AU2001266311A1 - Ejection head for aggressive liquids manufactured by anodic bonding - Google Patents
Ejection head for aggressive liquids manufactured by anodic bondingInfo
- Publication number
- AU2001266311A1 AU2001266311A1 AU2001266311A AU6631101A AU2001266311A1 AU 2001266311 A1 AU2001266311 A1 AU 2001266311A1 AU 2001266311 A AU2001266311 A AU 2001266311A AU 6631101 A AU6631101 A AU 6631101A AU 2001266311 A1 AU2001266311 A1 AU 2001266311A1
- Authority
- AU
- Australia
- Prior art keywords
- ejection head
- substrate
- nozzle plate
- ejection
- ejecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M51/00—Fuel-injection apparatus characterised by being operated electrically
- F02M51/06—Injectors peculiar thereto with means directly operating the valve needle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M51/00—Fuel-injection apparatus characterised by being operated electrically
- F02M51/06—Injectors peculiar thereto with means directly operating the valve needle
- F02M51/0603—Injectors peculiar thereto with means directly operating the valve needle using piezoelectric or magnetostrictive operating means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M53/00—Fuel-injection apparatus characterised by having heating, cooling or thermally-insulating means
- F02M53/04—Injectors with heating, cooling, or thermally-insulating means
- F02M53/06—Injectors with heating, cooling, or thermally-insulating means with fuel-heating means, e.g. for vaporising
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02M—SUPPLYING COMBUSTION ENGINES IN GENERAL WITH COMBUSTIBLE MIXTURES OR CONSTITUENTS THEREOF
- F02M61/00—Fuel-injectors not provided for in groups F02M39/00 - F02M57/00 or F02M67/00
- F02M61/16—Details not provided for in, or of interest apart from, the apparatus of groups F02M61/02 - F02M61/14
- F02M61/18—Injection nozzles, e.g. having valve seats; Details of valve member seated ends, not otherwise provided for
- F02M61/1853—Orifice plates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
- Magnetic Heads (AREA)
Abstract
A method for manufacturing an ejection head ( 10 ) or ejector suitable for ejecting in the form of droplets ( 16 ) a liquid ( 14 ) conveyed inside the ejection head ( 10 ), comprising a step of producing, from a silicon wafer, a nozzle plate ( 12 ) having at least one ejection nozzle ( 13 ); a step of producing, from another silicon wafer, a substrate ( 11 ) having at least one actuator ( 15 ) for activating the ejection of the droplets of liquid through the nozzle ( 13 ); and a step of joining the nozzle plate ( 12 ) and the substrate ( 11 ) together to form the ejection head, wherein this joining step comprises the production of a junction ( 25 ), made by means of the anodic bonding technology, between the substrate ( 11 ) and the nozzle plate ( 12 ), in such a way that, in the area of this junction ( 25 ), the ejection head ( 10 ) does not present structural discontinuities, and also possesses a resistance to chemical corrosion by the liquid ( 14 ) contained in the ejection head ( 10 ) at least equal to that of the silicon constituting both the substrate ( 11 ) and the nozzle plate ( 12 ). The method of the invention may be applied for manufacturing an ink jet printhead ( 110 ), having one or more nozzles ( 113 a , 113 b, etc.), which has the advantage, with respect to the known printheads, of also being suitable for working with special inks characterized by high level chemical aggressiveness. In general, the ejection head of the invention, thanks to its structure which is globally highly robust and also chemically inert in the area of the junction ( 25 ), can be used advantageously with various types of liquids, even with marked chemical aggressiveness, in different sectors of the art, for example for ejecting paints on various types of media, generally not paper, in the industrial marking sector; or for ejecting in a controlled way droplets of fuel, such as petrol, in an internal combustion engine.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2000TO000494A IT1320381B1 (en) | 2000-05-29 | 2000-05-29 | METHOD FOR THE MANUFACTURE OF AN EJECTION HEAD OF DILQUID DROPS, PARTICULARLY SUITABLE FOR OPERATING WITH CHEMICALLY LIQUIDS |
| ITTO200A000494 | 2000-05-29 | ||
| PCT/IT2001/000266 WO2001092715A1 (en) | 2000-05-29 | 2001-05-25 | Ejection head for aggressive liquids manufactured by anodic bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001266311A1 true AU2001266311A1 (en) | 2001-12-11 |
