AR071596A1 - Conectores electricos y plaquetas de circuito que tienen placas no ohmicas - Google Patents
Conectores electricos y plaquetas de circuito que tienen placas no ohmicasInfo
- Publication number
- AR071596A1 AR071596A1 ARP090101457A ARP090101457A AR071596A1 AR 071596 A1 AR071596 A1 AR 071596A1 AR P090101457 A ARP090101457 A AR P090101457A AR P090101457 A ARP090101457 A AR P090101457A AR 071596 A1 AR071596 A1 AR 071596A1
- Authority
- AR
- Argentina
- Prior art keywords
- traces
- differential pair
- housing
- circuit board
- circuit boards
- Prior art date
Links
- 230000000295 complement effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6467—Means for preventing cross-talk by cross-over of signal conductors
- H01R13/6469—Means for preventing cross-talk by cross-over of signal conductors on substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/941—Crosstalk suppression
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Un conectar eléctrico incluye un alojamiento y una pluralidad de contactos dentro del alojamiento que están configurados para vincularse con contactos complementarios de un conector complementario. Los contactos forman al menos un primer par diferencial y un segundo par diferencial. El conector eléctrico también incluye una plaqueta de circuito alojada dentro del alojamiento. La plaqueta de circuito tiene un cuerpo de sustrato formado de un material dialéctico que incluye una primera traza acoplada eléctricamente a un contacto del primer par diferencial y una segunda traza acoplada eléctricamente a un contacto del segundo par diferencial. Al menos una de las trazas primera y segunda es una traza de extremo abierto. La plaqueta de circuito también tiene una placa no ohmica que está ubicada adyacentemente a las trazas. La placa está ubicada para acoplar electromagnéticamente las trazas primera y segunda entre sí y la placa no ohmica y las trazas están configuradas para obtener un comportamiento eléctrico deseado.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/109,544 US7658651B2 (en) | 2008-04-25 | 2008-04-25 | Electrical connectors and circuit boards having non-ohmic plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR071596A1 true AR071596A1 (es) | 2010-06-30 |
Family
ID=40831714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP090101457A AR071596A1 (es) | 2008-04-25 | 2009-04-24 | Conectores electricos y plaquetas de circuito que tienen placas no ohmicas |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7658651B2 (es) |
| AR (1) | AR071596A1 (es) |
| TW (1) | TWI472105B (es) |
| WO (1) | WO2009131640A1 (es) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8016621B2 (en) | 2009-08-25 | 2011-09-13 | Tyco Electronics Corporation | Electrical connector having an electrically parallel compensation region |
| US8435082B2 (en) | 2010-08-03 | 2013-05-07 | Tyco Electronics Corporation | Electrical connectors and printed circuits having broadside-coupling regions |
| US8128436B2 (en) * | 2009-08-25 | 2012-03-06 | Tyco Electronics Corporation | Electrical connectors with crosstalk compensation |
| US7967644B2 (en) * | 2009-08-25 | 2011-06-28 | Tyco Electronics Corporation | Electrical connector with separable contacts |
| EP2391191A1 (fr) * | 2010-05-28 | 2011-11-30 | Thales | Dispositif d'interconnexion pour circuits électroniques, notamment des circuits électroniques hyperfréquence |
| US8425255B2 (en) * | 2011-02-04 | 2013-04-23 | Leviton Manufacturing Co., Inc. | Spring assembly with spring members biasing and capacitively coupling jack contacts |
| EP2487761B1 (en) * | 2011-02-10 | 2013-07-31 | 3M Innovative Properties Company | Telecommunications connector |
| US8235731B1 (en) * | 2011-03-18 | 2012-08-07 | Leviton Manufacturing Co., Ltd. | Connector module and patch panel |
| CH705538A1 (de) * | 2011-09-02 | 2013-03-15 | Reichle & De Massari Fa | Steckverbindungsteil. |
| US8535065B2 (en) * | 2012-01-09 | 2013-09-17 | Tyco Electronics Corporation | Connector assembly for interconnecting electrical connectors having different orientations |
