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AU2001249277A1 - Grind polish cluster and double side polishing of substrates - Google Patents

Grind polish cluster and double side polishing of substrates

Info

Publication number
AU2001249277A1
AU2001249277A1 AU2001249277A AU4927701A AU2001249277A1 AU 2001249277 A1 AU2001249277 A1 AU 2001249277A1 AU 2001249277 A AU2001249277 A AU 2001249277A AU 4927701 A AU4927701 A AU 4927701A AU 2001249277 A1 AU2001249277 A1 AU 2001249277A1
Authority
AU
Australia
Prior art keywords
cluster
substrates
side polishing
double side
polish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001249277A
Inventor
Duncan Dobson
Krishna Vepa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wafer Solutions Inc
Original Assignee
Wafer Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/808,749 external-priority patent/US6852012B2/en
Application filed by Wafer Solutions Inc filed Critical Wafer Solutions Inc
Publication of AU2001249277A1 publication Critical patent/AU2001249277A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P72/0456—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • H10P72/0461—
    • H10P72/0472—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001249277A 2000-03-17 2001-03-19 Grind polish cluster and double side polishing of substrates Abandoned AU2001249277A1 (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
USNOTGIVEN 1997-05-02
US19021400P 2000-03-17 2000-03-17
US19046300P 2000-03-17 2000-03-17
US19027800P 2000-03-17 2000-03-17
US60190463 2000-03-17
US60190214 2000-03-17
US60190278 2000-03-17
US20638200P 2000-05-23 2000-05-23
US60206382 2000-05-23
US09/808,749 US6852012B2 (en) 2000-03-17 2001-03-15 Cluster tool systems and methods for in fab wafer processing
PCT/US2001/008825 WO2001070457A1 (en) 2000-03-17 2001-03-19 Grind polish cluster and double side polishing of substrates

Publications (1)

Publication Number Publication Date
AU2001249277A1 true AU2001249277A1 (en) 2001-10-03

Family

ID=27497838

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001249277A Abandoned AU2001249277A1 (en) 2000-03-17 2001-03-19 Grind polish cluster and double side polishing of substrates

Country Status (3)

Country Link
US (1) US20020052116A1 (en)
AU (1) AU2001249277A1 (en)
WO (1) WO2001070457A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1302515C (en) * 2001-11-02 2007-02-28 株式会社荏原制作所 Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufacturing method using said manufacturing apparatus
CN1977361B (en) * 2005-04-19 2011-04-27 株式会社荏原制作所 Substrate processing apparatus
JP2011029355A (en) * 2009-07-24 2011-02-10 Sumco Corp Method of manufacturing semiconductor wafer with laser mark
US9064836B1 (en) * 2010-08-09 2015-06-23 Sandisk Semiconductor (Shanghai) Co., Ltd. Extrinsic gettering on semiconductor devices
DE102011082777A1 (en) * 2011-09-15 2012-02-09 Siltronic Ag Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer
JP6377656B2 (en) * 2016-02-29 2018-08-22 株式会社フジミインコーポレーテッド Silicon substrate polishing method and polishing composition set

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6217433B1 (en) * 1995-05-16 2001-04-17 Unova Ip Corp. Grinding device and method
JP3664188B2 (en) * 1995-12-08 2005-06-22 株式会社東京精密 Surface processing method and apparatus
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
JPH10180624A (en) * 1996-12-19 1998-07-07 Shin Etsu Handotai Co Ltd Wrapping device and method
US5964646A (en) * 1997-11-17 1999-10-12 Strasbaugh Grinding process and apparatus for planarizing sawed wafers
US5980366A (en) * 1997-12-08 1999-11-09 Speedfam-Ipec Corporation Methods and apparatus for polishing using an improved plate stabilizer
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US6227950B1 (en) * 1999-03-08 2001-05-08 Speedfam-Ipec Corporation Dual purpose handoff station for workpiece polishing machine

Also Published As

Publication number Publication date
US20020052116A1 (en) 2002-05-02
WO2001070457A1 (en) 2001-09-27

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