AU2001259796A1 - Over-voltage protection for electronic circuits - Google Patents
Over-voltage protection for electronic circuitsInfo
- Publication number
- AU2001259796A1 AU2001259796A1 AU2001259796A AU5979601A AU2001259796A1 AU 2001259796 A1 AU2001259796 A1 AU 2001259796A1 AU 2001259796 A AU2001259796 A AU 2001259796A AU 5979601 A AU5979601 A AU 5979601A AU 2001259796 A1 AU2001259796 A1 AU 2001259796A1
- Authority
- AU
- Australia
- Prior art keywords
- over
- electronic circuits
- voltage protection
- voltage
- protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01T—SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
- H01T4/00—Overvoltage arresters using spark gaps
- H01T4/08—Overvoltage arresters using spark gaps structurally associated with protected apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/026—Spark gaps
-
- H10W42/60—
-
- H10W42/80—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0257—Overvoltage protection
- H05K1/0259—Electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H10W90/724—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09548904 | 2000-04-13 | ||
| US09/548,904 US6373719B1 (en) | 2000-04-13 | 2000-04-13 | Over-voltage protection for electronic circuits |
| PCT/US2001/040508 WO2001080387A2 (en) | 2000-04-13 | 2001-04-11 | Over-voltage protection for electronic circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001259796A1 true AU2001259796A1 (en) | 2001-10-30 |
Family
ID=24190859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001259796A Abandoned AU2001259796A1 (en) | 2000-04-13 | 2001-04-11 | Over-voltage protection for electronic circuits |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US6373719B1 (en) |
| AU (1) | AU2001259796A1 (en) |
| WO (1) | WO2001080387A2 (en) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7695644B2 (en) * | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
| US7446030B2 (en) | 1999-08-27 | 2008-11-04 | Shocking Technologies, Inc. | Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| US20100044080A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
| US20080035370A1 (en) * | 1999-08-27 | 2008-02-14 | Lex Kosowsky | Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material |
| US20100044079A1 (en) * | 1999-08-27 | 2010-02-25 | Lex Kosowsky | Metal Deposition |
| US7825491B2 (en) * | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
| WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
| WO2003088356A1 (en) | 2002-04-08 | 2003-10-23 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
| US6981319B2 (en) * | 2003-02-13 | 2006-01-03 | Shrier Karen P | Method of manufacturing devices to protect election components |
| EP1494284A1 (en) * | 2003-06-30 | 2005-01-05 | Freescale Semiconductor, Inc. | Overvoltage protection device |
| US20050087877A1 (en) * | 2003-10-22 | 2005-04-28 | Dong-Ho Han | Differential signal traces coupled with high permittivity material |
| US7218492B2 (en) * | 2004-09-17 | 2007-05-15 | Electronic Polymers, Inc. | Devices and systems for electrostatic discharge suppression |
| JP5241238B2 (en) * | 2005-02-16 | 2013-07-17 | サンミナ−エスシーアイ コーポレーション | Substantially continuous layers of embedded transient protection for printed circuit boards |
| US9781830B2 (en) | 2005-03-04 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
| TWI389205B (en) * | 2005-03-04 | 2013-03-11 | Sanmina Sci Corp | Partitioning a via structure using plating resist |
| US7567416B2 (en) * | 2005-07-21 | 2009-07-28 | Cooper Technologies Company | Transient voltage protection device, material, and manufacturing methods |
| US20100263200A1 (en) * | 2005-11-22 | 2010-10-21 | Lex Kosowsky | Wireless communication device using voltage switchable dielectric material |
| EP1969627A4 (en) * | 2005-11-22 | 2010-01-20 | Shocking Technologies Inc | SEMICONDUCTOR DEVICES COMPRISING VOLTAGE SWITCHING MATERIALS PROVIDING OVERVOLTAGE PROTECTION |
| US20080032049A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having high aspect ratio particles |
| US7968010B2 (en) * | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
| US20080029405A1 (en) * | 2006-07-29 | 2008-02-07 | Lex Kosowsky | Voltage switchable dielectric material having conductive or semi-conductive organic material |
| KR20090055017A (en) * | 2006-09-24 | 2009-06-01 | 쇼킹 테크놀로지스 인코포레이티드 | Compositions for voltage-tunable dielectric materials with step voltage response and methods for making same |
| US20120119168A9 (en) * | 2006-11-21 | 2012-05-17 | Robert Fleming | Voltage switchable dielectric materials with low band gap polymer binder or composite |
| US7465882B2 (en) * | 2006-12-13 | 2008-12-16 | International Business Machines Corporation | Ceramic substrate grid structure for the creation of virtual coax arrangement |
| US7793236B2 (en) * | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
| US8206614B2 (en) * | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
| TWI378960B (en) * | 2008-03-20 | 2012-12-11 | Ind Tech Res Inst | Organic/inorganic hybrid material of dielectric composition with electrostatic discharge protection property |
| US8203421B2 (en) * | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
