instrument shielding casing and preparation method thereof |
| CN110769293A (en) * | 2019-11-28 | 2020-02-07 | 徐州蓝格数字科技有限公司 | Panel for digital set-top box shell |
| US20240196516A1 (en) * | 2021-04-15 | 2024-06-13 | Aes Global Holdings Pte Ltd. | Printed circuit board grounding |
| US11839043B2 (en) * | 2021-04-29 | 2023-12-05 | Robert Bosch Llc | Electronic device with sealed housing |
| FR3133199B1 (en) * | 2022-03-04 | 2025-11-07 | Jet Metal Tech | METHOD FOR MANUFACTURING A THREE-DIMENSIONAL ARTICLE WITH METALLIC MOTIF(S) |
Family Cites Families (104)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2004A (en) * | 1841-03-12 | Improvement in the manner of constructing and propelling steam-vessels | ||
| US2001A (en) * | 1841-03-12 | Sawmill | ||
| US3312197A (en) * | 1965-10-15 | 1967-04-04 | Forrest W Smith | Facsimile coin embedded in plastic, and method of making same |
| CA929041A (en) | 1967-09-15 | 1973-06-26 | The Robinson Waxed Paper Company Limited | Processing of web material |
| US3645822A (en) | 1969-01-31 | 1972-02-29 | Dow Chemical Co | Method for providing multilayer films having improved slip properties |
| US3670872A (en) * | 1971-01-08 | 1972-06-20 | Harcourt Brace Jovanovich | Combination carrying carton and display stand |
| CA1070792A (en) * | 1976-07-26 | 1980-01-29 | Earl A. Cooper | Electrical connector and frequency shielding means therefor and method of making same |
| JPS5539338A (en) * | 1978-09-12 | 1980-03-19 | Matsushita Electric Ind Co Ltd | Preparation for injection-molding |
| US4423106A (en) | 1979-01-26 | 1983-12-27 | Mahn John E | Laminated material and method of forming |
| US4329196A (en) | 1979-08-16 | 1982-05-11 | Monsanto Company | Method of making a three-dimensional laminate |
| US4678699A (en) | 1982-10-25 | 1987-07-07 | Allied Corporation | Stampable polymeric composite containing an EMI/RFI shielding layer |
| US4489116A (en) * | 1982-12-21 | 1984-12-18 | Flood James R | Skin packaging technique providing paint masking |
| DE3248147A1 (en) * | 1982-12-27 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | METALIZED PLASTIC MOLDED PARTS FOR TECHNICAL HOUSING FOR SHIELDING AGAINST ELECTROMAGNETIC INTERFERENCE |
| US4973514A (en) * | 1984-06-11 | 1990-11-27 | The Dow Chemical Company | EMI shielding composites |
| JPS6163445A (en) * | 1984-09-05 | 1986-04-01 | Mitsubishi Monsanto Chem Co | Manufacturing method of electromagnetic wave shielding case |
| DE3545790C2 (en) * | 1984-12-24 | 2001-04-12 | Fukuvi Chem Ind Co | Method for producing a transparent shielding material against electromagnetic waves. |
| US4774148A (en) * | 1984-12-28 | 1988-09-27 | Showa Laminate Printing Co., Ltd. | Composite sheet material for magnetic and electronic shielding and product obtained therefrom |
| JPH0651313B2 (en) * | 1986-03-31 | 1994-07-06 | 富士重工業株式会社 | Interior trim molding method |
| US4714905A (en) * | 1986-10-08 | 1987-12-22 | K & L Microwave | SMC filter and method of manufacture thereof |
| US4933060A (en) * | 1987-03-02 | 1990-06-12 | The Standard Oil Company | Surface modification of fluoropolymers by reactive gas plasmas |
| JPS6426435A (en) * | 1987-07-22 | 1989-01-27 | Chisso Corp | Conductive polypropylene sheet |
| US5286528A (en) | 1987-11-03 | 1994-02-15 | Eastman Kodak Company | Protective and decorative sheet material having a transparent topcoat |
| US4824506A (en) | 1988-04-21 | 1989-04-25 | General Motors Corporation | Process for protecting thermoformed films |
| JPH062317Y2 (en) * | 1988-08-09 | 1994-01-19 | 株式会社東芝 | Case structure |
