AR199567A1 - Un dispositivo para separar placas de semiconductor - Google Patents
Un dispositivo para separar placas de semiconductorInfo
- Publication number
- AR199567A1 AR199567A1 AR247688A AR24768873A AR199567A1 AR 199567 A1 AR199567 A1 AR 199567A1 AR 247688 A AR247688 A AR 247688A AR 24768873 A AR24768873 A AR 24768873A AR 199567 A1 AR199567 A1 AR 199567A1
- Authority
- AR
- Argentina
- Prior art keywords
- separate semiconductor
- semiconductor plates
- plates
- separate
- semiconductor
- Prior art date
Links
Classifications
-
- H10P52/00—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
- Y10S156/931—Peeling away backing
- Y10S156/932—Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1978—Delaminating bending means
- Y10T156/1983—Poking delaminating means
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US247639A US3915784A (en) | 1972-04-26 | 1972-04-26 | Method of semiconductor chip separation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR199567A1 true AR199567A1 (es) | 1974-09-13 |
Family
ID=22935700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AR247688A AR199567A1 (es) | 1972-04-26 | 1973-04-24 | Un dispositivo para separar placas de semiconductor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3915784A (es) |
| AR (1) | AR199567A1 (es) |
| BR (1) | BR7303004D0 (es) |
| CA (1) | CA992220A (es) |
| ES (1) | ES413721A1 (es) |
| GB (1) | GB1421408A (es) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3969813A (en) * | 1975-08-15 | 1976-07-20 | Bell Telephone Laboratories, Incorporated | Method and apparatus for removal of semiconductor chips from hybrid circuits |
| US4071944A (en) * | 1975-10-20 | 1978-02-07 | Western Electric Co., Inc. | Adhesively and magnetically holding an article |
| US4466852A (en) * | 1983-10-27 | 1984-08-21 | At&T Technologies, Inc. | Method and apparatus for demounting wafers |
| US4472218A (en) * | 1983-12-23 | 1984-09-18 | At&T Technologies, Inc. | Removing articles from an adhesive web |
| JP3197788B2 (ja) * | 1995-05-18 | 2001-08-13 | 株式会社日立製作所 | 半導体装置の製造方法 |
| US5837556A (en) * | 1997-01-06 | 1998-11-17 | Sundstrand Corporation | Method of removing a component from a substrate |
| GB2380602B (en) * | 2001-05-19 | 2005-03-02 | Wentworth Lab Ltd | Wafer alignment device |
| CN102555097B (zh) * | 2012-03-28 | 2014-08-06 | 杭州海纳半导体有限公司 | 适用于多线切割机加工时工件装载的夹具及紧固方法 |
| CN107696312A (zh) * | 2017-10-12 | 2018-02-16 | 江苏秉宸科技有限公司 | 一种硅棒切割底座 |
| CN114952023B (zh) * | 2022-06-24 | 2024-01-30 | 长沙麓邦光电科技有限公司 | 用于制备光栅尺的夹具及其联控方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3454428A (en) * | 1964-08-03 | 1969-07-08 | Dow Chemical Co | Method and apparatus for cleaning chips and the like |
| US3632074A (en) * | 1967-10-09 | 1972-01-04 | Western Electric Co | Releasable mounting and method of placing an oriented array of devices on the mounting |
| US3690984A (en) * | 1967-10-09 | 1972-09-12 | Western Electric Co | Releasable mounting method of placing an oriented array of semiconductor devices on the mounting |
| US3584741A (en) * | 1969-06-30 | 1971-06-15 | Ibm | Batch sorting apparatus |
| US3681139A (en) * | 1969-10-16 | 1972-08-01 | Western Electric Co | Method for handling and maintaining the orientation of a matrix of miniature electrical devices |
| US3663326A (en) * | 1970-01-09 | 1972-05-16 | Western Electric Co | Article holding methods and assemblage |
| US3666588A (en) * | 1970-01-26 | 1972-05-30 | Western Electric Co | Method of retaining and bonding articles |
| US3627124A (en) * | 1970-01-29 | 1971-12-14 | Western Electric Co | Method for separating selected articles from an array |
| US3687369A (en) * | 1970-10-12 | 1972-08-29 | North American Car Corp | Cleaning apparatus |
-
1972
- 1972-04-26 US US247639A patent/US3915784A/en not_active Expired - Lifetime
-
1973
- 1973-03-21 CA CA167,267A patent/CA992220A/en not_active Expired
- 1973-04-13 GB GB1780173A patent/GB1421408A/en not_active Expired
- 1973-04-14 ES ES413721A patent/ES413721A1/es not_active Expired
- 1973-04-24 AR AR247688A patent/AR199567A1/es active
- 1973-04-25 BR BR3004/73A patent/BR7303004D0/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA992220A (en) | 1976-06-29 |
| GB1421408A (en) | 1976-01-21 |
| US3915784A (en) | 1975-10-28 |
| ES413721A1 (es) | 1977-04-01 |
| BR7303004D0 (pt) | 1974-07-11 |
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