NZ196864A - Polymerisable dental composition containing a methacrylate monomer - Google Patents
Polymerisable dental composition containing a methacrylate monomerInfo
- Publication number
- NZ196864A NZ196864A NZ196864A NZ19686481A NZ196864A NZ 196864 A NZ196864 A NZ 196864A NZ 196864 A NZ196864 A NZ 196864A NZ 19686481 A NZ19686481 A NZ 19686481A NZ 196864 A NZ196864 A NZ 196864A
- Authority
- NZ
- New Zealand
- Prior art keywords
- monomer
- composition according
- thiourea
- weight
- cupric
- Prior art date
Links
- 239000000178 monomer Substances 0.000 title claims description 58
- 239000000203 mixture Substances 0.000 title claims description 54
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 title claims description 14
- -1 peroxy compound Chemical class 0.000 claims description 37
- 239000003638 chemical reducing agent Substances 0.000 claims description 30
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 19
- 239000003054 catalyst Substances 0.000 claims description 16
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims description 14
- 239000007800 oxidant agent Substances 0.000 claims description 14
- 230000001590 oxidative effect Effects 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- 125000000864 peroxy group Chemical group O(O*)* 0.000 claims description 11
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 10
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- 229940076286 cupric acetate Drugs 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- IPCRBOOJBPETMF-UHFFFAOYSA-N N-acetylthiourea Chemical group CC(=O)NC(N)=S IPCRBOOJBPETMF-UHFFFAOYSA-N 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 229960003280 cupric chloride Drugs 0.000 claims description 5
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 claims description 4
- 229960001748 allylthiourea Drugs 0.000 claims description 4
- 239000002685 polymerization catalyst Substances 0.000 claims description 4
- 150000003254 radicals Chemical class 0.000 claims description 4
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 claims description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- HTKFORQRBXIQHD-UHFFFAOYSA-N allylthiourea Chemical group NC(=S)NCC=C HTKFORQRBXIQHD-UHFFFAOYSA-N 0.000 claims description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- FULZLIGZKMKICU-UHFFFAOYSA-N N-phenylthiourea Chemical compound NC(=S)NC1=CC=CC=C1 FULZLIGZKMKICU-UHFFFAOYSA-N 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- QYJPSWYYEKYVEJ-FDGPNNRMSA-L copper;(z)-4-oxopent-2-en-2-olate Chemical compound [Cu+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O QYJPSWYYEKYVEJ-FDGPNNRMSA-L 0.000 claims description 2
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 claims description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 claims description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical group CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- WSDQIHATCCOMLH-UHFFFAOYSA-N phenyl n-(3,5-dichlorophenyl)carbamate Chemical compound ClC1=CC(Cl)=CC(NC(=O)OC=2C=CC=CC=2)=C1 WSDQIHATCCOMLH-UHFFFAOYSA-N 0.000 claims 1
- 238000007717 redox polymerization reaction Methods 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 239000005749 Copper compound Substances 0.000 description 8
- 150000001880 copper compounds Chemical class 0.000 description 8
- 229910001431 copper ion Inorganic materials 0.000 description 7
- 239000004615 ingredient Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 125000002947 alkylene group Chemical group 0.000 description 5
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 210000000214 mouth Anatomy 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 150000003585 thioureas Chemical class 0.000 description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000002252 acyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 229960005070 ascorbic acid Drugs 0.000 description 2
- 235000010323 ascorbic acid Nutrition 0.000 description 2
- 239000011668 ascorbic acid Substances 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- UCGFRIAOVLXVKL-UHFFFAOYSA-N benzylthiourea Chemical compound NC(=S)NCC1=CC=CC=C1 UCGFRIAOVLXVKL-UHFFFAOYSA-N 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 239000008119 colloidal silica Substances 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- 229940045803 cuprous chloride Drugs 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- SNVLJLYUUXKWOJ-UHFFFAOYSA-N methylidenecarbene Chemical compound C=[C] SNVLJLYUUXKWOJ-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- POXAIQSXNOEQGM-UHFFFAOYSA-N propan-2-ylthiourea Chemical compound CC(C)NC(N)=S POXAIQSXNOEQGM-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- KAGLPYRXTCQWHU-UHFFFAOYSA-N (2,4-dimethylphenyl)thiourea Chemical compound CC1=CC=C(NC(N)=S)C(C)=C1 KAGLPYRXTCQWHU-UHFFFAOYSA-N 0.000 description 1
- GSRPPAKIJBKMEY-UHFFFAOYSA-N (2-methoxyphenyl)methylthiourea Chemical compound COC1=CC=CC=C1CNC(N)=S GSRPPAKIJBKMEY-UHFFFAOYSA-N 0.000 description 1
- HXCHZMHFZXNFIX-UHFFFAOYSA-N (2-methoxyphenyl)thiourea Chemical compound COC1=CC=CC=C1NC(N)=S HXCHZMHFZXNFIX-UHFFFAOYSA-N 0.000 description 1