| US4913760A (en) | 1988-08-29 | 1990-04-03 | Eastman Kodak Company | Method of manufacturing a dried, thermoformable, paint-coated sheet material having gloss and smoothness |
| US5028490A (en) | 1988-11-14 | 1991-07-02 | Minnesota Mining And Manufacturing Co. | Metal/polymer composites |
| US5226210A (en) * | 1989-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method of forming metal fiber mat/polymer composite |
| US4965408A (en) * | 1989-02-01 | 1990-10-23 | Borden, Inc. | Composite sheet material for electromagnetic radiation shielding |
| US5084132A (en) * | 1989-04-13 | 1992-01-28 | Chomerics, Inc. | Non-moire' shielded window forming method |
| JPH0686310B2 (en) * | 1989-04-28 | 1994-11-02 | セントラル硝子株式会社 | Transparent non-expandable crystallized glass |
| US5250342A (en) * | 1989-05-24 | 1993-10-05 | United Technologies Corporation | Composite EMI shield having clean, highly conductive surfaces for conductive bonding |
| US4988550A (en) * | 1989-07-28 | 1991-01-29 | Chomerics, Inc. | Conductive masking laminate |
| US5107404A (en) * | 1989-09-14 | 1992-04-21 | Astec International Ltd. | Circuit board assembly for a cellular telephone system or the like |
| US5524697A (en) | 1990-03-15 | 1996-06-11 | Pcc Composites, Inc. | Method and apparatus for single die composite production |
| US5170009A (en) * | 1990-03-22 | 1992-12-08 | Canon Kabushiki Kaisha | Electrically conductive covers and electrically conductive covers of electronic equipment |
| US5235492A (en) * | 1990-04-24 | 1993-08-10 | Motorola, Inc. | Electromagnetic shielding apparatus for cellular telephones |
| US5191544A (en) * | 1990-06-15 | 1993-03-02 | International Business Machines Corp. | Personal computer enclosure with shielding |
| US5270488A (en) * | 1990-07-27 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Shield construction for electrical devices |
| US6058000A (en) * | 1990-07-31 | 2000-05-02 | Intermec Ip Corp. | Method and apparatus for electromagnetic shielding and electrostatic discharge protection |
| US5180639A (en) * | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5206796A (en) * | 1991-03-11 | 1993-04-27 | John Fluke Mfg. Co. Inc. | Electronic instrument with emi/esd shielding system |
| DE4134290A1 (en) | 1991-10-17 | 1993-09-23 | Herberts Gmbh | METHOD OF MULTILAYER LACQUERING |
| US5225629A (en) * | 1991-12-13 | 1993-07-06 | Dell Usa L.P. | Snap-in EMI contact associated with a digital computer |
| US5214242A (en) * | 1992-01-07 | 1993-05-25 | International Business Machines Corp. | Electromagnetic interference/radio frequency interference conducting strip |
| US5598034A (en) * | 1992-07-22 | 1997-01-28 | Vlsi Packaging Corporation | Plastic packaging of microelectronic circuit devices |
| JPH06203597A (en) * | 1992-09-25 | 1994-07-22 | Nec Corp | Dynamic ram |
| US5285619A (en) * | 1992-10-06 | 1994-02-15 | Williams International Corporation | Self tooling, molded electronics packaging |
| US5355016A (en) * | 1993-05-03 | 1994-10-11 | Motorola, Inc. | Shielded EPROM package |
| US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
| DE4319519A1 (en) | 1993-06-14 | 1994-12-15 | Ymos Ag Ind Produkte | Method for producing painted parts |
| EP0633585B1 (en) * | 1993-07-08 | 1997-11-05 | Philips Patentverwaltung GmbH | Housing for electric communication apparatus |
| JPH0745982A (en) * | 1993-07-28 | 1995-02-14 | Toshiba Corp | Connection structure between shield case and printed wiring board |
