AR059011A1 - Verificacion de atributos de desempeno de circuitos integrados empaquetados - Google Patents
Verificacion de atributos de desempeno de circuitos integrados empaquetadosInfo
- Publication number
- AR059011A1 AR059011A1 ARP070100162A ARP070100162A AR059011A1 AR 059011 A1 AR059011 A1 AR 059011A1 AR P070100162 A ARP070100162 A AR P070100162A AR P070100162 A ARP070100162 A AR P070100162A AR 059011 A1 AR059011 A1 AR 059011A1
- Authority
- AR
- Argentina
- Prior art keywords
- packaged
- order
- signature
- performance
- ics
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31719—Security aspects, e.g. preventing unauthorised access during test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31718—Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Storage Device Security (AREA)
- Test And Diagnosis Of Digital Computers (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Los circuitos integrados empaquetados (ICs) de algunos tipos, como ser procesadores, se clasifican y venden de acuerdo con una escala de desempeno, como ser la velocidad de reloj especificada máxima, que establece el fabricante como resultado de una prueba. Como registro de esta clasificacion algunas partes del envase, frecuentemente la superficie superior, se marca con un atributo de desempeno especificado. Sin embargo la actividad criminal desarrollo el lugar donde el envase se reetiqueta con el fin de mostrar una especificacion superior de modo tal que los ICs pueden revenderse fraudulentamente a un precio mayor. Con el fin de tratar este problema, la presente prevé que los fabricantes mantengan una base de datos de producto para cada IC empaquetado donde se registre no solo la especificacion de desempeno, sino también una firma digital que deriva de un diseno granulado que se obtiene del envase. Posteriormente, cualquier lC empaquetado se puede reescanear con el fin de interrogar su diseno granulado y recomputar la firma. Luego, la firma se utiliza para encontrar el producto en la base de datos, a través de lo cual, se recupera el atributo de desempeno especificado originariamente. Luego, se puede detectar el fraude. Este método se puede utilizar con el fin de probar los productos que se devuelven, por ejemplo, tras un reclamo por garantía.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0600828A GB2434442A (en) | 2006-01-16 | 2006-01-16 | Verification of performance attributes of packaged integrated circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR059011A1 true AR059011A1 (es) | 2008-03-05 |
Family
ID=35998105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP070100162A AR059011A1 (es) | 2006-01-16 | 2007-01-15 | Verificacion de atributos de desempeno de circuitos integrados empaquetados |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20070164729A1 (es) |
| AR (1) | AR059011A1 (es) |
| GB (1) | GB2434442A (es) |
| TW (1) | TW200735318A (es) |
| WO (1) | WO2007080375A1 (es) |
Families Citing this family (32)
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| EP2128790A3 (en) | 2004-03-12 | 2011-01-26 | Ingenia Technology Limited | Authenticity verification with linearised data |
| ATE433164T1 (de) | 2004-03-12 | 2009-06-15 | Ingenia Technology Ltd | Verfahren und vorrichtungen zur erzeugung authentifizierbarer gegenstände und ihrer nachfolgenden überprüfung |
| GB2417592B (en) | 2004-08-13 | 2006-07-26 | Ingenia Technology Ltd | Authenticity verification of articles |
| JP5123181B2 (ja) | 2005-07-27 | 2013-01-16 | インジェニア・テクノロジー・(ユーケイ)・リミテッド | 真正性の検証 |
| WO2007012821A1 (en) * | 2005-07-27 | 2007-02-01 | Ingenia Technology Limited | Verification of the signature of an article created from signals obtained from scatter of coherent optical radiation from the surface of the article |
| US7731435B2 (en) * | 2005-08-12 | 2010-06-08 | Ricoh Company, Ltd. | Techniques for printing with integrated paper sheet identification |
| US7809156B2 (en) * | 2005-08-12 | 2010-10-05 | Ricoh Company, Ltd. | Techniques for generating and using a fingerprint for an article |
| GB2429950B (en) * | 2005-09-08 | 2007-08-22 | Ingenia Holdings | Copying |