- BHJYKFUCQNISJA-UHFFFAOYSA-N (3-hydroxyphenyl)thiourea Chemical compound NC(=S)NC1=CC=CC(O)=C1 BHJYKFUCQNISJA-UHFFFAOYSA-N 0.000 description 1
- JAEZSIYNWDWMMN-UHFFFAOYSA-N 1,1,3-trimethylthiourea Chemical compound CNC(=S)N(C)C JAEZSIYNWDWMMN-UHFFFAOYSA-N 0.000 description 1
- OLTJYOMEFRRCKA-UHFFFAOYSA-N 1,1,3-triphenylthiourea Chemical compound C=1C=CC=CC=1N(C=1C=CC=CC=1)C(=S)NC1=CC=CC=C1 OLTJYOMEFRRCKA-UHFFFAOYSA-N 0.000 description 1
- OVRQXQSDQWOJIL-UHFFFAOYSA-N 1,1-dibutylthiourea Chemical compound CCCCN(C(N)=S)CCCC OVRQXQSDQWOJIL-UHFFFAOYSA-N 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- OGBWMWKMTUSNKE-UHFFFAOYSA-N 1-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CCCCCC(OC(=O)C(C)=C)OC(=O)C(C)=C OGBWMWKMTUSNKE-UHFFFAOYSA-N 0.000 description 1
- WGTSYSMCCBVJNF-UHFFFAOYSA-N 1-(4-ethenylphenyl)-3-methylthiourea Chemical compound CNC(=S)NC1=CC=C(C=C)C=C1 WGTSYSMCCBVJNF-UHFFFAOYSA-N 0.000 description 1
- ONIKNECPXCLUHT-UHFFFAOYSA-N 2-chlorobenzoyl chloride Chemical compound ClC(=O)C1=CC=CC=C1Cl ONIKNECPXCLUHT-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 229910000497 Amalgam Inorganic materials 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DQGASIACJAQOCL-UHFFFAOYSA-N C(=C)=C(CO)O Chemical group C(=C)=C(CO)O DQGASIACJAQOCL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VKOUCJUTMGHNOR-UHFFFAOYSA-N Diphenolic acid Chemical compound C=1C=C(O)C=CC=1C(CCC(O)=O)(C)C1=CC=C(O)C=C1 VKOUCJUTMGHNOR-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical group OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- KFFQABQEJATQAT-UHFFFAOYSA-N N,N'-dibutylthiourea Chemical compound CCCCNC(=S)NCCCC KFFQABQEJATQAT-UHFFFAOYSA-N 0.000 description 1
- KQJQICVXLJTWQD-UHFFFAOYSA-N N-Methylthiourea Chemical compound CNC(N)=S KQJQICVXLJTWQD-UHFFFAOYSA-N 0.000 description 1
- AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 description 1
- JPYHHZQJCSQRJY-UHFFFAOYSA-N Phloroglucinol Natural products CCC=CCC=CCC=CCC=CCCCCC(=O)C1=C(O)C=C(O)C=C1O JPYHHZQJCSQRJY-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- VGYYBBKADFJNDQ-UHFFFAOYSA-N butylthiourea octylthiourea Chemical compound C(CCCCCCC)NC(=S)N.C(CCC)NC(=S)N VGYYBBKADFJNDQ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000002668 chloroacetyl group Chemical group ClCC(=O)* 0.000 description 1
- 125000002603 chloroethyl group Chemical group [H]C([*])([H])C([H])([H])Cl 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- LEEHHPPLIOFGSC-UHFFFAOYSA-N cyclohexylthiourea Chemical compound NC(=S)NC1CCCCC1 LEEHHPPLIOFGSC-UHFFFAOYSA-N 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- CGMRCMMOCQYHAD-UHFFFAOYSA-J dicalcium hydroxide phosphate Chemical compound [OH-].[Ca++].[Ca++].[O-]P([O-])([O-])=O CGMRCMMOCQYHAD-UHFFFAOYSA-J 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000001867 hydroperoxy group Chemical group [*]OO[H] 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 239000012633 leachable Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- DCUFMVPCXCSVNP-UHFFFAOYSA-N methacrylic anhydride Chemical compound CC(=C)C(=O)OC(=O)C(C)=C DCUFMVPCXCSVNP-UHFFFAOYSA-N 0.000 description 1
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- VAVFWTOVXLDJFG-UHFFFAOYSA-N n-(butylcarbamothioyl)butanamide Chemical compound CCCCNC(=S)NC(=O)CCC VAVFWTOVXLDJFG-UHFFFAOYSA-N 0.000 description 1
- DQMWMUMCNOJLSI-UHFFFAOYSA-N n-carbamothioylbenzamide Chemical compound NC(=S)NC(=O)C1=CC=CC=C1 DQMWMUMCNOJLSI-UHFFFAOYSA-N 0.000 description 1
- DXZVIWFRNGADRH-UHFFFAOYSA-N n-carbamothioyloctanamide Chemical compound CCCCCCCC(=O)NC(N)=S DXZVIWFRNGADRH-UHFFFAOYSA-N 0.000 description 1
- 231100000344 non-irritating Toxicity 0.000 description 1
- JLMHZVYLAQPMOZ-UHFFFAOYSA-N noxytiolin Chemical compound CNC(=S)NCO JLMHZVYLAQPMOZ-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000003170 phenylsulfonyl group Chemical group C1(=CC=CC=C1)S(=O)(=O)* 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000068 pit and fissure sealant Substances 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical class [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
- C08F4/40—Redox systems
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/884—Preparations for artificial teeth, for filling teeth or for capping teeth comprising natural or synthetic resins
- A61K6/887—Compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Veterinary Medicine (AREA)
- Engineering & Computer Science (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
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Description
<div class="application article clearfix" id="description">
<p class="printTableText" lang="en">New Zealand Paient Spedficaiion for Paient Number 1 96864 <br><br>
1CK c <br><br>
Priori • - *■'» t ■ ■, •• & ^ ■ ¥~ • $° <br><br>
• I i'Jt 3«. » 4—'•-.>*.-- • taciaiiaaaaaatata <br><br>
Compl^io G-p«csOcatjcn Filed: Lk^. Class: <br><br>
PubHczCon Date: . ,?.7. APR J984 <br><br>
P.O. Jaumzl, No: <br><br>
?l <br><br>
Patents Form No. 5 Number <br><br>
PATENTS ACT 1953 <br><br>
COMPLETE SPECIFICATION DENTAL COMPOSITIONS <br><br>
