[go: up one dir, main page]

AU2001245664A1 - Processes and apparatus for treating electronic components - Google Patents

Processes and apparatus for treating electronic components

Info

Publication number
AU2001245664A1
AU2001245664A1 AU2001245664A AU4566401A AU2001245664A1 AU 2001245664 A1 AU2001245664 A1 AU 2001245664A1 AU 2001245664 A AU2001245664 A AU 2001245664A AU 4566401 A AU4566401 A AU 4566401A AU 2001245664 A1 AU2001245664 A1 AU 2001245664A1
Authority
AU
Australia
Prior art keywords
processes
electronic components
treating electronic
treating
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001245664A
Inventor
Lewis Liu
Christopher F McConnell
C. Wade Sheen
Steven Verhaverbeke
Alan E Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CFMT Inc
Original Assignee
CFMT Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CFMT Inc filed Critical CFMT Inc
Publication of AU2001245664A1 publication Critical patent/AU2001245664A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P52/00—
    • H10P72/0426—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2230/00—Other cleaning aspects applicable to all B08B range
    • B08B2230/01—Cleaning with steam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
AU2001245664A 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components Abandoned AU2001245664A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18889500P 2000-03-13 2000-03-13
US60188895 2000-03-13
PCT/US2001/007959 WO2001068277A1 (en) 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components

Publications (1)

Publication Number Publication Date
AU2001245664A1 true AU2001245664A1 (en) 2001-09-24

Family

ID=22695008

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001245664A Abandoned AU2001245664A1 (en) 2000-03-13 2001-03-13 Processes and apparatus for treating electronic components

Country Status (7)