Family
ID=11457761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001266311A Abandoned AU2001266311A1 (en) | 2000-05-29 | 2001-05-25 | Ejection head for aggressive liquids manufactured by anodic bonding |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6780340B2 (en) |
| EP (1) | EP1290336B1 (en) |
| AT (1) | ATE255204T1 (en) |
| AU (1) | AU2001266311A1 (en) |
| DE (1) | DE60101336T2 (en) |
| ES (1) | ES2211813T3 (en) |
| IT (1) | IT1320381B1 (en) |
| WO (1) | WO2001092715A1 (en) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT1320381B1 (en) * | 2000-05-29 | 2003-11-26 | Olivetti Lexikon Spa | METHOD FOR THE MANUFACTURE OF AN EJECTION HEAD OF DILQUID DROPS, PARTICULARLY SUITABLE FOR OPERATING WITH CHEMICALLY LIQUIDS |
| SG126682A1 (en) * | 2000-08-09 | 2006-11-29 | Sony Corp | Print head, manufacturing method therefor, and printer |
| NL1016030C1 (en) * | 2000-08-28 | 2002-03-01 | Aquamarijn Holding B V | Spraying device with a nozzle plate, a nozzle plate, as well as methods for manufacturing and applying such a nozzle plate. |
| KR100436760B1 (en) * | 2001-12-20 | 2004-06-23 | 삼성전자주식회사 | Head of ink jet printer and method for manufacturing head of ink jet printer |
| US6729306B2 (en) * | 2002-02-26 | 2004-05-04 | Hewlett-Packard Development Company, L.P. | Micro-pump and fuel injector for combustible liquids |
| US6962402B2 (en) * | 2002-12-02 | 2005-11-08 | Silverbrook Research Pty Ltd | Inkjet printhead with ink supply passage formed from both sides of the wafer by overlapping etches |
| ITTO20020375A1 (en) * | 2002-05-07 | 2003-11-07 | Fiat Ricerche | ,, ELECTRICITY MICROGENERATOR ,, |
| JP2004009127A (en) * | 2002-06-11 | 2004-01-15 | Senju Metal Ind Co Ltd | Jet soldering bath |
| US7052117B2 (en) | 2002-07-03 | 2006-05-30 | Dimatix, Inc. | Printhead having a thin pre-fired piezoelectric layer |
| US6782869B2 (en) | 2002-08-30 | 2004-08-31 | Hewlett-Packard Development Company, L.P. | Fuel delivery system and method |
| US6786194B2 (en) * | 2002-10-31 | 2004-09-07 | Hewlett-Packard Development Company, L.P. | Variable fuel delivery system and method |
| US7281778B2 (en) | 2004-03-15 | 2007-10-16 | Fujifilm Dimatix, Inc. | High frequency droplet ejection device and method |
| US8491076B2 (en) | 2004-03-15 | 2013-07-23 | Fujifilm Dimatix, Inc. | Fluid droplet ejection devices and methods |
| JP4337723B2 (en) * | 2004-12-08 | 2009-09-30 | セイコーエプソン株式会社 | Droplet discharge head manufacturing method, droplet discharge head, and droplet discharge apparatus |
| CN101094770B (en) | 2004-12-30 | 2010-04-14 | 富士胶卷迪马蒂克斯股份有限公司 | inkjet printing |
| US7586888B2 (en) | 2005-02-17 | 2009-09-08 | Mobitrum Corporation | Method and system for mesh network embedded devices |
| US7630736B2 (en) | 2005-10-11 | 2009-12-08 | Mobitrum Corporation | Method and system for spatial data input, manipulation and distribution via an adaptive wireless transceiver |
| JP4816070B2 (en) * | 2005-12-27 | 2011-11-16 | ブラザー工業株式会社 | Inkjet head manufacturing method |
| JP2007317747A (en) * | 2006-05-23 | 2007-12-06 | Seiko Epson Corp | Substrate dividing method and liquid jet head manufacturing method |
| US7801058B2 (en) | 2006-07-27 | 2010-09-21 | Mobitrum Corporation | Method and system for dynamic information exchange on mesh network devices |
| US8427979B1 (en) | 2006-07-27 | 2013-04-23 | Mobitrum Corporation | Method and system for dynamic information exchange on location aware mesh network devices |
| US8411590B2 (en) | 2006-07-27 | 2013-04-02 | Mobitrum Corporation | Mesh network remote control device |
| US8305935B2 (en) | 2006-07-27 | 2012-11-06 | Mobitrum Corporation | Method and system for dynamic information exchange on location aware mesh network devices |
| US8305936B2 (en) | 2006-07-27 | 2012-11-06 | Mobitrum Corporation | Method and system for dynamic information exchange on a mesh network in a vehicle |
| USRE47894E1 (en) | 2006-07-27 | 2020-03-03 | Iii Holdings 2, Llc | Method and system for dynamic information exchange on location aware mesh network devices |
| JP4306717B2 (en) * | 2006-11-09 | 2009-08-05 | セイコーエプソン株式会社 | Method for manufacturing silicon device and method for manufacturing liquid jet head |
| US7988247B2 (en) | 2007-01-11 | 2011-08-02 | Fujifilm Dimatix, Inc. | Ejection of drops having variable drop size from an ink jet printer |
| US7766462B2 (en) * | 2007-02-21 | 2010-08-03 | Hewlett-Packard Development Company, L.P. | Method for forming a fluid ejection device |
