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AU2001268289A1 - Multi-layer microwave circuits and methods of manufacture - Google Patents

Multi-layer microwave circuits and methods of manufacture

Info

Publication number
AU2001268289A1
AU2001268289A1 AU2001268289A AU6828901A AU2001268289A1 AU 2001268289 A1 AU2001268289 A1 AU 2001268289A1 AU 2001268289 A AU2001268289 A AU 2001268289A AU 6828901 A AU6828901 A AU 6828901A AU 2001268289 A1 AU2001268289 A1 AU 2001268289A1
Authority
AU
Australia
Prior art keywords
manufacture
methods
microwave circuits
layer microwave
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001268289A
Inventor
Vasanth Munikoti
Madadevan Sridharan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Synergy Microwave Corp
Original Assignee
Synergy Microwave Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Synergy Microwave Corp filed Critical Synergy Microwave Corp
Publication of AU2001268289A1 publication Critical patent/AU2001268289A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09318—Core having one signal plane and one power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
AU2001268289A 2000-06-09 2001-06-08 Multi-layer microwave circuits and methods of manufacture Abandoned AU2001268289A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21072500P 2000-06-09 2000-06-09
US60210725 2000-06-09
PCT/US2001/018696 WO2001095425A1 (en) 2000-06-09 2001-06-08 Multi-layer microwave circuits and methods of manufacture

Publications (1)

Publication Number Publication Date
AU2001268289A1 true AU2001268289A1 (en) 2001-12-17

Family

ID=22784030

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001268289A Abandoned AU2001268289A1 (en) 2000-06-09 2001-06-08 Multi-layer microwave circuits and methods of manufacture

Country Status (4)