&We COLGATE-PALMOLIVE COMPANY of 300 Park Avenue, New York, N.Y.10022, United States of America, a company organised under the laws of the state of Delaware, United States of America do hereby declare the invention for which X/we pray that a Patent may be granted to uw^us, and the method by which it is to be performed, to be particularly described in and by the following statement: <br><br>
- 1 - <br><br>
1 <br><br>
if*N # <br><br>
10 <br><br>
15 <br><br>
20 <br><br>
25 <br><br>
The invention relates in general to polymerizable dental compositions and particularly to such compositions capable of undergoing a rapid rate of cure to produce a product polymerizate having a relatively higher quantity of insoluble component. <br><br>
Polymerizable dental compositions based on the use of methacrylate monomers, e.g. the reaction product of the bis glycidyl ether of bis phenol A and methacrylic acid (hereinafter designated BIS-GMA), are commonly used as fillings, pit and fissure sealants and are advantageously adapted to a wide variety of dental restorative techniques. Such compositions typically include one or more methacrylate monomers.and at least one component of a free radical liberating (redox) polymerization system for said monomer(s). Usually, the monomer composition so formulated includes the peroxy type catalyst (oxidant) which is later contacted with the reducing agent (reductant) shortly prior to dental use. Upon contact of the oxidant with the reductant compositions, usually for convenience provided as pastes, polymerization occurs leading to the formation of a polymerizate having the physical properties necessary to the maintenance of good structural integrity within the oral cavity, e.g. high compressive strength, high degree of insolubles, etc.. The latter condition is highly desirable to minimize leaching out of vital ingredients and consequent deterioration of the polymerizate. <br><br>
/■ <br><br>
I > <br><br>
I ! <br><br>
-2- <br><br>
Rapid and complete curing are thus highly desirable objectives. To some extent, increase in catalyst concentration enhances curing rate; however, correlative enhancement in the degree of cure does not necessarily obtain. In fact, it is often the case that large catalyst concentrations impair the degree of cure thus producing a relatively- larger percentage of soluble and leachable components in the final polymerizate. Moreover, larger amounts of peroxy catalyst increase the possibility of pre-polymerization of methacrylate monomer, i.e. prior to contact with reductant thereby often necessitating the use of adjuvants, often in unusually large amounts having a stabilizing or polymerization retardant effect. However, such retardant effects are inevitably manifest to some extent during monomer-oxidant-reductant contact thereby depressing the cure rate and, unavoidably the degree of cure. <br><br>
Accordingly the invention in its broader aspects provides a polymerizable dental composition and process for using samethe composition having an accelerated curing rate and high degree of cure comprising at least one methacrylate monomer having 2 to k polymerizable double bonds^ from about <br><br>
19-6S-8-4- <br><br>
0 to 400% by weight based on said monomer of inorganic particulate filler, from about 0 to 5% by weight based on said monomer of silane coupling agent, an effective catalyst - activating amount of accelerator comprising cupric ion and from about 0.5 to 5% by weight based on said monomer of compound selected from (a) free radical liberating polymerization catalyst comprising an organic peroxy compound, (b) reducing agent for said peroxy compound and (c) mixtures of (a) and (b), and wherein the concentration (b) does not exceed about 40% by weight of the total quantity of (a) and (b). <br><br>
Cupric ions are most conveniently supplied in the form of copper salts with organic and inorganic acids. Particularly preferred materials for use herein include, without necessary limitation, cupric acetate, cupric acetyl acetonate, cupric chloride, and cupric sulfate. The compounds may be used singly or in admixture comprising two or more. In addition, cuprous ion maybe present with the foregoing, although the cupric compounds are found to be generally more effective as regards the obtention of both high degree and rate of cure. Accordingly, it is particularly preferred herein that cupric ion Cu++, constitute at least about 50% of the total copper ion used. However, and as will be hereinafter demonstrated, the use of cuprous salts alone provides significant improvement when compared to test runs omitting entirely the copper ion. Whether this is due to the presence of cupric ions invariably present in available cuprous salts or to the cuprous ion or to the combination has not been clearly estab- <br><br>
ic," 4 <br><br>
I */ ^ - r <br><br>
The amount of co'pper ion present in the monomer composition is exceedingly small generally ranging from about 5 to 100 ppm preferably 8 to 50 ppm based on total monomer. Otherwise stated, the amount of copper ion is at least that necessary to provide effective catalyst activating or accelerating effects. The term "total monomer" as. used herein refers to the total monomer which would be present at the time polymerization actually occurs. Thus, in accordance with a preferred embodiment, peroxy catalyst, monomer and filler if used are included in a first paste composition referred to as the "oxidant" paste and the reducing agent -for '•said peroxy catalyst is included in a second "reductant" <br><br>