Country Link
US (1) US6491763B2 (en)
EP (1) EP1272288A1 (en)
JP (1) JP2003526936A (en)
KR (1) KR20030019323A (en)
CN (1) CN1460037A (en)
AU (1) AU2001245664A1 (en)
WO (1) WO2001068277A1 (en)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060137723A1 (en) * 1997-05-09 2006-06-29 Bergman Eric J Workpiece processing using ozone gas and solvents
TW466558B (en) * 1999-09-30 2001-12-01 Purex Co Ltd Method of removing contamination adhered to surfaces and apparatus used therefor
US6794229B2 (en) * 2000-04-28 2004-09-21 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method for semiconductor device
WO2002027775A1 (en) * 2000-09-28 2002-04-04 Mitsubishi Denki Kabushiki Kaisha Method and apparatus for treating wafer
JP4014127B2 (en) * 2000-10-04 2007-11-28 東京エレクトロン株式会社 Substrate processing method and substrate processing apparatus
US6532974B2 (en) 2001-04-06 2003-03-18 Akrion Llc Process tank with pressurized mist generation
US20050087209A1 (en) * 2001-07-16 2005-04-28 Nicolosi Thomas J.Jr. Megasonic processing system with gasified fluid
US7156111B2 (en) * 2001-07-16 2007-01-02 Akrion Technologies, Inc Megasonic cleaning using supersaturated cleaning solution
US6635590B2 (en) * 2002-01-08 2003-10-21 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for in-situ removal of polymer residue
US20030136429A1 (en) * 2002-01-22 2003-07-24 Semitool, Inc. Vapor cleaning and liquid rinsing process vessel
US6716290B1 (en) * 2002-12-04 2004-04-06 The United States Of America As Represented By The Secretary Of The Navy Method for removing soldering flux residue from a substrate
US20040139987A1 (en) * 2003-01-13 2004-07-22 Mount David J. Method for releasing and drying moveable elements of micro-electronic mechanical structures with organic thin film sacrificial layers
US6897661B2 (en) * 2003-03-14 2005-05-24 Steris Inc. Method and apparatus for detection of contaminants in a fluid
US6960921B2 (en) 2003-03-14 2005-11-01 Steris Inc. Method and apparatus for real time monitoring of metallic cation concentrations in a solution
US6933733B2 (en) 2003-03-14 2005-08-23 Steris Inc. Method and apparatus for measuring the concentration of hydrogen peroxide in a fluid
US6927582B2 (en) * 2003-03-14 2005-08-09 Steris Inc. Method and apparatus for monitoring the state of a chemical solution for decontamination of chemical and biological warfare agents
US6992494B2 (en) * 2003-03-14 2006-01-31 Steris Inc. Method and apparatus for monitoring the purity and/or quality of steam
US6946852B2 (en) * 2003-03-14 2005-09-20 Steris Inc. Method and apparatus for measuring concentration of a chemical component in a gas mixture
US6930493B2 (en) * 2003-03-14 2005-08-16 Steris Inc. Method and apparatus for monitoring detergent concentration in a decontamination process
US20050139487A1 (en) * 2003-05-02 2005-06-30 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method for the oxidative treatment of components comprised of or containing elementary silicon and/or substantially inorganic silicon compounds
US6909972B2 (en) * 2003-06-06 2005-06-21 Steris Inc. Method and apparatus for formulating and controlling chemical concentrations in a solution
US6917885B2 (en) * 2003-06-06 2005-07-12 Steris Inc. Method and apparatus for formulating and controlling chemical concentration in a gas mixture
KR20050011510A (en) * 2003-07-23 2005-01-29 동부전자 주식회사 Etchant for removing polymer in semiconductor processing
US20050130420A1 (en) * 2003-12-10 2005-06-16 Huang Chih Y. Cleaning method using ozone DI process
US20050191584A1 (en) * 2004-02-27 2005-09-01 Kevin Shea Surface treatment of a dry-developed hard mask and surface treatment compositions used therefor
US20050274396A1 (en) * 2004-06-09 2005-12-15 Hong Shih Methods for wet cleaning quartz surfaces of components for plasma processing chambers
US7431886B2 (en) * 2004-09-24 2008-10-07 Steris Corporation Method of monitoring operational status of sensing devices for determining the concentration of chemical components in a fluid
US20060196525A1 (en) * 2005-03-03 2006-09-07 Vrtis Raymond N Method for removing a residue from a chamber
US7432177B2 (en) * 2005-06-15 2008-10-07 Applied Materials, Inc. Post-ion implant cleaning for silicon on insulator substrate preparation
US7442319B2 (en) * 2005-06-28 2008-10-28 Micron Technology, Inc. Poly etch without separate oxide decap
US20070261718A1 (en) * 2006-05-10 2007-11-15 Rubinder Randhawa Method and apparatus for ozone-enhanced cleaning of flat objects with pulsed liquid jet
US7977121B2 (en) * 2006-11-17 2011-07-12 Air Products And Chemicals, Inc. Method and composition for restoring dielectric properties of porous dielectric materials
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
CN105845547A (en) * 2015-01-15 2016-08-10 中芯国际集成电路制造(上海)有限公司 Semiconductor device and preparation method thereof, and electronic apparatus
US11261797B2 (en) * 2018-11-05 2022-03-01 General Electric Company System and method for cleaning, restoring, and protecting gas turbine engine components
KR102121237B1 (en) * 2018-12-06 2020-06-10 세메스 주식회사 Apparatus and Method for treating substrate
JP2020155721A (en) * 2019-03-22 2020-09-24 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method
US11555413B2 (en) 2020-09-22 2023-01-17 General Electric Company System and method for treating an installed and assembled gas turbine engine