Country Link
US (1) US6525623B2 (en)
EP (1) EP1293009A4 (en)
AU (1) AU2001268289A1 (en)
WO (1) WO2001095425A1 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201439B1 (en) * 1997-09-17 2001-03-13 Matsushita Electric Industrial Co., Ltd. Power splitter/ combiner circuit, high power amplifier and balun circuit
US6743731B1 (en) * 2000-11-17 2004-06-01 Agere Systems Inc. Method for making a radio frequency component and component produced thereby
GB0108655D0 (en) * 2001-04-06 2001-05-30 Koninkl Philips Electronics Nv Microwave circuit
JP3900013B2 (en) * 2001-07-30 2007-04-04 株式会社村田製作所 Surface acoustic wave duplexer, communication device
US6819202B2 (en) * 2002-02-13 2004-11-16 Scientific Components Power splitter having counter rotating circuit lines
FI20020522A0 (en) 2002-03-19 2002-03-19 Nokia Corp Arrangements for administering the effect
US7061772B2 (en) * 2002-08-05 2006-06-13 Nec Tokin Corporation Electronic circuit with transmission line type noise filter
US6909346B1 (en) * 2003-04-18 2005-06-21 Lockheed Martin Corporation Switching arrangement using HDI interconnects and MEMS switches
US6917265B2 (en) * 2003-05-22 2005-07-12 Synergy Microwave Corporation Microwave frequency surface mount components and methods of forming same
US6967544B2 (en) * 2003-06-30 2005-11-22 Scientific Components Miniature LTCC 2-way power splitter
EP1631133B1 (en) * 2004-08-31 2024-06-12 Synergy Microwave Corporation Visually inspectable surface mount device pad
ATE519359T1 (en) 2005-06-15 2011-08-15 Bae Systems Plc TRANSMISSION LINE
US7755457B2 (en) * 2006-02-07 2010-07-13 Harris Corporation Stacked stripline circuits
TWI370708B (en) * 2006-10-20 2012-08-11 Ind Tech Res Inst Architecture of complement of a mirrored design of a embedded planar resistor
GB0706638D0 (en) * 2007-04-04 2007-05-16 Mbda Uk Ltd A high-dielectric material
CN101420818B (en) * 2007-10-25 2011-03-30 鸿富锦精密工业（深圳）有限公司 Differential Distribution Architecture
WO2009114731A2 (en) 2008-03-13 2009-09-17 Viasat, Inc. Multi-level power amplification system
US7982555B2 (en) * 2008-03-28 2011-07-19 Broadcom Corporation Method and system for processing signals via power splitters embedded in an integrated circuit package
US8559186B2 (en) * 2008-04-03 2013-10-15 Qualcomm, Incorporated Inductor with patterned ground plane
US20090295500A1 (en) * 2008-05-30 2009-12-03 Ives Fred H Radio frequency power splitter/combiner, and method of making same
WO2014058783A1 (en) * 2012-10-08 2014-04-17 Marki Microwave, Inc. Improved mixer fabrication technique and system using the same
CN104756313A (en) 2012-10-25 2015-07-01 瑞典爱立信有限公司 Power divider and method of fabricating the same
CN104412722B (en) * 2012-12-27 2018-05-22 京瓷株式会社 Circuit board, electronic device and light-emitting device
CN103050453B (en) * 2012-12-28 2015-04-15 成都泰格微电子研究所有限责任公司 Surface mount microwave device
KR102328312B1 (en) * 2015-01-15 2021-11-19 한국전자통신연구원 Optical module
WO2018151134A1 (en) * 2017-02-20 2018-08-23 株式会社村田製作所 Electronic device
US10320043B2 (en) 2017-05-23 2019-06-11 Nanning Fugui Precision Industrial Co., Ltd. Power distributing device
CN113873740B (en) * 2020-06-30 2026-01-02 昆山展腾电子科技有限公司 Transmission line structure
US20220238999A1 (en) * 2021-01-26 2022-07-28 Cypress Semiconductor Corporation Close-range communication systems for high-density wireless networks
KR102301731B1 (en) * 2021-04-18 2021-09-14 (주)이지템 System having Dual Band Bio-Matched Bow-tie Antennas to be used RF receiver module for detecting core body temperature
KR102283072B1 (en) * 2021-04-18 2021-07-29 (주)이지템 Dual Band Bio-Matched Half-Sphere type Antennas to be used RF receiver module for detecting core body temperature
CN217607020U (en) * 2022-01-10 2022-10-18 稜研科技股份有限公司 Antenna device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0812887B2 (en) * 1985-04-13 1996-02-07 富士通株式会社 High-speed integrated circuit package
US4821007A (en) 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US5150088A (en) 1991-03-27 1992-09-22 Hughes Aircraft Company Stripline shielding techniques in low temperature co-fired ceramic
US5311406A (en) * 1991-10-30 1994-05-10 Honeywell Inc. Microstrip printed wiring board and a method for making same
JPH07106815A (en) 1993-08-09 1995-04-21 Oki Electric Ind Co Ltd Strip line resonator
US5408053A (en) 1993-11-30 1995-04-18 Hughes Aircraft Company Layered planar transmission lines
US5471181A (en) 1994-03-08 1995-11-28 Hughes Missile Systems Company Interconnection between layers of striplines or microstrip through cavity backed slot
US5534830A (en) 1995-01-03 1996-07-09 R F Prime Corporation Thick film balanced line structure, and microwave baluns, resonators, mixers, splitters, and filters constructed therefrom
US5532643A (en) 1995-06-23 1996-07-02 Motorola, Inc. Manufacturably improved asymmetric stripline enhanced aperture coupler
US5930665A (en) 1995-09-06 1999-07-27 Itt Industries, Inc. Wide frequency band transition between via RF transmission lines and planar transmission lines
US5922453A (en) * 1997-02-06 1999-07-13 Rogers Corporation Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
US5929729A (en) * 1997-10-24 1999-07-27 Com Dev Limited Printed lumped element stripline circuit ground-signal-ground structure
US6023210A (en) 1998-03-03 2000-02-08 California Institute Of Technology Interlayer stripline transition
US6121854A (en) * 1999-04-19 2000-09-19 Digital Microwave Corporation Reduced size 2-way RF power divider incorporating a low pass filter structure
US6356166B1 (en) * 1999-08-26 2002-03-12 Metawave Communications Corporation Multi-layer switched line phase shifter

Also Published As

Publication number Publication date
WO2001095425A1 (en) 2001-12-13
EP1293009A1 (en) 2003-03-19
US20020008599A1 (en) 2002-01-24
EP1293009A4 (en) 2004-06-09
US6525623B2 (en) 2003-02-25

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