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AU2001268630A1 - Systems for testing integraged circuits during burn-in - Google Patents

Systems for testing integraged circuits during burn-in

Info

Publication number
AU2001268630A1
AU2001268630A1 AU2001268630A AU6863001A AU2001268630A1 AU 2001268630 A1 AU2001268630 A1 AU 2001268630A1 AU 2001268630 A AU2001268630 A AU 2001268630A AU 6863001 A AU6863001 A AU 6863001A AU 2001268630 A1 AU2001268630 A1 AU 2001268630A1
Authority
AU
Australia
Prior art keywords
stress metal
springs
substrate
several embodiments
disclosed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001268630A
Inventor
Fu Chiung Chong
Sammy Mok
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NanoNexus Inc
Original Assignee
NanoNexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NanoNexus Inc filed Critical NanoNexus Inc
Publication of AU2001268630A1 publication Critical patent/AU2001268630A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P74/00—
    • H10W74/129—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • H10W72/00—
    • H10W72/20—
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H10W72/01331—
    • H10W72/07141—
    • H10W72/251—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Maintenance And Management Of Digital Transmission (AREA)

Abstract

Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.
AU2001268630A 2000-06-20 2001-06-20 Systems for testing integraged circuits during burn-in Abandoned AU2001268630A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US21292300P 2000-06-20 2000-06-20
US60/212,923 2000-06-20
US21372900P 2000-06-22 2000-06-22
US60/213,729 2000-06-22
PCT/US2001/019792 WO2001098793A2 (en) 2000-06-20 2001-06-20 Systems for testing integraged circuits during burn-in

Publications (1)

Publication Number Publication Date
AU2001268630A1 true AU2001268630A1 (en) 2002-01-02

Family

ID=26907616

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001268630A Abandoned AU2001268630A1 (en) 2000-06-20 2001-06-20 Systems for testing integraged circuits during burn-in

Country Status (8)

Country Link
US (1) US6791171B2 (en)
EP (1) EP1292834B1 (en)
JP (1) JP2004501517A (en)
KR (1) KR20020026585A (en)
AT (1) ATE311604T1 (en)
AU (1) AU2001268630A1 (en)
DE (1) DE60115437T2 (en)
WO (1) WO2001098793A2 (en)

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EP1292834B1 (en) 2005-11-30
WO2001098793A2 (en) 2001-12-27
DE60115437T2 (en) 2006-07-27
ATE311604T1 (en) 2005-12-15
WO2001098793A3 (en) 2002-07-25
KR20020026585A (en) 2002-04-10
US20020171133A1 (en) 2002-11-21
JP2004501517A (en) 2004-01-15
EP1292834A2 (en) 2003-03-19
DE60115437D1 (en) 2006-01-05

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