| US7828417B2 (en) * | 2007-04-23 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Microfluidic device and a fluid ejection device incorporating the same |
| US8206451B2 (en) * | 2008-06-30 | 2012-06-26 | Depuy Products, Inc. | Posterior stabilized orthopaedic prosthesis |
| JP6011002B2 (en) * | 2012-04-23 | 2016-10-19 | セイコーエプソン株式会社 | Manufacturing method of liquid ejecting head and manufacturing method of liquid ejecting apparatus |
| WO2015038687A1 (en) * | 2013-09-11 | 2015-03-19 | Halliburton Energy Services, Inc. | Anodic bonding of thermally stable polycrystalline materials to substrate |
| JP7071179B2 (en) * | 2017-04-25 | 2022-05-18 | キヤノン株式会社 | Manufacturing method of liquid discharge head |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1138401A (en) * | 1965-05-06 | 1969-01-01 | Mallory & Co Inc P R | Bonding |
| JPH07112939B2 (en) * | 1988-11-21 | 1995-12-06 | 三菱電機株式会社 | Anodic bonding method of silicon wafer and glass substrate |
| DE4133897C2 (en) * | 1991-10-10 | 2002-08-29 | Siemens Ag | Method of joining two panels |
| DE4219132A1 (en) * | 1992-06-11 | 1993-12-16 | Suess Kg Karl | Bonded silicon@ wafer-glass or silicon@-silicon@ joint prodn. - comprises using laser light radiation to initially fix materials at spot(s) and/or lines and conventional high temp. bonding for pressure and acceleration sensors or micro-system elements |
| GB9400036D0 (en) * | 1994-01-04 | 1994-03-02 | Xaar Ltd | Manufacture of ink jet printheads |
| US5437255A (en) * | 1994-03-15 | 1995-08-01 | Sadley; Mark L. | Fuel injection sytem employing solid-state injectors for liquid fueled combustion engines |
| JP3640089B2 (en) * | 1995-03-17 | 2005-04-20 | リコープリンティングシステムズ株式会社 | Pipette manufacturing method |
| SE9502251D0 (en) | 1995-06-21 | 1995-06-21 | Pharmacia Ab | Flow-through sampling cell and use thereof |
| FR2742811B1 (en) * | 1995-12-22 | 1998-01-30 | Inst Francais Du Petrole | METHOD AND DEVICE FOR CONTROLLING THE INJECTION OF A FUEL MIXTURE INTO THE INTAKE OF AN INTERNAL COMBUSTION ENGINE |
| US5948512A (en) * | 1996-02-22 | 1999-09-07 | Seiko Epson Corporation | Ink jet recording ink and recording method |
| US6039439A (en) * | 1998-06-19 | 2000-03-21 | Lexmark International, Inc. | Ink jet heater chip module |
| ITTO980592A1 (en) * | 1998-07-06 | 2000-01-06 | Olivetti Lexikon Spa | INKJET PRINTING HEAD WITH LARGE SILICON PLATE AND RELATED MANUFACTURING PROCESS |
| DE19831335A1 (en) * | 1998-07-13 | 2000-02-10 | Michael Angermann | Appts to produce micro droplets of molten conductive metals uses a magneto-hydrodynamic pump with modulation to give a clean and controlled droplet ejection |
| RU2143343C1 (en) * | 1998-11-03 | 1999-12-27 | Самсунг Электроникс Ко., Лтд. | Microinjector and microinjector manufacture method |
| US6422684B1 (en) * | 1999-12-10 | 2002-07-23 | Sensant Corporation | Resonant cavity droplet ejector with localized ultrasonic excitation and method of making same |
| IT1320381B1 (en) | 2000-05-29 | 2003-11-26 | Olivetti Lexikon Spa | METHOD FOR THE MANUFACTURE OF AN EJECTION HEAD OF DILQUID DROPS, PARTICULARLY SUITABLE FOR OPERATING WITH CHEMICALLY LIQUIDS |
-
2000
- 2000-05-29 IT IT2000TO000494A patent/IT1320381B1/en active
-
2001
- 2001-05-25 AT AT01943783T patent/ATE255204T1/en not_active IP Right Cessation
- 2001-05-25 EP EP01943783A patent/EP1290336B1/en not_active Expired - Lifetime
- 2001-05-25 ES ES01943783T patent/ES2211813T3/en not_active Expired - Lifetime
- 2001-05-25 AU AU2001266311A patent/AU2001266311A1/en not_active Abandoned
- 2001-05-25 DE DE60101336T patent/DE60101336T2/en not_active Expired - Lifetime
- 2001-05-25 US US10/296,629 patent/US6780340B2/en not_active Expired - Lifetime
- 2001-05-25 WO PCT/IT2001/000266 patent/WO2001092715A1/en not_active Ceased
-
2004
- 2004-04-27 US US10/832,359 patent/US6988791B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1290336B1 (en) | 2003-11-26 |
| ITTO20000494A0 (en) | 2000-05-29 |
| ITTO20000494A1 (en) | 2001-11-29 |
| DE60101336T2 (en) | 2004-09-09 |
| DE60101336D1 (en) | 2004-01-08 |
| US20040207697A1 (en) | 2004-10-21 |
| EP1290336A1 (en) | 2003-03-12 |
| US20030131475A1 (en) | 2003-07-17 |
| ES2211813T3 (en) | 2004-07-16 |
| WO2001092715A1 (en) | 2001-12-06 |
| IT1320381B1 (en) | 2003-11-26 |
| US6988791B2 (en) | 2006-01-24 |
| US6780340B2 (en) | 2004-08-24 |
| ATE255204T1 (en) | 2003-12-15 |
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