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AU2001249578A1 - Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester - Google Patents

Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester

Info

Publication number
AU2001249578A1
AU2001249578A1 AU2001249578A AU4957801A AU2001249578A1 AU 2001249578 A1 AU2001249578 A1 AU 2001249578A1 AU 2001249578 A AU2001249578 A AU 2001249578A AU 4957801 A AU4957801 A AU 4957801A AU 2001249578 A1 AU2001249578 A1 AU 2001249578A1
Authority
AU
Australia
Prior art keywords
wafer
integrated circuit
signal paths
testing signal
tester
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249578A
Inventor
Benjamin N Eldridge
Ralph G. Whitten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/548,885 external-priority patent/US6724209B1/en
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of AU2001249578A1 publication Critical patent/AU2001249578A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/3167—Testing of combined analog and digital circuits
    • H10P74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
AU2001249578A 2000-04-13 2001-03-27 Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester Abandoned AU2001249578A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/548,885 US6724209B1 (en) 2000-04-13 2000-04-13 Method for testing signal paths between an integrated circuit wafer and a wafer tester
US09548885 2000-04-13
US09568460 2000-05-09
US09/568,460 US6476630B1 (en) 2000-04-13 2000-05-09 Method for testing signal paths between an integrated circuit wafer and a wafer tester
PCT/US2001/010030 WO2001079863A2 (en) 2000-04-13 2001-03-27 Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester

Publications (1)

Publication Number Publication Date
AU2001249578A1 true AU2001249578A1 (en) 2001-10-30

Family

ID=27068958

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249578A Abandoned AU2001249578A1 (en) 2000-04-13 2001-03-27 Method and apparatus for testing signal paths between an integrated circuit wafer and a wafer tester

Country Status (8)

Country Link
US (1) US6476630B1 (en)
EP (1) EP1275010A2 (en)
JP (1) JP2003531481A (en)
KR (1) KR100752448B1 (en)
CN (1) CN1186643C (en)
AU (1) AU2001249578A1 (en)
TW (1) TW495897B (en)
WO (1) WO2001079863A2 (en)

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US7595629B2 (en) * 2004-07-09 2009-09-29 Formfactor, Inc. Method and apparatus for calibrating and/or deskewing communications channels
JP2008512680A (en) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド Double-sided probing structure
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US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7594149B2 (en) * 2005-02-22 2009-09-22 Integrated Device Technology, Inc. In-situ monitor of process and device parameters in integrated circuits
US7583087B2 (en) * 2005-02-22 2009-09-01 Integrated Device Technology, Inc. In-situ monitor of process and device parameters in integrated circuits
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US7474114B2 (en) * 2005-09-08 2009-01-06 Sitronic Corporation System and method for characterizing silicon wafers
DE202007018733U1 (en) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Transducer for differential signals with integrated balun
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN101393243B (en) * 2007-09-18 2011-02-16 京元电子股份有限公司 Test system and method with self-test function
US8073996B2 (en) * 2008-01-09 2011-12-06 Synopsys, Inc. Programmable modular circuit for testing and controlling a system-on-a-chip integrated circuit, and applications thereof
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
CN101770967A (en) * 2009-01-03 2010-07-07 上海芯豪微电子有限公司 Test method, device and system of common substrate integrated circuit
JP5202401B2 (en) * 2009-03-16 2013-06-05 株式会社アドバンテスト Test apparatus and calibration method
DE202012002391U1 (en) * 2012-03-08 2013-06-10 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Device for measuring electronic components
CN107340466B (en) * 2016-04-28 2019-11-01 中芯国际集成电路制造(上海)有限公司 Analog signal detection system and analog signal detection method
US10295588B2 (en) * 2016-12-22 2019-05-21 Xcelsis Corporation Wafer testing without direct probing
DE112018001207T5 (en) * 2017-03-07 2019-11-21 Semiconductor Energy Laboratory Co., Ltd. IC, driver IC, display system and electronic device
CN107192940A (en) * 2017-04-27 2017-09-22 中国石油天然气股份有限公司 A device for detecting the working state of a circuit board
DE102018217406B4 (en) * 2018-06-18 2020-07-23 ATEip GmbH Method and device for electrically testing an electrical assembly
WO2020048381A1 (en) 2018-09-03 2020-03-12 Changxin Memory Technologies, Inc. Chip test device and method
CN110907796B (en) * 2018-09-14 2022-02-08 长鑫存储技术有限公司 Integrated circuit measurement result imaging analysis method and system
CN110954804B (en) * 2019-12-19 2021-11-02 上海御渡半导体科技有限公司 Device and method for accurately diagnosing cBit array faults in batch
CN113687219B (en) * 2021-09-15 2025-03-07 上海华岭集成电路技术股份有限公司 Online detection method of test board

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Also Published As

Publication number Publication date
WO2001079863A2 (en) 2001-10-25
CN1436307A (en) 2003-08-13
US6476630B1 (en) 2002-11-05
JP2003531481A (en) 2003-10-21
KR100752448B1 (en) 2007-08-27
WO2001079863A3 (en) 2002-05-16
KR20030001420A (en) 2003-01-06
EP1275010A2 (en) 2003-01-15
CN1186643C (en) 2005-01-26
TW495897B (en) 2002-07-21

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