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988256A (en) * 1974-04-03 1976-10-26 Allied Chemical Corporation Photoresist stripper rinse
US4577650A (en) 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4740249A (en) 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4738272A (en) 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4856544A (en) 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4911761A (en) 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4984597B1 (en) 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
DE3585797D1 (en) 1985-06-24 1992-05-07 Cfm Technologies Inc TREATMENT OF SEMICONDUCTOR DISC WITH A LIQUID FLOW.
US4795497A (en) 1985-08-13 1989-01-03 Mcconnell Christopher F Method and system for fluid treatment of semiconductor wafers
US5181985A (en) 1988-06-01 1993-01-26 Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh Process for the wet-chemical surface treatment of semiconductor wafers
US5082518A (en) 1990-10-29 1992-01-21 Submicron Systems, Inc. Sparger plate for ozone gas diffusion
WO1992022084A1 (en) 1991-05-21 1992-12-10 Advantage Production Technology, Inc. Organic preclean for improving vapor phase wafer etch uniformity
JP3154814B2 (en) 1991-06-28 2001-04-09 株式会社東芝 Semiconductor wafer cleaning method and cleaning apparatus
US5583921A (en) 1992-09-21 1996-12-10 Casio Computer Co., Ltd. Data transmitting/receiving apparatus and data communication system
KR940012061A (en) 1992-11-27 1994-06-22 가나이 쯔또무 Organic matter removal method and organic matter removal apparatus for using the method
US5383484A (en) 1993-07-16 1995-01-24 Cfmt, Inc. Static megasonic cleaning system for cleaning objects
US5464480A (en) 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
DE4413077C2 (en) 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Method and device for chemical treatment of substrates
US5516730A (en) 1994-08-26 1996-05-14 Memc Electronic Materials, Inc. Pre-thermal treatment cleaning process of wafers
US5571337A (en) 1994-11-14 1996-11-05 Yieldup International Method for cleaning and drying a semiconductor wafer
US6132522A (en) 1996-07-19 2000-10-17 Cfmt, Inc. Wet processing methods for the manufacture of electronic components using sequential chemical processing
JP3036478B2 (en) 1997-08-08 2000-04-24 日本電気株式会社 Wafer cleaning and drying methods
TW426874B (en) * 1998-10-14 2001-03-21 United Microelectronics Corp Method for cleaning a semiconductor wafer
US6245185B1 (en) 1999-07-15 2001-06-12 International Business Machines Corporation Method of making a multilayer ceramic product with thin layers

Also Published As

Publication number Publication date
EP1272288A1 (en) 2003-01-08
JP2003526936A (en) 2003-09-09
WO2001068277A1 (en) 2001-09-20
CN1460037A (en) 2003-12-03
US6491763B2 (en) 2002-12-10
US20020033186A1 (en) 2002-03-21
KR20030019323A (en) 2003-03-06

Similar Documents

Publication Publication Date Title
AU2001245664A1 (en) Processes and apparatus for treating electronic components
SG106599A1 (en) Substrate processing apparatus and substrate processing method
SG94851A1 (en) Substrate processing apparatus and substrate processing method
AU2001285399A1 (en) Method and apparatus for secure electronic payments
AU2001235279A1 (en) Method and apparatus for balanced electronic operations
AU2002326152A1 (en) Apparatus and method for mounting electronic parts
IL157684A0 (en) Apparatus and method for photocosmetic and photodermatological treatment
SG112893A1 (en) Component mounting apparatus and method
SG105487A1 (en) Substrate processing apparatus and substrate processing method
GB0118582D0 (en) Method and apparatus for distributing electronic content
EP1308992A4 (en) Device and method for processing substrate
SG123603A1 (en) Substrate processing apparatus and substrate processing method
AU2001238644A1 (en) Electronic supports and methods and apparatus for forming apertures in electronic supports
AU2002326159A1 (en) Plasma treating apparatus and plasma treating method
AU2000233489A1 (en) Methods and apparatus for treating waste
AU2001289041A1 (en) Method and apparatus for treating wastewater
SG104267A1 (en) Substrate processing apparatus and substrate processing method
SG91902A1 (en) Substrate processing method and substrate processing apparatus
AU2001266388A1 (en) Electronic locking apparatus and control method thereof
TW565004U (en) Apparatus for processing electronic components
GB0101244D0 (en) Process and apparatus
AU2001241660A1 (en) Electronic supports and methods and apparatus for forming apertures in electronic supports
AU2001251189A1 (en) Method and apparatus for electronic device feature access
AU2002326362A1 (en) Method and apparatus for electronic processing of claims
AU2001215526A1 (en) Method of processing printed board scrap and apparatus for the same