AU2001283048A1 - Process for improving polymer to metal adhesion - Google Patents
Process for improving polymer to metal adhesionInfo
- Publication number
- AU2001283048A1 AU2001283048A1 AU2001283048A AU8304801A AU2001283048A1 AU 2001283048 A1 AU2001283048 A1 AU 2001283048A1 AU 2001283048 A AU2001283048 A AU 2001283048A AU 8304801 A AU8304801 A AU 8304801A AU 2001283048 A1 AU2001283048 A1 AU 2001283048A1
- Authority
- AU
- Australia
- Prior art keywords
- metal adhesion
- improving polymer
- polymer
- improving
- adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002184 metal Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/166—Metal in the pretreated surface to be joined
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemical Treatment Of Metals (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/643,813 US6554948B1 (en) | 2000-08-22 | 2000-08-22 | Process for improving the adhesion of polymeric materials to metal surfaces |
| US09643813 | 2000-08-22 | ||
| PCT/US2001/024005 WO2002016524A1 (en) | 2000-08-22 | 2001-07-31 | Process for improving polymer to metal adhesion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001283048A1 true AU2001283048A1 (en) | 2002-03-04 |
Family
ID=24582325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001283048A Abandoned AU2001283048A1 (en) | 2000-08-22 | 2001-07-31 | Process for improving polymer to metal adhesion |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6554948B1 (en) |
| EP (1) | EP1311644B1 (en) |
| JP (1) | JP4295504B2 (en) |
| CN (1) | CN100343356C (en) |
| AU (1) | AU2001283048A1 (en) |
| CA (1) | CA2420540A1 (en) |
| DE (1) | DE60115253T2 (en) |
| ES (1) | ES2252274T3 (en) |
| TW (1) | TW538080B (en) |
| WO (1) | WO2002016524A1 (en) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
| US6461415B1 (en) * | 2000-08-23 | 2002-10-08 | Applied Thin Films, Inc. | High temperature amorphous composition based on aluminum phosphate |
| US6645639B1 (en) * | 2000-10-13 | 2003-11-11 | Applied Thin Films, Inc. | Epitaxial oxide films via nitride conversion |
| US6573209B1 (en) * | 2000-10-13 | 2003-06-03 | Applied Thin Films, Inc. | Zirconium nitride and yttrium nitride solid solution composition |
| DE10114980A1 (en) * | 2001-03-27 | 2002-10-17 | Henkel Kgaa | Adhesion promoter for paints and adhesives on metals |
| CA2497468C (en) * | 2002-08-14 | 2011-10-11 | Applied Thin Films, Inc. | Aluminum phosphate compounds, compositions, materials and related composites. |
| US8021758B2 (en) * | 2002-12-23 | 2011-09-20 | Applied Thin Films, Inc. | Aluminum phosphate compounds, coatings, related composites and applications |
| US7232478B2 (en) | 2003-07-14 | 2007-06-19 | Enthone Inc. | Adhesion promotion in printed circuit boards |
| US20060065365A1 (en) * | 2004-09-30 | 2006-03-30 | Ferrier Donald R | Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer |
| KR101632450B1 (en) † | 2008-03-21 | 2016-06-21 | 엔쏜 인코포레이티드 | Adhesion promotion of metal to laminate with a multi-functional compound |
| US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
| US8308893B2 (en) * | 2010-02-01 | 2012-11-13 | Ming De Wang | Nano-oxide process for bonding copper/copper alloy and resin |
| KR101774906B1 (en) * | 2010-07-06 | 2017-09-05 | 나믹스 코포레이션 | Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boards |
| KR101958606B1 (en) | 2010-07-06 | 2019-03-14 | 아토테크 도이칠란드 게엠베하 | Method of fabricating printed circuit board |
| US8524540B2 (en) | 2011-02-01 | 2013-09-03 | Nilesh Kapadia | Adhesion promoting composition for metal leadframes |
