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AR009881A1 - Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido - Google Patents

Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido

Info

Publication number
AR009881A1
AR009881A1 ARP980103143A ARP980103143A AR009881A1 AR 009881 A1 AR009881 A1 AR 009881A1 AR P980103143 A ARP980103143 A AR P980103143A AR P980103143 A ARP980103143 A AR P980103143A AR 009881 A1 AR009881 A1 AR 009881A1
Authority
AR
Argentina
Prior art keywords
hybrid circuit
overload protection
provision
protector
substrate
Prior art date
Application number
ARP980103143A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of AR009881A1 publication Critical patent/AR009881A1/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/16Resistor networks not otherwise provided for
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/13Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10022Non-printed resistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10151Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Fuses (AREA)

Abstract

Se describe una disposicion de circuito híbrido con al menos una película resistiva (2)aplicada al menos por una cara sobe un substrato (1) en forma deplaca constituido de vidrio o cerámica y al menos un protector de sobrecarga dispuesto sobre el substrato (1), el cual está conectado eléctricamente con lapelícula resistiva (2), estando dicho protector constituido por un resistor de coeficiente positivo de temperatura (PCT) (3). Con esa medida la disposicionde circuito híbrido provista conel protector rearmable en forma automática puede ser empleada nuevamente aun en el caso de una falla por sobrecarga.
ARP980103143A 1997-07-01 1998-06-29 Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido AR009881A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19728015 1997-07-01

Publications (1)

Publication Number Publication Date
AR009881A1 true AR009881A1 (es) 2000-05-03

Family

ID=7834275

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP980103143A AR009881A1 (es) 1997-07-01 1998-06-29 Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido

Country Status (9)

Country Link
US (1) US6232868B1 (es)
EP (1) EP0996955B1 (es)
JP (1) JP2002507329A (es)
CN (1) CN1132195C (es)
AR (1) AR009881A1 (es)
AT (1) ATE221693T1 (es)
BR (1) BR9810963A (es)
DE (1) DE59805019D1 (es)
WO (1) WO1999001875A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6734781B1 (en) * 1999-04-30 2004-05-11 Rohm Co., Ltd. Mounting structure for temperature-sensitive fuse on circuit board
US6445277B1 (en) * 1999-06-22 2002-09-03 Yazaki Corporation Safety device of electric circuit and process for producing the same
WO2001093721A1 (en) 2000-06-05 2001-12-13 Bruce Alan Sargent A disposable toothbrush
JP3589174B2 (ja) 2000-10-24 2004-11-17 株式会社村田製作所 表面実装型正特性サーミスタおよびその実装方法
US6670881B1 (en) 2001-07-27 2003-12-30 General Electric Company Positive temperature coefficient resistor/overload resistor method and assemblies
JP2006310064A (ja) * 2005-04-28 2006-11-09 Sanyo Electric Co Ltd 蓄電デバイス
EP1811819B1 (de) * 2006-01-19 2011-03-23 Siemens Aktiengesellschaft Leiterplatte
CN101507073B (zh) * 2006-09-06 2012-07-25 西门子公司 用于装置(尤其是电动机)的热过载保护电路
US8289122B2 (en) * 2009-03-24 2012-10-16 Tyco Electronics Corporation Reflowable thermal fuse
DE102016101248A1 (de) 2015-11-02 2017-05-04 Epcos Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1253332B (de) 1965-04-07 1967-11-02 Licentia Gmbh Anordnung zum Abschalten hoher Stroeme
US4041440A (en) * 1976-05-13 1977-08-09 General Motors Corporation Method of adjusting resistance of a thick-film thermistor
US4222024A (en) * 1979-01-29 1980-09-09 Gte Sylvania Incorporated Thermistor assembly
DE8213333U1 (de) 1982-05-07 1982-08-19 Siemens AG, 1000 Berlin und 8000 München Leiterfoermiger schichtwiderstand
US4467310A (en) * 1983-10-03 1984-08-21 Northern Telecom Limited Telephone subscriber line battery feed resistor arrangements
US5166658A (en) * 1987-09-30 1992-11-24 Raychem Corporation Electrical device comprising conductive polymers
JP3335348B2 (ja) * 1987-09-30 2002-10-15 レイケム・コーポレイション 導電性重合体を含む電気的デバイス
US5436609A (en) * 1990-09-28 1995-07-25 Raychem Corporation Electrical device
DE4143095C1 (en) * 1991-12-27 1993-04-08 Roederstein Spezialfabriken Fuer Bauelemente Der Elektronik Und Kondensatoren Der Starkstromtechnik Gmbh, 8300 Landshut, De Electrical building block, for simplicity and reliability - comprises resistor in series with melt fuse and connection element forming protective wall section, fixed on substrate with silicone adhesive
JPH05234706A (ja) * 1992-02-25 1993-09-10 Rohm Co Ltd 面実装用サーミスタ
DE9319473U1 (de) 1993-12-17 1994-06-23 Siemens AG, 80333 München Hybridschaltungsanordnung
EP0748511B1 (en) * 1994-03-01 1998-07-01 Bowthorpe Components Limited Thermistor
US5594407A (en) * 1994-07-12 1997-01-14 Caddock Electronics, Inc. Debris-reducing film-type resistor and method
JP3297269B2 (ja) * 1995-11-20 2002-07-02 株式会社村田製作所 正特性サーミスタの実装構造

Also Published As

Publication number Publication date
EP0996955B1 (de) 2002-07-31
EP0996955A1 (de) 2000-05-03
BR9810963A (pt) 2000-09-26
JP2002507329A (ja) 2002-03-05
WO1999001875A1 (de) 1999-01-14
ATE221693T1 (de) 2002-08-15
CN1132195C (zh) 2003-12-24
US6232868B1 (en) 2001-05-15
CN1222744A (zh) 1999-07-14
DE59805019D1 (de) 2002-09-05

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