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AU2001249419A1 - Fabrication and controlled release of structures using etch-stop trenches - Google Patents

Fabrication and controlled release of structures using etch-stop trenches

Info

Publication number
AU2001249419A1
AU2001249419A1 AU2001249419A AU4941901A AU2001249419A1 AU 2001249419 A1 AU2001249419 A1 AU 2001249419A1 AU 2001249419 A AU2001249419 A AU 2001249419A AU 4941901 A AU4941901 A AU 4941901A AU 2001249419 A1 AU2001249419 A1 AU 2001249419A1
Authority
AU
Australia
Prior art keywords
etch
fabrication
structures
controlled release
stop trenches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249419A
Inventor
Behrang Behin
Michael J. Daneman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onix Microsystems Inc
Original Assignee
Onix Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onix Microsystems Inc filed Critical Onix Microsystems Inc
Publication of AU2001249419A1 publication Critical patent/AU2001249419A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00563—Avoid or control over-etching
    • B81C1/00571—Avoid or control under-cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
AU2001249419A 2000-03-24 2001-03-23 Fabrication and controlled release of structures using etch-stop trenches Abandoned AU2001249419A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US19214400P 2000-03-24 2000-03-24
US60192144 2000-03-24
US09712420 2000-11-13
US09/712,420 US6887391B1 (en) 2000-03-24 2000-11-13 Fabrication and controlled release of structures using etch-stop trenches
PCT/US2001/009461 WO2001072631A1 (en) 2000-03-24 2001-03-23 Fabrication and controlled release of structures using etch-stop trenches

Publications (1)

Publication Number Publication Date
AU2001249419A1 true AU2001249419A1 (en) 2001-10-08

Family

ID=26887772

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249419A Abandoned AU2001249419A1 (en) 2000-03-24 2001-03-23 Fabrication and controlled release of structures using etch-stop trenches

Country Status (3)

Country Link
US (1) US6887391B1 (en)
AU (1) AU2001249419A1 (en)
WO (1) WO2001072631A1 (en)

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US20090065429A9 (en) * 2001-10-22 2009-03-12 Dickensheets David L Stiffened surface micromachined structures and process for fabricating the same
DE102004037304A1 (en) * 2004-07-31 2006-02-16 Robert Bosch Gmbh Microstructured sensor and method for its manufacture
EP1966822A1 (en) * 2005-12-22 2008-09-10 Nxp B.V. Method of manufacturing a semiconductor device
DE102006002753B4 (en) * 2006-01-20 2010-09-30 X-Fab Semiconductor Foundries Ag Method and apparatus for evaluating the undercut of deep trench structures in SOI slices
JP4315174B2 (en) * 2006-02-16 2009-08-19 セイコーエプソン株式会社 Manufacturing method of lamb wave type high frequency device
KR20080113074A (en) * 2006-04-21 2008-12-26 바이오스케일, 아이엔씨. Microfabricated Device and Manufacturing Method of Microfabricated Device
US7999440B2 (en) * 2006-11-27 2011-08-16 Bioscale, Inc. Micro-fabricated devices having a suspended membrane or plate structure
US20080121042A1 (en) * 2006-11-27 2008-05-29 Bioscale, Inc. Fluid paths in etchable materials
US7884021B2 (en) * 2007-02-27 2011-02-08 Spartial Photonics, Inc. Planarization of a layer over a cavity
EP2060534A1 (en) * 2007-11-16 2009-05-20 Nivarox-FAR S.A. Composite silicon-metal micromechanical component and method for manufacturing same
DE102009015306B4 (en) 2009-03-27 2012-02-23 Austriamicrosystems Ag Process for the production of MEMS devices
US20100320548A1 (en) * 2009-06-18 2010-12-23 Analog Devices, Inc. Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device Fabrication
US20110084344A1 (en) * 2009-10-14 2011-04-14 Chien-Hsin Huang Mems device with a composite back plate electrode and method of making the same
US8828138B2 (en) 2010-05-17 2014-09-09 International Business Machines Corporation FET nanopore sensor
US8518829B2 (en) 2011-04-22 2013-08-27 International Business Machines Corporation Self-sealed fluidic channels for nanopore array
US8643140B2 (en) 2011-07-11 2014-02-04 United Microelectronics Corp. Suspended beam for use in MEMS device
US9000556B2 (en) 2011-10-07 2015-04-07 International Business Machines Corporation Lateral etch stop for NEMS release etch for high density NEMS/CMOS monolithic integration
US8525354B2 (en) 2011-10-13 2013-09-03 United Microelectronics Corporation Bond pad structure and fabricating method thereof
US8981501B2 (en) 2013-04-25 2015-03-17 United Microelectronics Corp. Semiconductor device and method of forming the same
US9340412B2 (en) 2014-07-28 2016-05-17 Ams International Ag Suspended membrane for capacitive pressure sensor
TWI636949B (en) 2015-05-15 2018-10-01 村田製作所股份有限公司 A multi-level micromechanical structure
FI126508B (en) 2015-05-15 2017-01-13 Murata Manufacturing Co Process for producing a multi-level micromechanical structure
FR3125810A1 (en) * 2021-11-03 2023-02-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives METHOD FOR CREATING A CAVITY WITHIN A STACK OF MATERIALS
DE102022208514A1 (en) * 2022-08-17 2024-02-22 Robert Bosch Gesellschaft mit beschränkter Haftung Method for producing microelectromechanical structures

