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AU2000270553A1 - Photoimageable, aqueous acid soluble polyimide polymers - Google Patents

Photoimageable, aqueous acid soluble polyimide polymers

Info

Publication number
AU2000270553A1
AU2000270553A1 AU2000270553A AU7055300A AU2000270553A1 AU 2000270553 A1 AU2000270553 A1 AU 2000270553A1 AU 2000270553 A AU2000270553 A AU 2000270553A AU 7055300 A AU7055300 A AU 7055300A AU 2000270553 A1 AU2000270553 A1 AU 2000270553A1
Authority
AU
Australia
Prior art keywords
photoimageable
aqueous acid
soluble polyimide
acid soluble
polyimide polymers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000270553A
Inventor
Hany B. Eitouni
Guoping Mao
Alphonsus Pocius
John Scheibner
Nanayakkara L. D. Somasiri
Nicholas A. Stacey
Alfred Viehbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2000270553A1 publication Critical patent/AU2000270553A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/136—Coating process making radiation sensitive element

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Materials For Photolithography (AREA)
AU2000270553A 2000-04-11 2000-08-08 Photoimageable, aqueous acid soluble polyimide polymers Abandoned AU2000270553A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/547,390 US6379865B1 (en) 2000-04-11 2000-04-11 Photoimageable, aqueous acid soluble polyimide polymers
US09547390 2000-04-11
PCT/US2000/021599 WO2001077753A1 (en) 2000-04-11 2000-08-08 Photoimageable, aqueous acid soluble polyimide polymers

Publications (1)

Publication Number Publication Date
AU2000270553A1 true AU2000270553A1 (en) 2001-10-23

Family

ID=24184472

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000270553A Abandoned AU2000270553A1 (en) 2000-04-11 2000-08-08 Photoimageable, aqueous acid soluble polyimide polymers

Country Status (5)

Country Link
US (4) US6379865B1 (en)
EP (1) EP1272901A1 (en)
AU (1) AU2000270553A1 (en)
MX (1) MXPA02010019A (en)
WO (1) WO2001077753A1 (en)

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US6824959B2 (en) 2002-06-27 2004-11-30 Ppg Industries Ohio, Inc. Process for creating holes in polymeric substrates
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US7081158B2 (en) * 2003-11-21 2006-07-25 Imaje S.A. Ink composition for continuous deflected jet printing, especially on letters and postal articles
CN101175633B (en) * 2005-04-19 2011-12-21 宇部兴产株式会社 Polyimide film laminate
JP4752556B2 (en) * 2005-09-22 2011-08-17 Ｊｓｒ株式会社 Radiation-sensitive composition for forming colored layer and color filter
US7998323B1 (en) * 2006-06-07 2011-08-16 Actus Potentia, Inc. Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces
JP5321839B2 (en) * 2007-04-25 2013-10-23 日産化学工業株式会社 Polyimide precursor, polyimide, and image-forming underlayer coating solution
US9080440B2 (en) 2007-07-25 2015-07-14 Schlumberger Technology Corporation Proppant pillar placement in a fracture with high solid content fluid
US9040468B2 (en) 2007-07-25 2015-05-26 Schlumberger Technology Corporation Hydrolyzable particle compositions, treatment fluids and methods
US10011763B2 (en) 2007-07-25 2018-07-03 Schlumberger Technology Corporation Methods to deliver fluids on a well site with variable solids concentration from solid slurries
US8936082B2 (en) 2007-07-25 2015-01-20 Schlumberger Technology Corporation High solids content slurry systems and methods
US8490698B2 (en) * 2007-07-25 2013-07-23 Schlumberger Technology Corporation High solids content methods and slurries
US20120111563A1 (en) 2010-11-08 2012-05-10 Carlos Abad Methods to deliver fluids on a well site with variable solids concentration from solid slurries
US8490699B2 (en) * 2007-07-25 2013-07-23 Schlumberger Technology Corporation High solids content slurry methods
US20110198089A1 (en) * 2009-08-31 2011-08-18 Panga Mohan K R Methods to reduce settling rate of solids in a treatment fluid
US7923415B2 (en) 2009-08-31 2011-04-12 Schlumberger Technology Corporation Methods to reduce settling rate of solids in a treatment fluid
US8662172B2 (en) 2010-04-12 2014-03-04 Schlumberger Technology Corporation Methods to gravel pack a well using expanding materials
US8511381B2 (en) 2010-06-30 2013-08-20 Schlumberger Technology Corporation High solids content slurry methods and systems
US8505628B2 (en) 2010-06-30 2013-08-13 Schlumberger Technology Corporation High solids content slurries, systems and methods
US8613314B2 (en) 2010-11-08 2013-12-24 Schlumberger Technology Corporation Methods to enhance the productivity of a well
US8607870B2 (en) 2010-11-19 2013-12-17 Schlumberger Technology Corporation Methods to create high conductivity fractures that connect hydraulic fracture networks in a well
US8998384B2 (en) * 2011-03-31 2015-04-07 Hewlett-Packard Development Company, L.P. Circuits and methods using a non-gold corrosion inhibitor
US9133387B2 (en) 2011-06-06 2015-09-15 Schlumberger Technology Corporation Methods to improve stability of high solid content fluid
US9803457B2 (en) 2012-03-08 2017-10-31 Schlumberger Technology Corporation System and method for delivering treatment fluid
US9863228B2 (en) 2012-03-08 2018-01-09 Schlumberger Technology Corporation System and method for delivering treatment fluid
US9528354B2 (en) 2012-11-14 2016-12-27 Schlumberger Technology Corporation Downhole tool positioning system and method
US9388335B2 (en) 2013-07-25 2016-07-12 Schlumberger Technology Corporation Pickering emulsion treatment fluid
US11791521B2 (en) * 2019-09-13 2023-10-17 Hutchinson Technology Incorporated Electrode tabs and methods of forming
US11322806B2 (en) 2019-09-13 2022-05-03 Hutchinson Technology Incorporated Sensored battery electrode
CN116675857B (en) * 2023-06-06 2025-12-19 江苏环峰电工材料有限公司 Piperazine grafted polyimide resin and preparation method thereof

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Also Published As

Publication number Publication date
US20030180664A1 (en) 2003-09-25
MXPA02010019A (en) 2003-04-25
US6559245B2 (en) 2003-05-06
US20020086236A1 (en) 2002-07-04
US6379865B1 (en) 2002-04-30
US20030211425A1 (en) 2003-11-13
WO2001077753A1 (en) 2001-10-18
EP1272901A1 (en) 2003-01-08

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