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AU2001266944A1 - Electronic package having embedded capacitors and method of fabrication therefor - Google Patents

Electronic package having embedded capacitors and method of fabrication therefor

Info

Publication number
AU2001266944A1
AU2001266944A1 AU2001266944A AU6694401A AU2001266944A1 AU 2001266944 A1 AU2001266944 A1 AU 2001266944A1 AU 2001266944 A AU2001266944 A AU 2001266944A AU 6694401 A AU6694401 A AU 6694401A AU 2001266944 A1 AU2001266944 A1 AU 2001266944A1
Authority
AU
Australia
Prior art keywords
capacitors
package
embedded
electronic package
embedded capacitors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001266944A
Inventor
David Figueroa
Aaron Hale
Toshimi Kohmura
Joan Vrtis
Michael Walk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of AU2001266944A1 publication Critical patent/AU2001266944A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W72/00—
    • H10W44/601—
    • H10W70/685—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

An electronic package (302, FIG. 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. 17-18) or ceramic capacitors. During the package build-up process, the capacitors are mounted (410, FIG. 4) to a package layer, and a non-conductive layer is applied (412) over the capacitors. When the build-up process is completed, the capacitor's terminals (604, 608, FIG. 6) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (1904, FIG. 19), an interposer (1906), and/or a printed circuit board (1908).
AU2001266944A 2000-06-29 2001-06-14 Electronic package having embedded capacitors and method of fabrication therefor Abandoned AU2001266944A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/606,882 US6407929B1 (en) 2000-06-29 2000-06-29 Electronic package having embedded capacitors and method of fabrication therefor
US09/606,882 2000-06-29
PCT/US2001/019225 WO2002003463A2 (en) 2000-06-29 2001-06-14 Electronic package having embedded capacitors and method of fabrication therefor

Publications (1)

Publication Number Publication Date
AU2001266944A1 true AU2001266944A1 (en) 2002-01-14

Family

ID=24429872

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001266944A Abandoned AU2001266944A1 (en) 2000-06-29 2001-06-14 Electronic package having embedded capacitors and method of fabrication therefor

Country Status (8)

Country Link
US (1) US6407929B1 (en)
EP (1) EP1360721B1 (en)
CN (1) CN1264214C (en)
AT (1) ATE441940T1 (en)
AU (1) AU2001266944A1 (en)
DE (1) DE60139809D1 (en)
MY (1) MY126682A (en)
WO (1) WO2002003463A2 (en)

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Also Published As

Publication number Publication date
WO2002003463A3 (en) 2003-09-04
EP1360721A2 (en) 2003-11-12
DE60139809D1 (en) 2009-10-15
WO2002003463A2 (en) 2002-01-10
ATE441940T1 (en) 2009-09-15
HK1058433A1 (en) 2004-05-14
MY126682A (en) 2006-10-31
EP1360721B1 (en) 2009-09-02
CN1264214C (en) 2006-07-12
US6407929B1 (en) 2002-06-18
CN1468448A (en) 2004-01-14

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