| CN111867275B (en) * | 2020-07-31 | 2021-08-24 | 国网河南省电力公司西峡县供电公司 | A browning method for improving the bonding force between layers of printed circuit boards |
| CA3110357A1 (en) * | 2021-02-25 | 2022-08-25 | Sixring Inc. | Modified sulfuric acid and uses thereof |
| JP2025102561A (en) * | 2023-12-26 | 2025-07-08 | 日本パーカライジング株式会社 | Surface treatment agent for copper materials |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5221460B1 (en) | 1971-04-26 | 1977-06-10 | ||
| SE400575B (en) | 1974-12-13 | 1978-04-03 | Nordnero Ab | BATH FOR CELLING OF COPPER AND ITS ALLOYS |
| DE2557269A1 (en) | 1975-12-19 | 1977-06-30 | Licentia Gmbh | Copper etching solution for printed circuits - contains ferric chloride or cupric chloride together with an acid and benzotriazole |
| JPS52150104A (en) | 1976-06-07 | 1977-12-13 | Fuji Photo Film Co Ltd | Photoosensitive lithographic press plate material |
| CA1146851A (en) * | 1978-05-01 | 1983-05-24 | Donald F. Greene | Hydrogen peroxide disinfecting and sterilizing compositions |
| JPS57116775A (en) | 1981-01-14 | 1982-07-20 | Toshiba Corp | Etching solution for nickel |
| US4409037A (en) | 1982-04-05 | 1983-10-11 | Macdermid Incorporated | Adhesion promoter for printed circuits |
| US4844981A (en) | 1982-04-05 | 1989-07-04 | Macdermid, Incorporated | Adhesion promoter for printed circuits |
| JPS6113688A (en) | 1984-06-28 | 1986-01-21 | 福田金属箔粉工業株式会社 | Copper foil for printed circuit and method of producing same |
| JPS61176192A (en) | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | Adhesion between copper and resin |
| US4902734A (en) | 1985-12-02 | 1990-02-20 | Ciba-Geigy Corporation | Acid-curable thermoset enamels containing a triazole |
| US4775444A (en) | 1987-08-26 | 1988-10-04 | Macdermid, Incorporated | Process for fabricating multilayer circuit boards |
| JPH0713304B2 (en) | 1987-12-14 | 1995-02-15 | 日立化成工業株式会社 | Copper surface treatment method |
| JPH01240683A (en) | 1988-03-19 | 1989-09-26 | Sanshin Kagaku Kogyo Kk | Composition of etching solution for copper and etching method |
| JPH01246393A (en) | 1988-03-25 | 1989-10-02 | Fukuda Metal Foil & Powder Co Ltd | Surface treatment of copper foil for inner layer or copper lined laminated sheet |
| US4976817A (en) | 1988-12-09 | 1990-12-11 | Morton International, Inc. | Wet lamination process and apparatus |
| US4997516A (en) | 1989-07-10 | 1991-03-05 | Edward Adler | Method for improving adherence of copper foil to resinous substrates |
| US4997722A (en) | 1989-07-10 | 1991-03-05 | Edward Adler | Composition and method for improving adherence of copper foil to resinous substrates |
| JPH0379778A (en) | 1989-08-21 | 1991-04-04 | Sanshin Chem Ind Co Ltd | Copper etching solution composition and etching method |
| US5037482A (en) | 1990-02-16 | 1991-08-06 | Macdermid, Incorporated | Composition and method for improving adhesion of coatings to copper surfaces |
| US5128065A (en) | 1990-10-03 | 1992-07-07 | Betz Laboratories, Inc. | Method for the inhibition of corrosion of copper-bearing metallurgies |
| US5289630A (en) | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
| JP3387528B2 (en) | 1992-08-07 | 2003-03-17 | 朝日化学工業株式会社 | Composition for etching copper or copper alloy and method for etching the same |
| JP2717911B2 (en) | 1992-11-19 | 1998-02-25 | 日鉱グールド・フォイル株式会社 | Copper foil for printed circuit and manufacturing method thereof |
| JP3225471B2 (en) | 1992-12-24 | 2001-11-05 | 旭電化工業株式会社 | Copper dissolving agent |