| US7946863B2 (en) * | 2008-04-25 | 2011-05-24 | Adc Telecommunications, Inc. | Circuit protection block |
| US20100047535A1 (en) * | 2008-08-22 | 2010-02-25 | Lex Kosowsky | Core layer structure having voltage switchable dielectric material |
| US20100065785A1 (en) * | 2008-09-17 | 2010-03-18 | Lex Kosowsky | Voltage switchable dielectric material containing boron compound |
| US9208930B2 (en) * | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductive core shelled particles |
| US9208931B2 (en) * | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
| US8362871B2 (en) * | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
| US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
| US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
| WO2010110909A1 (en) | 2009-03-26 | 2010-09-30 | Shocking Technologies, Inc. | Components having voltage switchable dielectric materials |
| US9053844B2 (en) * | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
| US20110198544A1 (en) * | 2010-02-18 | 2011-08-18 | Lex Kosowsky | EMI Voltage Switchable Dielectric Materials Having Nanophase Materials |
| US9224728B2 (en) * | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
| US9320135B2 (en) * | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
| US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
| CN113257793B (en) * | 2021-04-08 | 2022-09-06 | 武汉芯宝科技有限公司 | Full antistatic base of integrated circuit |
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| US3648364A (en) | 1970-04-30 | 1972-03-14 | Hokuriku Elect Ind | Method of making a printed resistor |
| US3685026A (en) | 1970-08-20 | 1972-08-15 | Matsushita Electric Industrial Co Ltd | Process of switching an electric current |
| US4103274A (en) | 1976-09-13 | 1978-07-25 | General Electric Company | Reconstituted metal oxide varistor |
| US4298416A (en) | 1976-12-08 | 1981-11-03 | Huron Chemicals Limited | Protection of substrates against corrosion |
| US4486738A (en) | 1982-02-16 | 1984-12-04 | General Electric Ceramics, Inc. | High reliability electrical components |
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| CA1204213A (en) * | 1982-09-09 | 1986-05-06 | Masahiro Takeda | Memory card having static electricity protection |
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| BR8601387A (en) | 1985-03-29 | 1986-12-02 | Raychem Ltd | DEVICE TO PROTECT AN ELECTRIC CIRCUIT, ELECTRIC CIRCUIT, ELECTRIC COMPONENT AND USE OF AN AMORPUS COMPOSITION |
| US4729752A (en) | 1985-07-26 | 1988-03-08 | Amp Incorporated | Transient suppression device |
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| US5130881A (en) | 1988-01-11 | 1992-07-14 | The United States Of Americas As Represented By The Secretary Of The Air Force | IC socket having overvoltage protection |
| US5008770A (en) | 1990-02-20 | 1991-04-16 | The United States Of America As Represented By The Secretary Of The Air Force | Filter pin integrated circuit socket kit |
| US5089929A (en) | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
| US5099380A (en) | 1990-04-19 | 1992-03-24 | Electromer Corporation | Electrical connector with overvoltage protection feature |
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| US5260848A (en) | 1990-07-27 | 1993-11-09 | Electromer Corporation | Foldback switching material and devices |
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| US5189387A (en) | 1991-07-11 | 1993-02-23 | Electromer Corporation | Surface mount device with foldback switching overvoltage protection feature |
| JP2581348B2 (en) | 1991-07-29 | 1997-02-12 | 日立化成工業株式会社 | Manufacturing method of chip type fuse |
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| EP0589560B1 (en) | 1992-09-23 | 1997-10-22 | The Whitaker Corporation | Electrical overstress protection apparatus |
| US5393597A (en) | 1992-09-23 | 1995-02-28 | The Whitaker Corporation | Overvoltage protection element |
| US5262754A (en) | 1992-09-23 | 1993-11-16 | Electromer Corporation | Overvoltage protection element |
| US5340641A (en) | 1993-02-01 | 1994-08-23 | Antai Xu | Electrical overstress pulse protection |
| EP0770260B1 (en) * | 1994-07-14 | 2003-02-19 | Surgx Corporation | Variable voltage protection structures and methods for making same |
| US6178339B1 (en) * | 1995-04-11 | 2001-01-23 | Matsushita Electric Industrial Co., Ltd. | Wireless communication filter operating at low temperature |
| US5674083A (en) | 1995-11-22 | 1997-10-07 | The Whitaker Corporation | ESD protected electrical connector |
| US5796570A (en) | 1996-09-19 | 1998-08-18 | National Semiconductor Corporation | Electrostatic discharge protection package |
-
2000
- 2000-04-13 US US09/548,904 patent/US6373719B1/en not_active Expired - Lifetime
-
2001
- 2001-04-11 WO PCT/US2001/040508 patent/WO2001080387A2/en not_active Ceased
- 2001-04-11 AU AU2001259796A patent/AU2001259796A1/en not_active Abandoned
- 2001-12-13 US US10/013,952 patent/US6570765B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001080387A3 (en) | 2002-02-28 |
| WO2001080387A2 (en) | 2001-10-25 |
| US20020070838A1 (en) | 2002-06-13 |
| US6570765B2 (en) | 2003-05-27 |
| US6373719B1 (en) | 2002-04-16 |
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