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AU2001245500A1 - Method for making a flexible circuit interposer having high-aspect ratio conductors - Google Patents

Method for making a flexible circuit interposer having high-aspect ratio conductors

Info

Publication number
AU2001245500A1
AU2001245500A1 AU2001245500A AU4550001A AU2001245500A1 AU 2001245500 A1 AU2001245500 A1 AU 2001245500A1 AU 2001245500 A AU2001245500 A AU 2001245500A AU 4550001 A AU4550001 A AU 4550001A AU 2001245500 A1 AU2001245500 A1 AU 2001245500A1
Authority
AU
Australia
Prior art keywords
making
aspect ratio
flexible circuit
circuit interposer
ratio conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001245500A
Inventor
Kevin Kwong-Tai Chung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amerasia International Technology Inc
Original Assignee
CHUNG KEVIN KWONG TAI
Amerasia International Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/524,148 external-priority patent/US6376769B1/en
Priority claimed from US09/578,583 external-priority patent/US6717819B1/en
Application filed by CHUNG KEVIN KWONG TAI, Amerasia International Technology Inc filed Critical CHUNG KEVIN KWONG TAI
Publication of AU2001245500A1 publication Critical patent/AU2001245500A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/005—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with variable reactance for tuning the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H10W70/611—
    • H10W70/65—
    • H10W70/688—
    • H10W76/153—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H10W70/655—
    • H10W72/01—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/60—
    • H10W72/877—
    • H10W72/90—
    • H10W72/9415—
    • H10W90/00—
    • H10W90/22—
    • H10W90/291—
    • H10W90/297—
    • H10W90/721—
    • H10W90/724—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
AU2001245500A 2000-03-14 2001-03-08 Method for making a flexible circuit interposer having high-aspect ratio conductors Abandoned AU2001245500A1 (en)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US09/524,148 US6376769B1 (en) 1999-05-18 2000-03-14 High-density electronic package, and method for making same
US09524148 2000-03-14
US19060700P 2000-03-20 2000-03-20
US60190607 2000-03-20
US19443400P 2000-04-04 2000-04-04
US60194434 2000-04-04
US09/578,583 US6717819B1 (en) 1999-06-01 2000-05-25 Solderable flexible adhesive interposer as for an electronic package, and method for making same
US09578583 2000-05-25
US22090900P 2000-07-26 2000-07-26
US60220909 2000-07-26
US09727307 2000-11-30
US09/727,307 US6580031B2 (en) 2000-03-14 2000-11-30 Method for making a flexible circuit interposer having high-aspect ratio conductors
PCT/US2001/007312 WO2001069675A1 (en) 2000-03-14 2001-03-08 Method for making a flexible circuit interposer having high-aspect ratio conductors

Publications (1)

Publication Number Publication Date
AU2001245500A1 true AU2001245500A1 (en) 2001-09-24

Family

ID=27558812

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001245500A Abandoned AU2001245500A1 (en) 2000-03-14 2001-03-08 Method for making a flexible circuit interposer having high-aspect ratio conductors

Country Status (3)

Country Link
US (1) US6580031B2 (en)
AU (1) AU2001245500A1 (en)
WO (1) WO2001069675A1 (en)

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US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
US6615044B2 (en) * 2001-06-06 2003-09-02 Nokia Mobile Phones, Ltd. Method of WCDMA coverage based handover triggering
CA2447368A1 (en) * 2001-06-29 2003-01-09 Xanoptix, Inc. Opto-electronic device integration
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
US7645262B2 (en) * 2002-04-11 2010-01-12 Second Sight Medical Products, Inc. Biocompatible bonding method and electronics package suitable for implantation
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US20060091538A1 (en) * 2004-11-04 2006-05-04 Kabadi Ashok N Low profile and tight pad-pitch land-grid-array (LGA) socket
TWI287805B (en) * 2005-11-11 2007-10-01 Ind Tech Res Inst Composite conductive film and semiconductor package using such film
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
JP2006294527A (en) * 2005-04-14 2006-10-26 Nec Corp Connector and manufacturing method thereof
US7300824B2 (en) * 2005-08-18 2007-11-27 James Sheats Method of packaging and interconnection of integrated circuits
US7936060B2 (en) * 2009-04-29 2011-05-03 International Business Machines Corporation Reworkable electronic device assembly and method
US8678771B2 (en) * 2009-12-14 2014-03-25 Siemens Energy, Inc. Process for manufacturing a component
WO2011156397A2 (en) 2010-06-08 2011-12-15 Amerasia International Technology, Inc. Solar cell interconnection, module, panel and method
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
JP7405337B2 (en) * 2018-10-11 2023-12-26 積水ポリマテック株式会社 Electrical connection sheet and glass plate structure with terminals
DE102019206260A1 (en) * 2019-05-02 2020-11-05 Abb Schweiz Ag Method for manufacturing a semiconductor module
TWI755034B (en) * 2020-08-19 2022-02-11 友達光電股份有限公司 Device substrate and manufacturing method thereof

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Also Published As

Publication number Publication date
WO2001069675A1 (en) 2001-09-20
US20020046873A1 (en) 2002-04-25
US6580031B2 (en) 2003-06-17

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