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AU2001281221A1 - Method of laminating a photoresist sheet to a substrate - Google Patents

Method of laminating a photoresist sheet to a substrate

Info

Publication number
AU2001281221A1
AU2001281221A1 AU2001281221A AU8122101A AU2001281221A1 AU 2001281221 A1 AU2001281221 A1 AU 2001281221A1 AU 2001281221 A AU2001281221 A AU 2001281221A AU 8122101 A AU8122101 A AU 8122101A AU 2001281221 A1 AU2001281221 A1 AU 2001281221A1
Authority
AU
Australia
Prior art keywords
laminating
substrate
photoresist sheet
photoresist
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281221A
Inventor
Bret Walczynski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chromaline Corp
Original Assignee
Chromaline Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chromaline Corp filed Critical Chromaline Corp
Publication of AU2001281221A1 publication Critical patent/AU2001281221A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU2001281221A 2000-08-09 2001-08-09 Method of laminating a photoresist sheet to a substrate Abandoned AU2001281221A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22393500P 2000-08-09 2000-08-09
US60/223,935 2000-08-09
US09/924,742 2001-08-08
US09/924,742 US20020048715A1 (en) 2000-08-09 2001-08-08 Photoresist adhesive and method
PCT/US2001/025045 WO2002012960A2 (en) 2000-08-09 2001-08-09 Method of laminating a photoresist sheet to a substrate

Publications (1)

Publication Number Publication Date
AU2001281221A1 true AU2001281221A1 (en) 2002-02-18

Family

ID=26918261

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281221A Abandoned AU2001281221A1 (en) 2000-08-09 2001-08-09 Method of laminating a photoresist sheet to a substrate

Country Status (4)

Country Link
US (1) US20020048715A1 (en)
EP (1) EP1307784A2 (en)
AU (1) AU2001281221A1 (en)
WO (1) WO2002012960A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006740A1 (en) * 2019-05-10 2020-11-10 Applied Materials Inc SUBSTRATE STRUCTURING PROCEDURES
IT201900006736A1 (en) 2019-05-10 2020-11-10 Applied Materials Inc PACKAGE MANUFACTURING PROCEDURES
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349620A (en) * 1979-06-15 1982-09-14 E. I. Du Pont De Nemours And Company Solvent developable photoresist film
DE3340154A1 (en) * 1983-11-07 1985-05-15 Basf Ag, 6700 Ludwigshafen METHOD FOR PRODUCING IMAGERALLY STRUCTURED RESIST LAYERS AND DRY FILM RESIST SUITABLE FOR THIS METHOD
US4764449A (en) * 1985-11-01 1988-08-16 The Chromaline Corporation Adherent sandblast photoresist laminate
US5415971A (en) * 1993-04-02 1995-05-16 The Chromaline Corporation Photoresist laminate including photoimageable adhesive layer

Also Published As

Publication number Publication date
EP1307784A2 (en) 2003-05-07
WO2002012960A8 (en) 2003-11-20
WO2002012960A2 (en) 2002-02-14
US20020048715A1 (en) 2002-04-25
WO2002012960A3 (en) 2002-08-01

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