| GB2448245B (en) | 2005-12-23 | 2009-11-04 | Ingenia Holdings | Optical authentication |
| US8756673B2 (en) | 2007-03-30 | 2014-06-17 | Ricoh Company, Ltd. | Techniques for sharing data |
| US7865124B2 (en) * | 2007-03-30 | 2011-01-04 | Ricoh Company, Ltd. | Pre-scanning printer with paper fingerprinting |
| US8281997B2 (en) * | 2008-02-19 | 2012-10-09 | Bilcare Technologies Singapore Pte. Ltd. | Reading device for identifying a tag or an object adapted to be identified, related methods and systems |
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| GB2476226B (en) | 2009-11-10 | 2012-03-28 | Ingenia Holdings Ltd | Optimisation |
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| CN106226040A (zh) * | 2016-08-29 | 2016-12-14 | 成都美律科技有限公司 | Led元件测试系统 |
| CN106226039A (zh) * | 2016-08-29 | 2016-12-14 | 成都美律科技有限公司 | 一种led元件测试系统 |
| CN106226038A (zh) * | 2016-08-29 | 2016-12-14 | 成都美律科技有限公司 | 一种led元件测试装置 |
| CN106441813A (zh) * | 2016-08-29 | 2017-02-22 | 成都美律科技有限公司 | 一种led元件的测试平台 |
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| DE102019213774A1 (de) * | 2019-09-10 | 2021-03-11 | Robert Bosch Gmbh | Verfahren zum Bereitstellen von Homologationskennzeichnungen |
| CN120846649B (zh) * | 2025-09-22 | 2025-12-30 | 晋城市光机电产业协调服务中心(晋城市光机电产业研究院) | 一种半导体激光器综合性能测试系统 |
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| FR2849245B1 (fr) * | 2002-12-20 | 2006-02-24 | Thales Sa | Procede d'authentification et d'identification optique d'objets et dispositif de mise en oeuvre |
| JP2004220424A (ja) * | 2003-01-16 | 2004-08-05 | Canon Inc | 文書管理システム |
| EP2436307B1 (en) * | 2003-03-31 | 2015-10-21 | The General Hospital Corporation | Speckle reduction in optical coherence tomography by path length encoded angular compounding |
| US7221445B2 (en) * | 2003-04-11 | 2007-05-22 | Metrolaser, Inc. | Methods and apparatus for detecting and quantifying surface characteristics and material conditions using light scattering |
| EP1618538A1 (en) * | 2003-04-30 | 2006-01-25 | E.I. Dupont De Nemours And Company | Method for tracking and tracing marked articles |
| US7002675B2 (en) * | 2003-07-10 | 2006-02-21 | Synetics Solutions, Inc. | Method and apparatus for locating/sizing contaminants on a polished planar surface of a dielectric or semiconductor material |
| US6955141B2 (en) * | 2003-08-06 | 2005-10-18 | General Motors Corporation | Engine cooling system |
| US7389530B2 (en) * | 2003-09-12 | 2008-06-17 | International Business Machines Corporation | Portable electronic door opener device and method for secure door opening |
| FR2860670B1 (fr) * | 2003-10-02 | 2006-01-06 | Novatec | Procede de securisation de transaction a partir de cartes presentant des identificateurs uniques et inreproductibles |
| US7071481B2 (en) * | 2003-10-09 | 2006-07-04 | Igor V. Fetisov | Automated reagentless system of product fingerprint authentication and trademark protection |
| US7497379B2 (en) * | 2004-02-27 | 2009-03-03 | Microsoft Corporation | Counterfeit and tamper resistant labels with randomly occurring features |
| EP2128790A3 (en) * | 2004-03-12 | 2011-01-26 | Ingenia Technology Limited | Authenticity verification with linearised data |
| US7577844B2 (en) * | 2004-03-17 | 2009-08-18 | Microsoft Corporation | Systems and methods for encoding randomly distributed features in an object |
| US7321430B2 (en) * | 2004-04-22 | 2008-01-22 | Zygo Corporation | Vibration resistant interferometry |
-
2006
- 2006-01-16 GB GB0600828A patent/GB2434442A/en not_active Withdrawn
-
2007
- 2007-01-02 TW TW096100104A patent/TW200735318A/zh unknown
- 2007-01-03 WO PCT/GB2007/000015 patent/WO2007080375A1/en not_active Ceased
- 2007-01-15 AR ARP070100162A patent/AR059011A1/es not_active Application Discontinuation
- 2007-01-16 US US11/623,633 patent/US20070164729A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| GB2434442A (en) | 2007-07-25 |
| TW200735318A (en) | 2007-09-16 |
| WO2007080375A1 (en) | 2007-07-19 |
| US20070164729A1 (en) | 2007-07-19 |
| GB0600828D0 (en) | 2006-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA | Abandonment or withdrawal |