paste preferably including the same components as the first paste except for the peroxy catalyst. The pastes are mixed shortly prior to dental use whereupon polymerization is initiated The copper ion may be added to either or both of the paste j compositions with its presence in the oxidant composition being most preferred. In any event, copper ion concentration in this embodiment has reference to the total monomer present in both the oxidant and reductant pastes. On the basis of catalyst, the concentration of copper ion ranges from about 0.02 to 0.4$ of the peroxy compound. Generally, it is preferred to add the copper compound to the fluid monomer system (absent filler) which is intended as the oxidant paste. <br><br>
The copper compound can be added to the composition by dispensing same in the normally liquid monomer(s) component. <br><br>
The roqirl r;j l;<; <1 1 rip or o"! on onn bo achieved by addlnp 1;lio copper compound to the monomer as a solution in a solvent preferably a polar organic solvent; of low. hoi linn point such as ether or lower alkanol, e.g. methanol. Since the solvent is merely a carrier for the copper compound it is most desirable that it be of high volability so that generally, most if not all of the solvent is removed in subsequent handling operations, e.g. <br><br>
mixing, etc. The amount of solvent used is quite low, thus to provide 80 ppm Cu++, and using only a 1% solution in methanol, <br><br>
the volume of solvent would be only 12.5% of monomer volume and <br><br>
2.5% of a suitable paste on a weight basis. Alternatively, <br><br>
the copper compound may be sorbed onto the filler component, <br><br>
e.g. silica, should such material be used, for mixing with the monomer component(s). <br><br>
In addition to the copper compound, the preferred compositions herein are as follows: <br><br>
Parts by weight <br><br>
Monomer(s) 100 <br><br>
Inorganic particulate filler -0-100 <br><br>
t <br><br>
Silane coupling agent 0.5-5.0 <br><br>
Peroxy catalyst 0.5-5-0 <br><br>
Reducing agent 0.3-2.0 <br><br>
The methacrylate monomer is selected from materials having at least two, and preferably two to four polymerizable double bonds per molecule in order that the cured composite <br><br>
be crosslinked and thus better suited for use in the oral cavity. The most preferred monomers are those having two polymerizable double bonds per molecule. Desirable characteristics.for such monomers include low polymerization shrinkage, low exotherm during polymerization, low water sorption and the ability to cure rapidly and completely in the mouth. It is also desirable that the monomers be low In volatility and non-irritating to the tooth pulp. <br><br>
invention are those represented by the following general formulae: <br><br>
Methacrylate monomers particularly useful in this <br><br>
[ (M- A - 0)n - Ar ] - B <br><br>
(M - A - 0C0)2Ar <br><br>
I <br><br>
' II <br><br>
(M - A) CR <br><br>
M R 2 <br><br>
(M - A - 0C0 - NH)2R <br><br>
m <br><br>
III <br><br>
IV <br><br>
V <br><br>
CH <br><br>
CH <br><br>
CH <br><br>
M <br><br>
2 <br><br>
VI <br><br>
wherein M is methacryloyloxy, i.e. CH = C(CH )C00- ; <br><br>
2 3 <br><br>
M' is methacryloyloxy or hydroxyl; A is alkylene having 1-3 carbon atoms, such as methylene, propylene, isopropylene <br><br>
19686c hydrocyalkylene having 1-3 carbon atoms, such as hydroxy-methylene, 2-hydroxypropylene or acetoxyalkylene having 3-5 carbon atoms in the alkylene group such as 2-acetpxypropylene, 3-acetoxyamylene etc.; n is 1 to 1 preferably 1 or 2; m is 2 or 3 and p is 1 or 2 with the proviso that the sum of m and p is R is hydrogen, methyl, ethyl or -A-M wherein A and M are previously described; Ar is phenylene, e.g. o-phenylene, m-phenylene or p-phenylene, alkyl substituted phenylene, e.g. tolylene or 5-t-butyl-m-phenylene or cycloaliphatic having 6 to 10 carbon atoms such as 1,3-cyclohexylene; <br><br>
\ ^R <br><br>
B is . C . ^ wherein R and R are independently <br><br>
X \ u 5 <br><br>
X Vr5 <br><br>
hydrogen, alkyl e.g. to , or substituted alkyl and R' is alkylene having 2 to 12 carbon atoms such as ethylene, dodecylene etc., or -R^(O-R^) OR- wherein R^ is alkylene having 2 or 3 <br><br>
X <br><br>
carbon atoms such as ethylene, propylene or isopropylene and x is <br><br>
- 8 - <br><br>
2 0 OCT 1983 RECEIVED <br><br>
196864 <br><br>
zero to 5; and is phenylene, tolylene, methylene-bis-pheny-lene or alkylene having 2 to 12 carbon atoms. <br><br>
Monomers having the above formulae are well known and generally commercially available materials. Alternately, they are readily provided by conventional synthetic routes, for example, by reacting a phenolic compound such as diphenolic acid, phloroglucinol or bisphenol A with glycidyl methacrylate in the presence of various tertiary amines or by reacting methacrylic acid with an epoxide containing compound such as the diglycidyl ether of a bisphenol. Some of these monomers also are made by reacting appropriate alcohols with methacrylic acid, methacrylyl chloride or methacrylic anhydride. <br><br>
