[go: up one dir, main page]

AU2000270415A1 - Polishing apparatus comprising pad and polishing method using the same - Google Patents

Polishing apparatus comprising pad and polishing method using the same

Info

Publication number
AU2000270415A1
AU2000270415A1 AU2000270415A AU7041500A AU2000270415A1 AU 2000270415 A1 AU2000270415 A1 AU 2000270415A1 AU 2000270415 A AU2000270415 A AU 2000270415A AU 7041500 A AU7041500 A AU 7041500A AU 2000270415 A1 AU2000270415 A1 AU 2000270415A1
Authority
AU
Australia
Prior art keywords
polishing
pad
same
polishing apparatus
polishing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000270415A
Inventor
Chan-Hwa Chung
Sung-Yong Park
Sung-Joon Yoon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fine Semitech Corp
Original Assignee
Fine Semitech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fine Semitech Corp filed Critical Fine Semitech Corp
Publication of AU2000270415A1 publication Critical patent/AU2000270415A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10P52/403—
    • H10P50/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2000270415A 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same Abandoned AU2000270415A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR0048870 2000-08-23
KR10-2000-0048870A KR100470137B1 (en) 2000-08-23 2000-08-23 Polishing apparatus comprising frozen pad and method for polishing using the same
PCT/KR2000/001030 WO2002017411A1 (en) 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same

Publications (1)

Publication Number Publication Date
AU2000270415A1 true AU2000270415A1 (en) 2002-03-04

Family

ID=19684638

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000270415A Abandoned AU2000270415A1 (en) 2000-08-23 2000-09-09 Polishing apparatus comprising pad and polishing method using the same

Country Status (3)

Country Link
KR (1) KR100470137B1 (en)
AU (1) AU2000270415A1 (en)
WO (1) WO2002017411A1 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030050105A (en) * 2001-12-18 2003-06-25 삼성전자주식회사 Chemical mechanical polishing apparatus
JP2003332274A (en) 2002-05-17 2003-11-21 Tokyo Seimitsu Co Ltd Chemical mechanical polishing method and chemical mechanical polishing apparatus
KR20030095589A (en) * 2002-06-12 2003-12-24 동부전자 주식회사 Method For Manufacturing Semiconductors
CN100425405C (en) * 2006-08-03 2008-10-15 南京航空航天大学 Freezing nanometer abrasive polishing pad and its prepn. method
CN101774160B (en) * 2010-03-01 2011-05-11 南京航空航天大学 Grainofice-type concretion abrasive polishing pad as well as rapid preparation method and device
KR101330827B1 (en) * 2011-11-10 2013-11-18 한국기계연구원 Apparatus forming frost, laser processing system including the same and laser processing method using the same
CN102615555B (en) * 2012-04-16 2014-02-05 大连理工大学 Kindle direct publishing (KDP) crystal micro-nano hygroscopic ultraprecision polishing method based on ultrasonic atomization moisture
CN104875116B (en) * 2015-06-09 2017-09-12 青岛理工大学 Nanofluid electrostatic atomization and electrocaloric heat pipe integrated trace lubrication grinding device
US10058975B2 (en) 2016-02-12 2018-08-28 Applied Materials, Inc. In-situ temperature control during chemical mechanical polishing with a condensed gas
WO2020005749A1 (en) 2018-06-27 2020-01-02 Applied Materials, Inc. Temperature control of chemical mechanical polishing
CN109037033A (en) * 2018-07-17 2018-12-18 武汉新芯集成电路制造有限公司 A kind of wafer thining method
CN110039382A (en) * 2018-10-16 2019-07-23 天通控股股份有限公司 A kind of thining method of large-size ultra-thin lithium tantalate wafer
TWI838459B (en) 2019-02-20 2024-04-11 美商應用材料股份有限公司 Chemical mechanical polishing apparatus and method of chemical mechanical polishing
US11628478B2 (en) 2019-05-29 2023-04-18 Applied Materials, Inc. Steam cleaning of CMP components
TWI859239B (en) 2019-05-29 2024-10-21 美商應用材料股份有限公司 Apparatus and method for steam treatment stations for chemical mechanical polishing system
US11633833B2 (en) 2019-05-29 2023-04-25 Applied Materials, Inc. Use of steam for pre-heating of CMP components
CN110190020A (en) * 2019-07-03 2019-08-30 中国振华集团云科电子有限公司 A kind of lithographic method and system
JP7295412B2 (en) * 2019-07-09 2023-06-21 日本製鉄株式会社 Evaluation method for metallic materials
TWI872101B (en) 2019-08-13 2025-02-11 美商應用材料股份有限公司 Apparatus and method for cmp temperature control
US11897079B2 (en) 2019-08-13 2024-02-13 Applied Materials, Inc. Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
WO2022006008A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc. Control of steam generation for chemical mechanical polishing
KR20240165485A (en) 2020-06-29 2024-11-22 어플라이드 머티어리얼스, 인코포레이티드 Temperature and slurry flow rate control in cmp
US11919123B2 (en) 2020-06-30 2024-03-05 Applied Materials, Inc. Apparatus and method for CMP temperature control
US11577358B2 (en) 2020-06-30 2023-02-14 Applied Materials, Inc. Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
CN112139859A (en) * 2020-09-21 2020-12-29 大连理工大学 Method for anhydrous polishing of KDP crystal
CN117448001A (en) * 2023-11-01 2024-01-26 广东先导微电子科技有限公司 A dislocation etching liquid for gallium arsenide polycrystal and its dislocation etching method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4450652A (en) * 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US5127196A (en) * 1990-03-01 1992-07-07 Intel Corporation Apparatus for planarizing a dielectric formed over a semiconductor substrate
JPH09123059A (en) * 1995-11-02 1997-05-13 Fujitsu Ltd Polishing method
JPH11347935A (en) * 1998-06-10 1999-12-21 Ebara Corp Polishing device

Also Published As

Publication number Publication date
KR100470137B1 (en) 2005-02-04
WO2002017411A1 (en) 2002-02-28
KR20000064128A (en) 2000-11-06

Similar Documents

Publication Publication Date Title
AU2000270415A1 (en) Polishing apparatus comprising pad and polishing method using the same
EP1055486B8 (en) Dressing apparatus and polishing apparatus
SG10201706765QA (en) Substrate holding apparatus and substrate polishing apparatus
SG96621A1 (en) Polishing apparatus
SG86364A1 (en) Planarization apparatus and method
AU2001263028A1 (en) Stream-cipher method and apparatus
AU2001256933A1 (en) Apparatus and method
AU5902899A (en) Abrasive polishing method, apparatus and composition
SG99868A1 (en) Polishing apparatus and dressing method
SG94358A1 (en) Polishing composition and method
AU2001227224A1 (en) Tomographic apparatus and method
SG97860A1 (en) Polishing apparatus
GB0108751D0 (en) Polishing apparatus and method
SG99901A1 (en) Polishing apparatus
AUPQ777500A0 (en) Grinding apparatus
AU2002217867A1 (en) Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method
AU2604001A (en) Method and apparatus for conditioning a polishing pad
EP1108499A4 (en) Polishing device and polishing method
GB9911801D0 (en) Polishing device and polishing method
AU7450900A (en) Polishing composition and method
AU2001235535A1 (en) Abrasive grindstone and method for making same
GB2361446B (en) Polishing apparatus
AU2001278101A1 (en) Abrasive pad
AU2001290975A1 (en) Cleaning device and associated method
AU2001235584A1 (en) Improved grinding method and related device