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AR059011A1 - Verificacion de atributos de desempeno de circuitos integrados empaquetados - Google Patents

Verificacion de atributos de desempeno de circuitos integrados empaquetados

Info

Publication number
AR059011A1
AR059011A1 ARP070100162A ARP070100162A AR059011A1 AR 059011 A1 AR059011 A1 AR 059011A1 AR P070100162 A ARP070100162 A AR P070100162A AR P070100162 A ARP070100162 A AR P070100162A AR 059011 A1 AR059011 A1 AR 059011A1
Authority
AR
Argentina
Prior art keywords
packaged
order
signature
performance
ics
Prior art date
Application number
ARP070100162A
Other languages
English (en)
Inventor
Russell P Cowburn
James David Ralph Buchanan
Original Assignee
Ingenia Holdings Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ingenia Holdings Uk Ltd filed Critical Ingenia Holdings Uk Ltd
Publication of AR059011A1 publication Critical patent/AR059011A1/es

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31719Security aspects, e.g. preventing unauthorised access during test
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317Testing of digital circuits
    • G01R31/31718Logistic aspects, e.g. binning, selection, sorting of devices under test, tester/handler interaction networks, Test management software, e.g. software for test statistics or test evaluation, yield analysis
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/57Protection from inspection, reverse engineering or tampering
    • H01L23/573Protection from inspection, reverse engineering or tampering using passive means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54406Marks applied to semiconductor devices or parts comprising alphanumeric information
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54413Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54473Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486Located on package parts, e.g. encapsulation, leads, package substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Storage Device Security (AREA)
  • Test And Diagnosis Of Digital Computers (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Los circuitos integrados empaquetados (ICs) de algunos tipos, como ser procesadores, se clasifican y venden de acuerdo con una escala de desempeno, como ser la velocidad de reloj especificada máxima, que establece el fabricante como resultado de una prueba. Como registro de esta clasificacion algunas partes del envase, frecuentemente la superficie superior, se marca con un atributo de desempeno especificado. Sin embargo la actividad criminal desarrollo el lugar donde el envase se reetiqueta con el fin de mostrar una especificacion superior de modo tal que los ICs pueden revenderse fraudulentamente a un precio mayor. Con el fin de tratar este problema, la presente prevé que los fabricantes mantengan una base de datos de producto para cada IC empaquetado donde se registre no solo la especificacion de desempeno, sino también una firma digital que deriva de un diseno granulado que se obtiene del envase. Posteriormente, cualquier lC empaquetado se puede reescanear con el fin de interrogar su diseno granulado y recomputar la firma. Luego, la firma se utiliza para encontrar el producto en la base de datos, a través de lo cual, se recupera el atributo de desempeno especificado originariamente. Luego, se puede detectar el fraude. Este método se puede utilizar con el fin de probar los productos que se devuelven, por ejemplo, tras un reclamo por garantía.
ARP070100162A 2006-01-16 2007-01-15 Verificacion de atributos de desempeno de circuitos integrados empaquetados AR059011A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0600828A GB2434442A (en) 2006-01-16 2006-01-16 Verification of performance attributes of packaged integrated circuits

Publications (1)

Publication Number Publication Date
AR059011A1 true AR059011A1 (es) 2008-03-05

Family

ID=35998105

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP070100162A AR059011A1 (es) 2006-01-16 2007-01-15 Verificacion de atributos de desempeno de circuitos integrados empaquetados

Country Status (5)

Country Link
US (1) US20070164729A1 (es)
AR (1) AR059011A1 (es)
GB (1) GB2434442A (es)
TW (1) TW200735318A (es)
WO (1) WO2007080375A1 (es)

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Also Published As

Publication number Publication date
GB2434442A (en) 2007-07-25
TW200735318A (en) 2007-09-16
WO2007080375A1 (en) 2007-07-19
US20070164729A1 (en) 2007-07-19
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