Illustrative monomers having these formulae include: <br><br>
CH2=C (CH3) COOCH2-OCO—^2y"COOCH2CH2OCOC (CH3) =CH2 <br><br>
C -fCH2OCOC (CH3) =CH214; <br><br>
CH-,CH_C i CH_0-C-C=CH„) ; <br><br>
J Z Z H I Z <br><br>
b ck3 <br><br>
CH2= C(CH3)COO(CH2)4OCOC(CH3)=CH2; <br><br>
CH2= C(CH3)COOCH2CH2OCH2CH2OCH2CH2OCOC(CH2)=CH2; <br><br>
CH2= C (CH3)COO— C (CH'3) —(^) O-COC (CH3)=CH2; <br><br>
CH2=C (CH3) COO-CH2CH (OH) CH9-O—^OCH0CH (OH)CH2OOOC(CH3)=CH2 <br><br>
CH2= C (CH3)COO-CH2CH2OCONH <br><br>
CH OCH2CH(OH)OCOC(CH3)=CH2 <br><br>
HCOOCH2CH2OCOC(CH3)=CH2 <br><br>
CH =C (CH.,) COO-CH-CH- 0CCNH-CHoCHoC-C--C-CHo—NHC00CH-CHo—CXX)-C (CHJ=CH0 <br><br>
Z J Z | Z Zi H | Z . Z Z <br><br>
CH CH CH CH i ■ <br><br>
*2. EXTENT OW** <br><br>
_9_ 2 0 OCT 1983 <br><br>
RECEIV'! <br><br>
19686,4- <br><br>
Monomers having the formulae I, III, III and IV are preferred in the practice of this invention. Of these monomers, I, II and III are particularly preferred, monomers IV being employed more often in admixture with one or more of monomers I, II and III. Further useful monomers comprise: <br><br>
Other useful methacrylate monomers suitable for use in the practice of this invention include those having the following formulae wherein M and Ar are as previously described; <br><br>
4 4 <br><br>
(MR OAr^CfCH^^ wherein R is ispropylene; <br><br>
(MR^OAr)2 and (MR^O)2Ar wherein R^ is 2-hydroxy- <br><br>
propylene; MA R^M wherein R^ is hydroxycyclopentyl or hydroxy- <br><br>
8 8 <br><br>
cyclohexyl, and A is 2-hydroxyethylene; and M2R wherein R is: <br><br>
(A) CH" <br><br>
s >-c-( s <br><br>
<B> ^ <br><br>
-CH2-(S)-CH2- <br><br>
CH2i§)"0i§^CH2- or <br><br>
(D> -ch2"<2^ch2- <br><br>
-10- <br><br>
HZ. PATENT pynca <br><br>
20 OCT 1983 <br><br>
RECEIVED <br><br>
1 9 <br><br>
^ /f o <br><br>
4 <br><br>
15 <br><br>
20 # <br><br>
Preparative? details .for many of those monomers are given in U.S. Patent Nos.3,066,112; 3,721,641; 3,730,9^7; 3,770,881 and 3,77') ,305. A tertiary outcctic monomer mixture also suitable for use in this invention is described in U.S. <br><br>
Patent No. 3,539,526. All of the aforementioned patents are herewith incorporated by reference in their entirety. <br><br>
It is to be understood that mixture of two or more appropriate methacrylate monomers are within the scope of this invention. In fact, depending on the choice of monomers, mixture are often highly desirable to optimize the characteristics of the resulting dental composition. <br><br>
Thus, it is preferred that the monomer or monomer blend have a viscosity of from about 100 to about 10,000 centi-poises as determined using a Brookfield viscometer at 20 rpm,at room temperature. <br><br>
The inorganic particulate filler employed in the compositions of this invention include fused silica, quartz, crystalline silica, amorphous silica, soda glass beads, <br><br>
glass rods, ceramic oxides, particulate silicate glass, radiopaque glasses(barium and strantium glasses), and synthetic minerals such as beta-eucryptic (LiAlSiO^), the latter having a negative coefficient of thermal expansion. It is also feasible to employ finely divided materials and powdered hydroxylapatite, although materials that react with silane coupling agents are preferred. Also available as a filler are colloidal or sub-rnicron silicas coated with a polymer. <br><br>
- 11 - <br><br>
1 <br><br>
5 <br><br>
.0 <br><br>
15 <br><br>
io <br><br>
25 <br><br>
Small amounts of pigments to allow matching of the composition to various shades of teeth can be included. Suitable pigments include iron oxide blacky cadmium yellows and oranges, fluorescent zinc oxides, titanium dioxide, etc.. The filler particles viould be generally smaller than about 50 microns in diameter and preferably smaller than 30 microns. It will be noted that the filler is an optional ingredient,unfilled formulations being employed where the dental composition is intended for use as a coating, malrgin sealant for amalgam restorations or adhesive. <br><br>
The silane coupling agents or keying agents are materials that contain at least one polymerizable double bond to react with the methacrylate monomers. Examples of suitable coupling agents are vinyl trichlorosilane, <br><br>
tris(acetoxy) vinyl silane, 1-N(vinylbenzylaminoethyl) aminopropyl trimethoxysilane-3 or 3-methacryloxypropyl trim-ethoxy silane. The last named1 Material is preferred for use with methacrylate monomers because of the similarity in reactivity of the double bonds. <br><br>
Peroxy catalysts useful herein and capable of initiating polymerization of the methacrylate monomer(s) <br><br>
are well known in the art for such use and include, without limitation, conventional peroxy as well as hydroperoxy compounds such as cumenc hydroperoxide, p-methane hydroperoxide, <br><br>
diisopropyl benzene hydroperoxide and t-butyl hydroperoxides. <br><br>
■ « <br><br>
- 12 - ' <br><br>
c <br><br>
Hydroperoxides are the preferred species of organic peroxy polymerization catalyst with cumene hydroperoxide (CIIP) <br><br>