| JPH0766331A (en) | 1993-08-02 | 1995-03-10 | Motorola Inc | Method of manufacturing semiconductor device package |
| US5373102A (en) * | 1993-08-19 | 1994-12-13 | The United States Of America As Represented By The Secretary Of The Army | Optically transmissive Faraday cage |
| CA2129073C (en) * | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US5436803A (en) * | 1993-12-16 | 1995-07-25 | Schlegel Corporation | Emi shielding having flexible conductive envelope |
| FI117224B (en) * | 1994-01-20 | 2006-07-31 | Nec Tokin Corp | Electromagnetic piece for removing interference, as well as electronic device and hybrid microcircuit element in which it is used |
| US5405000A (en) * | 1994-02-28 | 1995-04-11 | Hagedon; Bryan D. | Protective suspension package |
| TW311267B (en) * | 1994-04-11 | 1997-07-21 | Raychem Ltd | |
| US5557064A (en) * | 1994-04-18 | 1996-09-17 | Motorola, Inc. | Conformal shield and method for forming same |
| US5639989A (en) * | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
| US5559677A (en) * | 1994-04-29 | 1996-09-24 | Motorola, Inc. | Method of forming a device by selectively thermal spraying a metallic conductive material thereon |
| US5811050A (en) | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
| SE504039C2 (en) | 1994-06-14 | 1996-10-21 | Ericsson Telefon Ab L M | Way to injection mold plastic |
| DE69508911T2 (en) * | 1994-11-28 | 1999-10-07 | Kabushiki Kaisha Toshiba, Kawasaki | Housing with electromagnetic shielding |
| US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
| US5597979A (en) * | 1995-05-12 | 1997-01-28 | Schlegel Corporation | EMI shielding having flexible condustive sheet and I/O Gasket |
| US5559676A (en) * | 1995-06-07 | 1996-09-24 | Gessaman; Martin J. | Self-contained drop-in component |
| CA2151331A1 (en) * | 1995-06-08 | 1996-12-09 | Henry W. C. Mok | Emi shield |
| JP3385163B2 (en) * | 1995-09-04 | 2003-03-10 | 吉野電化工業株式会社 | Electromagnetic wave shield and method of forming the same |
| US5550713A (en) * | 1995-09-06 | 1996-08-27 | Aironet Wireless Communications, Inc. | Electromagnetic shielding assembly for printed circuit board |
| FI956226L (en) * | 1995-12-22 | 1997-06-23 | Nokia Mobile Phones Ltd | Method and arrangement for electromagnetic shielding of an electronic medium |
| US5825634A (en) * | 1995-12-22 | 1998-10-20 | Bfgoodrich Avionics Systems, Inc. | Circuit board having an EMI shielded area |
| US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
| US5822690A (en) * | 1996-04-12 | 1998-10-13 | Motorola, Inc. | Multi-pole switch assembly providing display cover and virtual pivot action |
| JPH1027987A (en) * | 1996-07-10 | 1998-01-27 | Hitachi Ltd | Low EMI circuit board and low EMI cable connector |
| JP2954535B2 (en) | 1996-07-31 | 1999-09-27 | 大日本印刷株式会社 | Injection molding simultaneous painting method and apparatus |
| US6030708A (en) | 1996-10-28 | 2000-02-29 | Nissha Printing Co., Ltd. | Transparent shielding material for electromagnetic interference |
| US6018125A (en) * | 1996-11-15 | 2000-01-25 | Collins; Pat Eliot | High frequency EMI shield with air flow for electronic device enclosure |
| WO1998034787A1 (en) | 1997-02-07 | 1998-08-13 | Android Industries Of Michigan, L.L.C. | Method for making formable laminated decorative sheets |
| US6262364B1 (en) * | 1997-06-24 | 2001-07-17 | Bridgestone Corporation | Electromagnetic-wave shielding and light transmitting plate |
| US5872332A (en) * | 1997-06-27 | 1999-02-16 | Delco Electronics Corp. | Molded housing with EMI shield |
