AU2001253351A1 - Rheology-controlled epoxy-based compositions - Google Patents

Rheology-controlled epoxy-based compositions

Info

Publication number: AU2001253351A1
Authority: AU; Australia
Prior art keywords: rheology; based compositions; controlled epoxy; epoxy; controlled
Prior art date: 2000-04-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001253351A

Inventor

Kyra M. Kozak

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Henkel Loctite Corp

Original Assignee

Henkel Loctite Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-04-21

Filing date

2001-04-23

Publication date

2001-11-12

2001-04-23 Application filed by Henkel Loctite Corp filed Critical Henkel Loctite Corp

2001-11-12 Publication of AU2001253351A1 publication Critical patent/AU2001253351A1/en

Status Abandoned legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- H10W72/30—
- H10W74/012—
- H10W74/15—
- H10W74/47—
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/03—Specific materials used
- H10W72/07251—
- H10W72/073—
- H10W72/20—
- H10W72/856—
- H10W90/724—
- H10W90/734—

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Adhesives Or Adhesive Processes (AREA)
Epoxy Resins (AREA)
Compositions Of Macromolecular Compounds (AREA)
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

AU2001253351A 2000-04-21 2001-04-23 Rheology-controlled epoxy-based compositions Abandoned AU2001253351A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US19874400P	2000-04-21	2000-04-21
US60198744		2000-04-21
PCT/US2001/011727 WO2001083607A1 (en)	2000-04-21	2001-04-23	Rheology-controlled epoxy-based compositions

Publications (1)

Publication Number	Publication Date
AU2001253351A1 true AU2001253351A1 (en)	2001-11-12

Family

ID=22734625

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001253351A Abandoned AU2001253351A1 (en)	2000-04-21	2001-04-23	Rheology-controlled epoxy-based compositions

Country Status (5)

Country	Link
EP (1)	EP1282660A4 (en)
JP (1)	JP2003531941A (en)
KR (1)	KR20020091224A (en)
AU (1)	AU2001253351A1 (en)
WO (1)	WO2001083607A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6943058B2 (en)	2003-03-18	2005-09-13	Delphi Technologies, Inc.	No-flow underfill process and material therefor
JP5114111B2 (en) *	2006-09-07	2013-01-09	日東シンコー株式会社	Resin composition, heat conductive sheet, high heat conductive adhesive sheet with metal foil, and high heat conductive adhesive sheet with metal plate
US9480164B2 (en)	2011-05-31	2016-10-25	Mitsubishi Gas Chemical Company, Inc.	Resin composition, prepreg, and laminate
JP5958799B2 (en) *	2012-03-08	2016-08-02	パナソニックＩｐマネジメント株式会社	Liquid epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
CN104837922B (en) *	2012-11-28	2019-05-10	三菱瓦斯化学株式会社	Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3532653A (en) *	1969-02-27	1970-10-06	United States Steel Corp	Epoxy adhesive compositions containing amine hardener and tertiar y amine catalyst
US3849187A (en) *	1970-03-08	1974-11-19	Dexter Corp	Encapsulant compositions for semiconductors
US4248920A (en) *	1978-04-26	1981-02-03	Tokyo Shibaura Denki Kabushiki Kaisha	Resin-sealed semiconductor device
US5476884A (en) *	1989-02-20	1995-12-19	Toray Industries, Inc.	Semiconductor device-encapsulating epoxy resin composition containing secondary amino functional coupling agents
US5013383A (en) *	1989-07-11	1991-05-07	Hewlett-Packard Company	Epoxy adhesive for use with thermal ink-jet printers
US5346743A (en) *	1992-03-13	1994-09-13	Kabushiki Kaisha Toshiba	Resin encapsulation type semiconductor device
GB2291426B (en) *	1994-07-19	1998-05-06	Sumitomo Chemical Co	Epoxy resin composition process for producing the same and resin-sealed semiconductor device
JP3576684B2 (en) *	1995-03-03	2004-10-13	キヤノン株式会社	Ink jet head and ink jet device
JP3435250B2 (en) *	1995-03-20	2003-08-11	コニシ株式会社	Adhesive composition
US5908881A (en) *	1996-11-29	1999-06-01	Sumitomo Bakelite Company Limited	Heat-conductive paste
US6180696B1 (en) *	1997-02-19	2001-01-30	Georgia Tech Research Corporation	No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
JP3851441B2 (en) *	1998-04-23	2006-11-29	日東電工株式会社	Epoxy resin composition for optical semiconductor element sealing and optical semiconductor device
CA2331790A1 (en) *	1999-03-23	2000-09-28	Loctite Corporation	Reworkable thermosetting resin compositions

2001
- 2001-04-23 AU AU2001253351A patent/AU2001253351A1/en not_active Abandoned
- 2001-04-23 WO PCT/US2001/011727 patent/WO2001083607A1/en not_active Ceased
- 2001-04-23 JP JP2001580224A patent/JP2003531941A/en active Pending
- 2001-04-23 KR KR1020027014071A patent/KR20020091224A/en not_active Withdrawn
- 2001-04-23 EP EP01926841A patent/EP1282660A4/en not_active Withdrawn

Also Published As

Publication number	Publication date
KR20020091224A (en)	2002-12-05
JP2003531941A (en)	2003-10-28
EP1282660A4 (en)	2003-06-18
EP1282660A1 (en)	2003-02-12
WO2001083607A1 (en)	2001-11-08

Publication	Publication Date	Title
AU2001233691A1 (en)	2001-07-24	Antiperspirant compositions
AU2002218751A1 (en)	2002-01-21	Stable radiopharmaceutical compositions
AU2001281887A1 (en)	2002-01-14	Enamel composition
AU2001266345A1 (en)	2002-04-11	Five-membered-ring compound
AUPQ875700A0 (en)	2000-08-03	Combination compositions
AU2001285790A1 (en)	2002-01-21	Antiperspirant compositions
AU2002231641A1 (en)	2002-06-18	Polycarbonate compositions
AU2001274593A1 (en)	2002-01-08	Cold-setting composition
AU2001241098A1 (en)	2001-10-08	Composition
AU2681500A (en)	2000-09-14	Rapidly-soluble compositions
AU2002236455A1 (en)	2002-05-27	Synergistic ecta compositions
AU2002210433A1 (en)	2002-02-05	Dental compositions
AU2001270235A1 (en)	2002-01-14	Oral compositions
AU5085300A (en)	2001-03-05	Compositions
AU2001275201A1 (en)	2001-12-11	Acne-treating composition
AU2001235764A1 (en)	2001-09-03	Compositions
AU2001290669A1 (en)	2002-03-26	Oral compositions
AU2001287852A1 (en)	2002-03-26	Composition
AU2002211005A1 (en)	2002-05-21	Lipid peroxide-lowering compositions
AU2001253351A1 (en)	2001-11-12	Rheology-controlled epoxy-based compositions
AU2001223721A1 (en)	2001-07-24	Dental compositions
AU2002221703A1 (en)	2002-05-06	Dish-washing compositions
AU2001287732A1 (en)	2002-04-08	Copolycarbonate-based composition
AU2000275584A1 (en)	2001-08-07	Anticancer compositions
AU2001262163A1 (en)	2002-04-22	Composition