being particularly preferred. If desired, peroxide stabilizers such as ascorbic acid, maleic acid and the like may be included in small amounts. <br><br>
Reducing agents useful herein generally include any material capable of reacting with the peroxy compound to form polymerization initiating, free radical species as is known in the art. Particularly useful herein is a substituted thiourea having the formula: <br><br>
i ll <br><br>
X N G Z <br><br>
wherein X is H or Y and Y is alkyl having 1 to 8 carbon atoms, such as methyl, butyl, octyl; cycloalkyl having 5 or 6 carbon atoms such as cyclopentyl, cyclohexyl; chloro, hydroxy or mercapto substituted alkyl having 1 to 8 carbon atoms such as"chloroethyl, mereapto-ethyl, hydroxymethyl and chlorooctyl; alkenyl having 3 to 4 carbon atoms, such as allyl or methallyl; aryl having 6 to 8 carbons, such as phenyl or xylyl, and chloro-, hydroxy-, methoxy-, or sulfonyl substituted phenyl such as chlorophenyl,.phenylsulfonyl, hydroxyphenyl and methoxyphenyl; acyl having 2 to 8 carbon atoms such as acetyljbutyry1, octanoylj chloro or methoxy substituted acyl, such as chloroacetyl, chlorobenzoyl, chlorotoluoyl and methoxybenzoyl; aralkyl having 7 to 8 carbon atoms, such <br><br>
- 13 - <br><br>
1 96 v • - - <br><br>
as benzyl, or chloro or methyl substituted aralkyl such as methoxybenzyl; and Z is NH^, NHX or NX . Examples of illustrative compounds suitable for use in the practice of this invention are methyl thiourea, isopropyl thiourea, <br><br>
butyl thiourea octyl thiourea, benzyl thiourea, acetyl thiourea, benzoyl thiourea, octanoyl thiourea, cyclohexyl thiourea, allyl thiourea, 1,1,3-triphenyl thiourea, 1,1,3-trimethyl thiourea, 2,4-xylyl thiourea, p-tolysulfony1 thiourea, l-octyl-3-phenyl thiourea, o-methoxyphenyl thiourea, m-hydroxyphenyl thiourea, 1,1-diallyl thiourea, 1,3-dially thiourea, 2-methallyl thiourea, o-methoxybenzyl thiourea, 1-(hydroxymethyl)-3-methyl thiourea, 1,1-dibutyl thiourea, 1,3-dibutyl thiourea, l-(p chloro phenyl)-3-methyl thiourea, 1 butyl-3-butyryl thiourea, l-acetyl-3-phenyl thiourea, 1 methyl-3-(p-vinylphenyl) thiourea, l-methyl-3-0 tolyl thiourea, l-methyl-3-pentyl thiourea, 3-methyl-l, 1-diphenyl thiourea and l-acetylr, 3-(2 metcaptoethyl) thiourea. While any of the aforementioned thioureas can be employed in the practice of this invention, preferred are the monosubstituted thioureas, that is, those having the aforementioned formula wherein X is H and Z is NH . Particularly preferred are i <br><br>
2 I <br><br>
phenyl thiourea, acetyl thiourea and allyl thiourea. Preferably the composition contains about 0.5 to about 1% by weight of reducing agent. <br><br>
The following examples are given for purposes of <br><br>
_ in _ <br><br>
) <br><br>
illustration only and are not to be considered as limiting the invention. <br><br>
EXAMPLES 1-14 Radiopaque reductant pastes having the following compositions are prepared: <br><br>
Ingredient 1NUPOL 2HMDMA 3A-174 <br><br>
Composition % by Weight j i <br><br>
ABCDEFGHj 10.27 10.24 10.27 10.27 10.27 10.27 10.27 10.2^ 10.27 10.24 10.27 10.27 10.27 10.27 10.27 10.2"/ 1.03 1.02 1.03 1.03 1.03 1.03 1.03' 1.0 <br><br>
Acetyl Thiourea 0.43 0.43 0.43 0.43 0.43 0.43 0.43 0.43 <br><br>
Ascorbic acid <br><br>
4 „ ++ <br><br>
Cu ; <br><br>
'Imsil A-10 <br><br>
0.07 <br><br>
-- .00022 .00044.0011 .0022 .0033-0044 <br><br>
41.86 41.86 41.86 41.86 41.86 41.86 41.86 41.86 <br><br>
'Corning 7724 TOTAL <br><br>
36.14 36.14 36.14 36.14 36.14 36.14 36.14 36.14 <br><br>
100 <br><br>
100 100 100 100 100 100 100; <br><br>
1 - Bis (GMA) <br><br>
2 - 1.6 hexanedioldimethacrylate <br><br>
3 <br><br>
^ * - z-methacryloxy propyl trimethoxy silane <br><br>
- In the form cupric acetate added from methanol solution to monomer mixture c. <br><br>
- Amorphous silica (Illinois Minerals) <br><br>
- Barium Glass (Corning) <br><br>
Radiopaque oxidant pastes having the following compositions arc prepared. <br><br>
Composition % by weight <br><br>
Ingredient Nupol HMDMA A - 17 4 <br><br>
Naleic acid : v Ascorbic, acid <br><br>
Cumene hydroperoxide (80$) <br><br>
Imsil A-10 Corning 7724 Total <br><br>
Oxidant and reductant pastes respectively are mixed in a weight ratio of 1:1 as indicated in the following examples. Curing times are given in minutes and include time required for mixing, approximately 30 seconds. The cessation of the curing reaction is determined by the material no longer being indentable by a spatula. It can also be done by measuring the percent of polymerizate insoluble in methanol upon completion of the curing reaction. Samples of the polymer-forming mass are taken at timed intervals during the curing reaction; cessation of the latter is indicated by the point at which percent insolubles remains substantially constant. The results are summarized as follows: <br><br>
I. <br><br>
9.94 9.94 0.99 <br><br>
0.07 1.05 41.93 36.06 <br><br>
100 <br><br>
.. Sk •- <br><br>
- 3-'--. . <br><br>
J <br><br>
9.78 9.78 0.98 <br><br>
0. .41 <br><br>
• •' <br><br>
1^0 5 <br><br>
41.79 36.22 100 <br><br>
- 16 - <br><br>
> <br><br>
1C ^ < <br><br>
4 \J v..' v,5 <br><br>