| NZ258702A (en) | 1993-01-11 | 1996-12-20 | Macdermid Inc | Phosphating compositions, method for providing phosphate conversion coating on metal substrate, and use in the fabrication of printed circuits utilising organic resins |
| JP3347457B2 (en) | 1994-02-24 | 2002-11-20 | 日本電解株式会社 | Non-cyanide copper-zinc electroplating bath, surface treatment method of copper foil for printed wiring board using the same, and copper foil for printed wiring board |
| JP2781954B2 (en) | 1994-03-04 | 1998-07-30 | メック株式会社 | Copper and copper alloy surface treatment agent |
| JP3400558B2 (en) | 1994-08-12 | 2003-04-28 | メック株式会社 | Copper and copper alloy etchant |
| GB9425090D0 (en) | 1994-12-12 | 1995-02-08 | Alpha Metals Ltd | Copper coating |
| JP2923524B2 (en) | 1995-08-01 | 1999-07-26 | メック株式会社 | Copper and copper alloy microetching agent and microetching method |
| JPH1056263A (en) | 1996-08-07 | 1998-02-24 | Ebara Densan:Kk | Manufacturing method of printed wiring board |
| TW374802B (en) | 1996-07-29 | 1999-11-21 | Ebara Densan Ltd | Etching composition, method for roughening copper surface and method for producing printed wiring board |
| US6020029A (en) | 1997-06-12 | 2000-02-01 | Macdermid, Incorporated | Process for treating metal surfaces |
| US5869130A (en) | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
| US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
| EP1547645B1 (en) * | 1998-07-13 | 2008-12-10 | JMS Co., Ltd. | Medical tube connector device |
| US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
| IT1307040B1 (en) * | 1999-05-31 | 2001-10-23 | Alfachimici Spa | PROCEDURE FOR PROMOTING ADHERENCE BETWEEN AN INORGANIC SUBSTRATE AND AN ORGANIC POLYMER. |
| ES2270789T3 (en) * | 2000-05-22 | 2007-04-16 | Macdermid Incorporated | PROCESS TO IMPROVE THE ADHESION OF POLYMER MATERIALS TO METAL SURFACES. |
| US6383272B1 (en) | 2000-06-08 | 2002-05-07 | Donald Ferrier | Process for improving the adhesion of polymeric materials to metal surfaces |
| US6521139B1 (en) * | 2000-08-04 | 2003-02-18 | Shipley Company L.L.C. | Composition for circuit board manufacture |
-
2000
- 2000-08-22 US US09/643,813 patent/US6554948B1/en not_active Expired - Lifetime
-
2001
- 2001-07-31 CN CNB01814523XA patent/CN100343356C/en not_active Expired - Lifetime
- 2001-07-31 JP JP2002521607A patent/JP4295504B2/en not_active Expired - Lifetime
- 2001-07-31 EP EP01961812A patent/EP1311644B1/en not_active Expired - Lifetime
- 2001-07-31 WO PCT/US2001/024005 patent/WO2002016524A1/en not_active Ceased
- 2001-07-31 AU AU2001283048A patent/AU2001283048A1/en not_active Abandoned
- 2001-07-31 DE DE60115253T patent/DE60115253T2/en not_active Expired - Lifetime
- 2001-07-31 ES ES01961812T patent/ES2252274T3/en not_active Expired - Lifetime
- 2001-07-31 CA CA002420540A patent/CA2420540A1/en not_active Abandoned
- 2001-08-15 TW TW090119979A patent/TW538080B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004517974A (en) | 2004-06-17 |
| DE60115253D1 (en) | 2005-12-29 |
| CN1447846A (en) | 2003-10-08 |
| EP1311644A4 (en) | 2004-09-01 |
| CN100343356C (en) | 2007-10-17 |
| CA2420540A1 (en) | 2002-02-28 |
| JP4295504B2 (en) | 2009-07-15 |
| EP1311644B1 (en) | 2005-11-23 |
| EP1311644A1 (en) | 2003-05-21 |
| DE60115253T2 (en) | 2006-08-17 |
| TW538080B (en) | 2003-06-21 |
| ES2252274T3 (en) | 2006-05-16 |
| WO2002016524A1 (en) | 2002-02-28 |
| US6554948B1 (en) | 2003-04-29 |
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