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JP2643262B2 (en) * 1988-03-23 1997-08-20 日本電気株式会社 Method for manufacturing semiconductor device
US5043043A (en) 1990-06-22 1991-08-27 Massachusetts Institute Of Technology Method for fabricating side drive electrostatic micromotor
US5314572A (en) 1990-08-17 1994-05-24 Analog Devices, Inc. Method for fabricating microstructures
US5206983A (en) 1991-06-24 1993-05-04 Wisconsin Alumni Research Foundation Method of manufacturing micromechanical devices
FR2700065B1 (en) 1992-12-28 1995-02-10 Commissariat Energie Atomique Method of manufacturing accelerometers using silicon on insulator technology.
US5426070A (en) * 1993-05-26 1995-06-20 Cornell Research Foundation, Inc. Microstructures and high temperature isolation process for fabrication thereof
US5645684A (en) 1994-03-07 1997-07-08 The Regents Of The University Of California Multilayer high vertical aspect ratio thin film structures
US5914507A (en) 1994-05-11 1999-06-22 Regents Of The University Of Minnesota PZT microdevice
US6021675A (en) 1995-06-07 2000-02-08 Ssi Technologies, Inc. Resonating structure and method for forming the resonating structure
US5770465A (en) * 1995-06-23 1998-06-23 Cornell Research Foundation, Inc. Trench-filling etch-masking microfabrication technique
US5717631A (en) 1995-07-21 1998-02-10 Carnegie Mellon University Microelectromechanical structure and process of making same
US5638946A (en) 1996-01-11 1997-06-17 Northeastern University Micromechanical switch with insulated switch contact
US5637539A (en) 1996-01-16 1997-06-10 Cornell Research Foundation, Inc. Vacuum microelectronic devices with multiple planar electrodes
US5747353A (en) * 1996-04-16 1998-05-05 National Semiconductor Corporation Method of making surface micro-machined accelerometer using silicon-on-insulator technology
US5866281A (en) 1996-11-27 1999-02-02 Wisconsin Alumni Research Foundation Alignment method for multi-level deep x-ray lithography utilizing alignment holes and posts
US6025951A (en) 1996-11-27 2000-02-15 National Optics Institute Light modulating microdevice and method
US5971355A (en) 1996-11-27 1999-10-26 Xerox Corporation Microdevice valve structures to fluid control
JP3301334B2 (en) 1997-01-31 2002-07-15 三菱電機株式会社 Sensor element and method of manufacturing the same
US6121552A (en) * 1997-06-13 2000-09-19 The Regents Of The University Of Caliofornia Microfabricated high aspect ratio device with an electrical isolation trench
US6060398A (en) 1998-03-09 2000-05-09 Siemens Aktiengesellschaft Guard cell for etching
US6291875B1 (en) * 1998-06-24 2001-09-18 Analog Devices Imi, Inc. Microfabricated structures with electrical isolation and interconnections
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US6203715B1 (en) 1999-01-19 2001-03-20 Daewoo Electronics Co., Ltd. Method for the manufacture of a thin film actuated mirror array
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Also Published As

Publication number Publication date
WO2001072631A1 (en) 2001-10-04
US6887391B1 (en) 2005-05-03

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