Example Oxidant Reductant PPM CU+*1' Cure Temp No. Paste Paste in Reductant Minutes on <br><br>
Paste <br><br>
1 <br><br>
J <br><br>
C <br><br>
2.2 <br><br>
3.5-4.3 <br><br>
21 <br><br>
2 <br><br>
II <br><br>
D <br><br>
4.4 <br><br>
2.8-3.2 <br><br>
23 <br><br>
3 <br><br>
II <br><br>
E . <br><br>
11.0 <br><br>
1.8-2.2 <br><br>
23 <br><br>
4 <br><br>
it <br><br>
F <br><br>
22.0 <br><br>
1.7-2.2 <br><br>
20.5 <br><br>
5 <br><br>
II <br><br>
G <br><br>
33.0 <br><br>
1.5-1.8 <br><br>
21.5 <br><br>
6 <br><br>
ii <br><br>
H <br><br>
44.0 <br><br>
1.3-1.8 <br><br>
23 <br><br>
7 <br><br>
it <br><br>
A <br><br>
none <br><br>
4.0-5.0 <br><br>
27 <br><br>
8 <br><br>
C <br><br>
2.2 <br><br>
3.3-3.8 <br><br>
21 <br><br>
9 <br><br>
II <br><br>
D <br><br>
4.4 <br><br>
2.7-3.5 <br><br>
22.5 <br><br>
10 <br><br>
II <br><br>
E <br><br>
11.0 <br><br>
1.8-2.2 <br><br>
23 <br><br>
11 <br><br>
tt <br><br>
F <br><br>
22.0 <br><br>
1.7-2.0 <br><br>
20.5 <br><br>
12 <br><br>
n <br><br>
G <br><br>
33.0 <br><br>
1.3-1.7 <br><br>
21 <br><br>
13 <br><br>
II <br><br>
Ii <br><br>
44.0 <br><br>
1.25-1.6 <br><br>
23 <br><br>
14 <br><br>
II <br><br>
A <br><br>
none <br><br>
3.3-4.0 <br><br>
21 <br><br>
In each of the runs, curing is carried out in air, i.e. in an open vessel. Increased concentration of Cu"1"* provides more rapid cures. <br><br>
- 17 - <br><br>
1 ~ 5 4 <br><br>
In comparison to Examples 7 and 14, which omit the copper accelerator, the data establish marked improvement in curing rate for the present invention. <br><br>
Similar combinations (1:1) of reductant paste B with I and J produce comparable results. <br><br>
EXAMPLES 15 ~ 17 <br><br>
The procedure of the foregoing examples is repeated but using a Nupol: HMDMA (71:29) by weight monomer blend in each of the oxidant and reductant compositions. <br><br>
Filler is omitted altogether in each of the examples. Copper ions are provided by the following compounds: <br><br>
Example No. Accelerator <br><br>
15 cupric acetate <br><br>
16 cupric chloride <br><br>
17 cupric acetonyl acetonate <br><br>
(no solvent) <br><br>
In each case, improved rate of curing is achieved when compared to identical control runs omitting the copper compound. <br><br>
18 - <br><br>
1 O < A <br><br>
» K J , ■ -}• <br><br>
EXAMPLES 18 - 20 <br><br>
The procedure of Examples 15-17 Is repeated but using the following materials as accelerators: <br><br>
The results are similar to those of the preceding examples. <br><br>
EXAMPLES 21 - 34 Each of examples 1-14 is repeated with the exception that the cupric acetate is sorbed onto the filler and then added to the monomer composition. Similar improvement is obtained in curing rate by comparison with control runs omitting the copper compound. <br><br>
EXAMPLES 35-37 <br><br>
The following reductant-containing and oxidant-containing compositions are prepared: <br><br>
Example No. <br><br>
Accelerator (weight ratios) <br><br>
20 <br><br>
18 <br><br>
19 <br><br>
cupric acetate/cupric chloride (50:50) cupric acetate/cuprous chloride (50:50) cupric chloride/cuprous chloride (50:50' <br><br>
- 19 - <br><br>
REDUCTANT <br><br>
Composition % by weight <br><br>
Ingredient <br><br>
NUPOL <br><br>
HMDMA <br><br>
Acetyl Thiourea Cu++ <br><br>
Corning 7724a IMSIL A-10a Colloidal Silica a. Silanized <br><br>
K <br><br>
9.9 9.9 0.45 0.0002 36.25 42.25 1.30 <br><br>
L <br><br>
9.9 9.9 0.45 <br><br>
0.0005 36.25 42.25 <br><br>
1. 30 <br><br>
M <br><br>
9.9 9.9 0.45 <br><br>
0.0010 <br><br>
36.25 <br><br>
42.25 <br><br>
1. 30 <br><br>
OXIDANT COMPOSITION - N <br><br>
Ingredient NUPOL HMDMA CHP (801) <br><br>
Corning 7724a IMSIL A-10a Colloidal Silica ai Silanized <br><br>
Composition % by weight 9.325 9.325 1.05 36.25 42.25 1. 80 <br><br>
The Oxidant paste is mixed on a clean glass plate with each of the three reductant pastes in a 1:1 ratio. Curing times for each of three mixes are determined by the <br><br>
- 20 - <br><br></p>
</div>
Claims (14)
1. A polymerizable dental composition having an accelerated curing rate comprising at least one methacrylate monomer having 2 to 4 polymerizable double bonds, from 0 to 400% by weight based on said monomer of inorganic particulate filler, from 0 to 5% by weight based on said monomer of silane coupling agent, an effective catalyst -activating amount of accelerator comprising cupric ion and from 0.5 to 5.0% by weight based on said monomer of compound selected from (a) free radical liberating polymerization catalyst comprising an organic peroxy compound, (b) reducing agent for said peroxy compound and (c) mixtures of (a) and (b), and wherein the concentration of (b) does not exceed 40% by weight of the total quantity of (a) and (b).<br><br>
2. A composition according to claim 1 wherein the ratio by weight of (a) to '(b) is 2:1.<br><br>
3. A composition according to claim 1 wherein said reducing agent is a substituted thiourea compound.<br><br>
4. A composition according to claim 3 wherein said reducing agent is an allyl or acetyl - substituted thiourea.<br><br>
5. A composition according to claim 4 wherein reducing agent is acetyl thiourea.<br><br> said peroxy compound is cumene hydropero><br><br> 22<br><br> 1 96684<br><br> (>.