| US6455770B2 (en) * | 1997-07-03 | 2002-09-24 | Lee J. Pulver | Electromagnetic radiation shield for attenuating electromagnetic radiation from an active electronic device |
| US6121545A (en) * | 1997-07-11 | 2000-09-19 | Parker-Hannifin Corporation | Low closure force EMI shielding spacer gasket |
| US6140575A (en) * | 1997-10-28 | 2000-10-31 | 3Com Corporation | Shielded electronic circuit assembly |
| US5938979A (en) * | 1997-10-31 | 1999-08-17 | Nanogram Corporation | Electromagnetic shielding |
| US6117384A (en) * | 1997-11-06 | 2000-09-12 | General Electric Co. | In-mold decorating process |
| KR100335346B1 (en) * | 1997-11-11 | 2002-06-20 | 이사오 우치가사키 | Electromagnetically shielding bonding film, and shielding assembly and display device using such film |
| US6127038A (en) * | 1997-12-11 | 2000-10-03 | American Meter Company | Printed circuit board coating and method |
| US6094361A (en) * | 1997-12-12 | 2000-07-25 | Nortel Networks Corporation | Assemblies of printed circuit boards and flexible containers therefor |
| US6097613A (en) * | 1997-12-12 | 2000-08-01 | Nortel Networks Limited | Assemblies of electronic devices and flexible containers therefor |
| US6147879A (en) * | 1997-12-12 | 2000-11-14 | Nortel Networks Limited | Assemblies of electrical devices and flexible containers therefor |
| US6063999A (en) * | 1997-12-19 | 2000-05-16 | Siemens Medical Systems, Inc. | Surface mount spring gasket and EMI enclosure |
| US5969418A (en) * | 1997-12-22 | 1999-10-19 | Ford Motor Company | Method of attaching a chip to a flexible substrate |
| US6180876B1 (en) * | 1997-12-29 | 2001-01-30 | Research In Motion Limited | Apparatus and method for RF shielding of a printed circuit board |
| US6350951B1 (en) * | 1997-12-29 | 2002-02-26 | Intel Corporation | Electric shielding of on-board devices |
| US6275683B1 (en) * | 1998-01-12 | 2001-08-14 | Ericsson Inc. | Interchangeable shield for a radio communication device |
| DE19812880A1 (en) * | 1998-03-24 | 1999-09-30 | Bayer Ag | Shaped part and flexible film with protected conductor track and process for its production |
| US6090728A (en) | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
| US6219258B1 (en) * | 1999-01-29 | 2001-04-17 | Ericsson Inc. | Electronic enclosure with improved environmental protection |
| US6088231A (en) * | 1999-03-03 | 2000-07-11 | Methode Electronics, Inc. | RF and EMI shield |
| US6271465B1 (en) * | 1999-08-31 | 2001-08-07 | Nokia Mobile Phones Limited | Low cost conformal EMI/RFI shield |
| FI20002038L (en) * | 2000-09-15 | 2002-03-16 | Nokia Mobile Phones Ltd | Decorated injection molded product and method for making same |
| US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
-
2001
- 2001-09-04 US US09/947,229 patent/US6768654B2/en not_active Expired - Lifetime
- 2001-09-10 CN CNA01818989XA patent/CN1474742A/en active Pending
- 2001-09-10 WO PCT/US2001/028718 patent/WO2002024431A1/en not_active Ceased
- 2001-09-10 EP EP01970959A patent/EP1324867A4/en not_active Withdrawn
- 2001-09-10 CN CNA2005101285979A patent/CN1781702A/en active Pending
- 2001-09-10 AU AU2001290903A patent/AU2001290903A1/en not_active Abandoned
-
2004
- 2004-06-07 US US10/863,716 patent/US20040234752A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1324867A1 (en) | 2003-07-09 |
| US20020071940A1 (en) | 2002-06-13 |
| US6768654B2 (en) | 2004-07-27 |
| US20040234752A1 (en) | 2004-11-25 |
| WO2002024431A1 (en) | 2002-03-28 |
| CN1781702A (en) | 2006-06-07 |
| CN1474742A (en) | 2004-02-11 |
| EP1324867A4 (en) | 2007-05-30 |
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