| TWM452515U (zh) * | 2012-06-27 | 2013-05-01 | Advanced Connectek Inc | 可降低近端串音之連結器結構 |
| US9147977B2 (en) | 2012-07-05 | 2015-09-29 | Leviton Manufacturing Co., Inc. | High density high speed data communications connector |
| US20140174812A1 (en) * | 2012-12-21 | 2014-06-26 | Raul Enriquez Shibayama | Method and Apparatus for Far End Crosstalk Reduction in Single Ended Signaling |
| WO2014130775A1 (en) * | 2013-02-22 | 2014-08-28 | Tyco Electronics Corporation | Electrical connector with multiple contact array materials |
| WO2014144735A1 (en) * | 2013-03-15 | 2014-09-18 | Tyco Electronics Uk Ltd. | Connector with capacitive crosstalk compensation to reduce alien crosstalk |
| DE102013108130A1 (de) * | 2013-07-30 | 2015-02-05 | MCQ TECH GmbH | Kontaktsatz für eine Anschlussbuchse |
| US9300092B1 (en) | 2014-09-30 | 2016-03-29 | Optical Cable Corporation | High frequency RJ45 plug with non-continuous ground planes for cross talk control |
| US9583890B2 (en) | 2014-09-30 | 2017-02-28 | Optical Cable Corporation | RJ45 connector |
| TWI611640B (zh) | 2015-05-22 | 2018-01-11 | 好慶科技企業股份有限公司 | 電路基板 |
| JP6655183B2 (ja) * | 2015-11-11 | 2020-02-26 | ベル フューズ (マカオ コマーシャル オフショア) リミテッド | モジュラーコネクタ |
| TWI616038B (zh) * | 2016-06-08 | 2018-02-21 | 光纜公司 | 使用串音控制的非連續接地面之高頻rj45插頭 |
| TWM537333U (zh) * | 2016-10-21 | 2017-02-21 | Jyh Eng Technology Co Ltd | 高速網路模組插座連接器 |
| WO2018081712A1 (en) * | 2016-10-31 | 2018-05-03 | Commscope Technologies Llc | Connector with capacitive crosstalk compensation |
| TWI655885B (zh) | 2018-01-25 | 2019-04-01 | 好慶科技企業股份有限公司 | 電路基板 |
| US10530106B2 (en) | 2018-01-31 | 2020-01-07 | Bel Fuse (Macao Commercial Offshore) Limited | Modular plug connector with multilayer PCB for very high speed applications |
| JP7265438B2 (ja) * | 2019-07-17 | 2023-04-26 | 日本航空電子工業株式会社 | モジュラープラグ及びケーブルハーネス |
| US11811163B2 (en) | 2021-02-26 | 2023-11-07 | Leviton Manufacturing Co., Inc. | Mutoa and quad floating connector |
| KR20250170310A (ko) * | 2024-05-28 | 2025-12-05 | 삼성전자주식회사 | 회로 기판, 반도체 모듈 및 반도체 시스템 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5399106A (en) * | 1994-01-21 | 1995-03-21 | The Whitaker Corporation | High performance electrical connector |
| US5431584A (en) * | 1994-01-21 | 1995-07-11 | The Whitaker Corporation | Electrical connector with reduced crosstalk |
| JP3311221B2 (ja) * | 1995-01-10 | 2002-08-05 | キヤノン株式会社 | 画像処理装置及びその方法 |
| JP3802070B2 (ja) * | 1996-02-29 | 2006-07-26 | ザ ウィタカー コーポレーション | クロストーク減少のための非抵抗エネルギ結合 |
| US6162076A (en) * | 1998-08-28 | 2000-12-19 | Senior Industries, Inc. | Electrical shorting assembly for electrical jacks and the like |
| US5975960A (en) * | 1998-10-06 | 1999-11-02 | The Whitaker Corporation | Modular connector with capacitive plates |
| US6710255B2 (en) * | 2001-03-30 | 2004-03-23 | Intel Corporation | Printed circuit board having buried intersignal capacitance and method of making |
| RU2322741C2 (ru) * | 2002-11-20 | 2008-04-20 | Те Симон Компани | Устройство для компенсации перекрестной помехи в телекоммуникационном соединителе |
| US6808399B2 (en) * | 2002-12-02 | 2004-10-26 | Tyco Electronics Corporation | Electrical connector with wafers having split ground planes |
| US7182649B2 (en) * | 2003-12-22 | 2007-02-27 | Panduit Corp. | Inductive and capacitive coupling balancing electrical connector |
| US7402085B2 (en) * | 2006-04-11 | 2008-07-22 | Adc Gmbh | Telecommunications jack with crosstalk compensation provided on a multi-layer circuit board |
-
2008
- 2008-04-25 US US12/109,544 patent/US7658651B2/en active Active
-
2009
- 2009-04-16 WO PCT/US2009/002370 patent/WO2009131640A1/en not_active Ceased
- 2009-04-22 TW TW98113375A patent/TWI472105B/zh not_active IP Right Cessation
- 2009-04-24 AR ARP090101457A patent/AR071596A1/es not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI472105B (zh) | 2015-02-01 |
| US20090269978A1 (en) | 2009-10-29 |
| TW201004067A (en) | 2010-01-16 |
| WO2009131640A1 (en) | 2009-10-29 |
| US7658651B2 (en) | 2010-02-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG | Grant, registration | ||
| FD | Application declared void or lapsed, e.g., due to non-payment of fee |