AR009881A1 - Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido - Google Patents
Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibridoInfo
- Publication number
- AR009881A1 AR009881A1 ARP980103143A ARP980103143A AR009881A1 AR 009881 A1 AR009881 A1 AR 009881A1 AR P980103143 A ARP980103143 A AR P980103143A AR P980103143 A ARP980103143 A AR P980103143A AR 009881 A1 AR009881 A1 AR 009881A1
- Authority
- AR
- Argentina
- Prior art keywords
- hybrid circuit
- overload protection
- provision
- protector
- substrate
- Prior art date
Links
- 230000001012 protector Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/16—Resistor networks not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
- Emergency Protection Circuit Devices (AREA)
- Fuses (AREA)
Abstract
Se describe una disposicion de circuito híbrido con al menos una película resistiva (2)aplicada al menos por una cara sobe un substrato (1) en forma deplaca constituido de vidrio o cerámica y al menos un protector de sobrecarga dispuesto sobre el substrato (1), el cual está conectado eléctricamente con lapelícula resistiva (2), estando dicho protector constituido por un resistor de coeficiente positivo de temperatura (PCT) (3). Con esa medida la disposicionde circuito híbrido provista conel protector rearmable en forma automática puede ser empleada nuevamente aun en el caso de una falla por sobrecarga.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19728015 | 1997-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR009881A1 true AR009881A1 (es) | 2000-05-03 |
Family
ID=7834275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP980103143A AR009881A1 (es) | 1997-07-01 | 1998-06-29 | Circuito hibrido con proteccion de sobrecarga, y disposicion de circuito hibrido |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6232868B1 (es) |
| EP (1) | EP0996955B1 (es) |
| JP (1) | JP2002507329A (es) |
| CN (1) | CN1132195C (es) |
| AR (1) | AR009881A1 (es) |
| AT (1) | ATE221693T1 (es) |
| BR (1) | BR9810963A (es) |
| DE (1) | DE59805019D1 (es) |
| WO (1) | WO1999001875A1 (es) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6734781B1 (en) * | 1999-04-30 | 2004-05-11 | Rohm Co., Ltd. | Mounting structure for temperature-sensitive fuse on circuit board |
| US6445277B1 (en) * | 1999-06-22 | 2002-09-03 | Yazaki Corporation | Safety device of electric circuit and process for producing the same |
| WO2001093721A1 (en) | 2000-06-05 | 2001-12-13 | Bruce Alan Sargent | A disposable toothbrush |
| JP3589174B2 (ja) | 2000-10-24 | 2004-11-17 | 株式会社村田製作所 | 表面実装型正特性サーミスタおよびその実装方法 |
| US6670881B1 (en) | 2001-07-27 | 2003-12-30 | General Electric Company | Positive temperature coefficient resistor/overload resistor method and assemblies |
| JP2006310064A (ja) * | 2005-04-28 | 2006-11-09 | Sanyo Electric Co Ltd | 蓄電デバイス |
| EP1811819B1 (de) * | 2006-01-19 | 2011-03-23 | Siemens Aktiengesellschaft | Leiterplatte |
| CN101507073B (zh) * | 2006-09-06 | 2012-07-25 | 西门子公司 | 用于装置(尤其是电动机)的热过载保护电路 |
| US8289122B2 (en) * | 2009-03-24 | 2012-10-16 | Tyco Electronics Corporation | Reflowable thermal fuse |
| DE102016101248A1 (de) | 2015-11-02 | 2017-05-04 | Epcos Ag | Sensorelement und Verfahren zur Herstellung eines Sensorelements |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1253332B (de) | 1965-04-07 | 1967-11-02 | Licentia Gmbh | Anordnung zum Abschalten hoher Stroeme |
| US4041440A (en) * | 1976-05-13 | 1977-08-09 | General Motors Corporation | Method of adjusting resistance of a thick-film thermistor |
| US4222024A (en) * | 1979-01-29 | 1980-09-09 | Gte Sylvania Incorporated | Thermistor assembly |
| DE8213333U1 (de) | 1982-05-07 | 1982-08-19 | Siemens AG, 1000 Berlin und 8000 München | Leiterfoermiger schichtwiderstand |
| US4467310A (en) * | 1983-10-03 | 1984-08-21 | Northern Telecom Limited | Telephone subscriber line battery feed resistor arrangements |
| US5166658A (en) * | 1987-09-30 | 1992-11-24 | Raychem Corporation | Electrical device comprising conductive polymers |
| JP3335348B2 (ja) * | 1987-09-30 | 2002-10-15 | レイケム・コーポレイション | 導電性重合体を含む電気的デバイス |
| US5436609A (en) * | 1990-09-28 | 1995-07-25 | Raychem Corporation | Electrical device |
| DE4143095C1 (en) * | 1991-12-27 | 1993-04-08 | Roederstein Spezialfabriken Fuer Bauelemente Der Elektronik Und Kondensatoren Der Starkstromtechnik Gmbh, 8300 Landshut, De | Electrical building block, for simplicity and reliability - comprises resistor in series with melt fuse and connection element forming protective wall section, fixed on substrate with silicone adhesive |
| JPH05234706A (ja) * | 1992-02-25 | 1993-09-10 | Rohm Co Ltd | 面実装用サーミスタ |
| DE9319473U1 (de) | 1993-12-17 | 1994-06-23 | Siemens AG, 80333 München | Hybridschaltungsanordnung |
| EP0748511B1 (en) * | 1994-03-01 | 1998-07-01 | Bowthorpe Components Limited | Thermistor |
| US5594407A (en) * | 1994-07-12 | 1997-01-14 | Caddock Electronics, Inc. | Debris-reducing film-type resistor and method |
| JP3297269B2 (ja) * | 1995-11-20 | 2002-07-02 | 株式会社村田製作所 | 正特性サーミスタの実装構造 |
-
1998
- 1998-05-29 BR BR9810963-4A patent/BR9810963A/pt not_active IP Right Cessation
- 1998-05-29 DE DE59805019T patent/DE59805019D1/de not_active Expired - Fee Related
- 1998-05-29 WO PCT/DE1998/001477 patent/WO1999001875A1/de not_active Ceased
- 1998-05-29 EP EP98934831A patent/EP0996955B1/de not_active Expired - Lifetime
- 1998-05-29 US US09/462,051 patent/US6232868B1/en not_active Expired - Fee Related
- 1998-05-29 JP JP50607499A patent/JP2002507329A/ja active Pending
- 1998-05-29 AT AT98934831T patent/ATE221693T1/de not_active IP Right Cessation
- 1998-06-29 CN CN98115534A patent/CN1132195C/zh not_active Expired - Fee Related
- 1998-06-29 AR ARP980103143A patent/AR009881A1/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP0996955B1 (de) | 2002-07-31 |
| EP0996955A1 (de) | 2000-05-03 |
| BR9810963A (pt) | 2000-09-26 |
| JP2002507329A (ja) | 2002-03-05 |
| WO1999001875A1 (de) | 1999-01-14 |
| ATE221693T1 (de) | 2002-08-15 |
| CN1132195C (zh) | 2003-12-24 |
| US6232868B1 (en) | 2001-05-15 |
| CN1222744A (zh) | 1999-07-14 |
| DE59805019D1 (de) | 2002-09-05 |
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