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AU2001268707A1 - Mechanical clamper for heated substrates at die attach - Google Patents

Mechanical clamper for heated substrates at die attach

Info

Publication number
AU2001268707A1
AU2001268707A1 AU2001268707A AU6870701A AU2001268707A1 AU 2001268707 A1 AU2001268707 A1 AU 2001268707A1 AU 2001268707 A AU2001268707 A AU 2001268707A AU 6870701 A AU6870701 A AU 6870701A AU 2001268707 A1 AU2001268707 A1 AU 2001268707A1
Authority
AU
Australia
Prior art keywords
die attach
heated substrates
mechanical clamper
clamper
mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001268707A
Inventor
Sally Y. L. Foong
Kok Khoon Ho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001268707A1 publication Critical patent/AU2001268707A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10P72/0446—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53104—Roller or ball bearing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53961—Means to assemble or disassemble with work-holder for assembly
    • Y10T29/53974—Means to assemble or disassemble with work-holder for assembly having means to permit support movement while work is thereon
AU2001268707A 2000-06-28 2001-06-22 Mechanical clamper for heated substrates at die attach Abandoned AU2001268707A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21441700P 2000-06-28 2000-06-28
US60214417 2000-06-28
US09/764,133 US6547121B2 (en) 2000-06-28 2001-01-19 Mechanical clamper for heated substrates at die attach
US09764133 2001-01-19
PCT/US2001/020100 WO2002001612A2 (en) 2000-06-28 2001-06-22 Mechanical clamper for heated substrates at die attach

Publications (1)

Publication Number Publication Date
AU2001268707A1 true AU2001268707A1 (en) 2002-01-08

Family

ID=26908984

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001268707A Abandoned AU2001268707A1 (en) 2000-06-28 2001-06-22 Mechanical clamper for heated substrates at die attach

Country Status (8)

Country Link
US (1) US6547121B2 (en)
EP (1) EP1295313A2 (en)
JP (1) JP2004513507A (en)
KR (1) KR20030011931A (en)
CN (1) CN1439169A (en)
AU (1) AU2001268707A1 (en)
TW (1) TW503508B (en)
WO (1) WO2002001612A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4456234B2 (en) * 2000-07-04 2010-04-28 パナソニック株式会社 Bump formation method
US6547121B2 (en) * 2000-06-28 2003-04-15 Advanced Micro Devices, Inc. Mechanical clamper for heated substrates at die attach
US20070071583A1 (en) * 2005-09-29 2007-03-29 Stats Chippac Ltd. Substrate indexing system
JP5467743B2 (en) * 2008-08-29 2014-04-09 光洋サーモシステム株式会社 Heater unit and heat treatment apparatus
JP2011131229A (en) 2009-12-24 2011-07-07 Hitachi High-Technologies Corp Laser beam machining method, laser beam machining apparatus, and solar panel manufacturing method
US10199350B2 (en) * 2012-05-25 2019-02-05 Asm Technology Singapore Pte Ltd Apparatus for heating a substrate during die bonding
JP6385885B2 (en) * 2015-05-01 2018-09-05 キヤノンマシナリー株式会社 Bonding equipment
US10541223B2 (en) * 2017-05-05 2020-01-21 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
EP3506340B1 (en) * 2017-12-28 2020-10-21 Nexperia B.V. Bonding and indexing apparatus
JP7024464B2 (en) * 2018-02-02 2022-02-24 浜名湖電装株式会社 Electrical parts manufacturing equipment and manufacturing method of electrical parts

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3847004A (en) * 1971-03-25 1974-11-12 Bringewald Process Corp Apparatus and method for applying pressure and die and method for forming a part
US3791567A (en) * 1971-12-17 1974-02-12 Gloucester Eng Co Inc Web gripping, advancing apparatus
US4072077A (en) * 1976-05-24 1978-02-07 Gte Automatic Electric Laboratories Incorporated Printed circuit board protector
US4289563A (en) * 1977-12-23 1981-09-15 Wiechowski Joseph W Grating construction and assembly method and apparatus
US4280039A (en) * 1979-01-12 1981-07-21 Thomas P. Mahoney Apparatus for fabricating and welding core reinforced panel
FI802386A7 (en) * 1979-08-03 1981-01-01 National Res Development Clump handling device.
US4451319A (en) * 1981-09-21 1984-05-29 Haggar Company System for prefabricating pocket welts and facing strips
DE3149588C2 (en) * 1981-12-15 1983-10-27 Howaldtswerke-Deutsche Werft Ag Hamburg Und Kiel, 2300 Kiel Method and device for applying a coating to thin, rigid panels by means of application rollers
US4674670A (en) * 1984-08-13 1987-06-23 Hitachi, Ltd. Manufacturing apparatus
US5447665A (en) * 1986-03-31 1995-09-05 Nupipe, Inc. Method of removal of replacement pipe installed in an existing conduit
US4908153A (en) * 1988-05-06 1990-03-13 Service Tool Die & Mfg. Company Transport apparatus for electrocoating machines
US5038155A (en) * 1988-07-22 1991-08-06 Fuji Photo Film Co., Ltd. Recording apparatus
EP0432926B1 (en) * 1989-11-24 1996-04-24 Kabushiki Kaisha Toshiba Apparatus for printing data in a book, a notebook, or the like
US5238174A (en) 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
US5540153A (en) * 1995-06-13 1996-07-30 Philip Morris Incorporated Embosser and method using slot mounted die and impression pad
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5954842A (en) * 1996-01-26 1999-09-21 Micron Technology, Inc. Lead finger clamp assembly
US6030857A (en) * 1996-03-11 2000-02-29 Micron Technology, Inc. Method for application of spray adhesive to a leadframe for chip bonding
US6048750A (en) * 1997-11-24 2000-04-11 Micron Technology, Inc. Method for aligning and connecting semiconductor components to substrates
US6038119A (en) * 1998-09-21 2000-03-14 Atkins; Ian Paul Overvoltage protection device including wafer of varistor material
US6106365A (en) * 1998-11-06 2000-08-22 Seh America, Inc. Method and apparatus to control mounting pressure of semiconductor crystals
US6254521B1 (en) * 1999-05-14 2001-07-03 Amplas, Inc. Apparatus for manufacture of a plastic bag with standup bottom wall
US6547121B2 (en) * 2000-06-28 2003-04-15 Advanced Micro Devices, Inc. Mechanical clamper for heated substrates at die attach

Also Published As

Publication number Publication date
CN1439169A (en) 2003-08-27
WO2002001612A2 (en) 2002-01-03
US6547121B2 (en) 2003-04-15
JP2004513507A (en) 2004-04-30
TW503508B (en) 2002-09-21
EP1295313A2 (en) 2003-03-26
US20020106603A1 (en) 2002-08-08
KR20030011931A (en) 2003-02-11
WO2002001612A3 (en) 2002-06-06

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