A composition according t.o claim k wherein r.nlil peroxy compound is cumene hydroperoxide and .'Jaid reducing agent is allyl thiourea.<br><br>
7. A composition according to claim 1 wherein said cuprio ioti is present as cupric acetate, cupric acetyl acetonate, cupric chloride, or a mixture thereof.<br><br>
8. A composition according to claim 1 wherein the concentration of said cupric ion is from 5 to 100 ppm based on said monomer.<br><br>
9. A composition according to claim 1 wherein said cupric ion is dispersed in said monomer.<br><br>
10. A composition according to claim 1 wherein at least 40% by weight of said monomer comprises the reaction product; of glycidyl methacrylate and bisphenol A.<br><br>
11. A composition according to claim 10 wherein up to 60 /o by weight of said monomer is 1 ,6- hexanedioldimethacry-late.<br><br>
12. A composition according to claim 1 includi up to 50% bv weight based on the weight of cupric ion of , " -•<br><br> cuprous ion.<br><br> I i4DEfMQ«?<br><br> ng<br><br> -23-<br><br> \ \ ' V<br><br>
13. A composition according to claim 1 having a pat c -.1 ikc c on r. i r> t c nc y.<br><br>
14. A process for forming a dental polymerizate comprising contacting methacrylate monomer having 2 to 4 polymerizable double bonds with a redox polymerization catalyst capable of initiating the polymerization of said methacrylatc monomer and comprising organic3 peroxy compound and reducing agent therefor,said contacting being carried out in the presence of an effective catalyst activating amount of cupric ion.<br><br> WEST-WALKER, McCABE<br><br> per:<br><br> ATTORNEYS FSR-THE APPLICANT<br><br> -24-<br><br> </p> </div>
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14519980A | 1980-04-29 | 1980-04-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NZ196864A true NZ196864A (en) | 1984-04-27 |
Family
ID=22512027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NZ196864A NZ196864A (en) | 1980-04-29 | 1981-04-16 | Polymerisable dental composition containing a methacrylate monomer |
Country Status (20)
| Country | Link |
|---|---|
| JP (1) | JPS56169609A (en) |
| AT (1) | AT376125B (en) |
| AU (1) | AU554532B2 (en) |
| BE (1) | BE888599A (en) |
| BR (1) | BR8102607A (en) |
| CA (1) | CA1223696A (en) |
| CH (1) | CH649465A5 (en) |
| DE (1) | DE3116132A1 (en) |
| DK (1) | DK157727B (en) |
| ES (1) | ES501695A0 (en) |
| FR (1) | FR2481114A1 (en) |
| GB (2) | GB2075035B (en) |
| IE (1) | IE51152B1 (en) |
| MX (1) | MX156002A (en) |
| NL (1) | NL8102128A (en) |
| NO (1) | NO158991C (en) |
| NZ (1) | NZ196864A (en) |
| PH (1) | PH17044A (en) |
| SE (1) | SE450547B (en) |
| ZA (1) | ZA812567B (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3928987A1 (en) * | 1989-09-01 | 1991-03-28 | Siegfried Reiss | METHOD AND SHAPE FORM FOR PRODUCING SHAPINGS FOR THE DENTAL AREA |
| DE4339399A1 (en) * | 1993-11-18 | 1995-05-24 | Thera Ges Fuer Patente | Dental inserts prodn. for use with composite filling materials. |
| US20070100019A1 (en) * | 2005-08-02 | 2007-05-03 | Fuming Sun | Catalyst system for dental compositions |
| DE102005039590B4 (en) * | 2005-08-19 | 2008-05-21 | Heraeus Kulzer Gmbh | Polymerizable dental composition with a 2-component initiator system |
| EP1849449A1 (en) * | 2006-04-26 | 2007-10-31 | 3M Innovative Properties Company | Filler containing composition and process for production and use thereof |
| JP5595264B2 (en) * | 2007-04-25 | 2014-09-24 | デンツプライ インターナショナル インコーポレーテッド | Self-adhesive dental cement |
| JP2009292761A (en) * | 2008-06-04 | 2009-12-17 | Kuraray Medical Inc | Curable composition for dental use |
| JP5388482B2 (en) * | 2008-06-04 | 2014-01-15 | クラレノリタケデンタル株式会社 | Dental curable composition |
| CN102702405B (en) * | 2012-07-05 | 2014-04-09 | 东营市诺尔化工有限责任公司 | Method for preparing ultralow-residue water absorbing resins |
| JP6112887B2 (en) * | 2013-02-05 | 2017-04-12 | 株式会社トクヤマデンタル | Dental curable composition |
| JP6086797B2 (en) * | 2013-04-25 | 2017-03-01 | クラレノリタケデンタル株式会社 | Dental polymerizable composition |
| RU2683315C2 (en) | 2014-07-10 | 2019-03-28 | 3М Инновейтив Пропертиз Компани | Two-component self-adhesive dental composition, process of production and use thereof |
| HK1248527A1 (en) * | 2015-02-09 | 2018-10-19 | Zest Ip Holdings, Llc | Dental compositions and methods of use |
| US11325993B2 (en) | 2017-12-26 | 2022-05-10 | Tokuyama Dental Corporation | Chemical polymerization initiator, adhesive composition, adhesive composition kit, dental material, dental material kit, and method of storing adhesive composition |
| EP3808324A1 (en) * | 2019-09-26 | 2021-04-21 | Shofu Inc. | Curable composition containing transition metal adsorbent |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB714868A (en) * | 1951-12-24 | 1954-09-01 | Dental Fillings Ltd | Improvements in or relating to polymerisation products |
| GB1177879A (en) * | 1967-09-04 | 1970-01-14 | Sumitomo Chemical Co | Catalyst System and process for the Polymerisation of Vinyl Compounds |
| JPS4842467B1 (en) * | 1970-12-04 | 1973-12-12 | ||
| JPS5223509B2 (en) * | 1973-04-26 | 1977-06-24 | ||
| JPS587646B2 (en) * | 1974-05-31 | 1983-02-10 | 東亞合成株式会社 | Niekiseikoukaseisoseibutsu |
| JPS516224A (en) * | 1974-07-05 | 1976-01-19 | Johnson & Johnson | |
| US3991008A (en) * | 1974-08-12 | 1976-11-09 | The Kendall Company | Dental compositions having improved color stability |
| JPS51131197A (en) * | 1975-05-08 | 1976-11-15 | Sankin Ind Co | Uniiliquid type dental cement |
-
1981
- 1981-04-16 NZ NZ196864A patent/NZ196864A/en unknown
- 1981-04-16 ZA ZA00812567A patent/ZA812567B/en unknown
- 1981-04-23 DE DE19813116132 patent/DE3116132A1/en not_active Withdrawn
- 1981-04-27 SE SE8102634A patent/SE450547B/en not_active IP Right Cessation
- 1981-04-27 AT AT0187781A patent/AT376125B/en not_active IP Right Cessation
- 1981-04-28 CA CA000376461A patent/CA1223696A/en not_active Expired
- 1981-04-28 AU AU69911/81A patent/AU554532B2/en not_active Ceased
- 1981-04-28 FR FR8108413A patent/FR2481114A1/en active Granted
- 1981-04-28 NO NO811448A patent/NO158991C/en unknown
- 1981-04-28 CH CH2760/81A patent/CH649465A5/en not_active IP Right Cessation
- 1981-04-28 ES ES501695A patent/ES501695A0/en active Granted
- 1981-04-28 BR BR8102607A patent/BR8102607A/en unknown
- 1981-04-28 PH PH25567A patent/PH17044A/en unknown
- 1981-04-28 BE BE0/204628A patent/BE888599A/en not_active IP Right Cessation
- 1981-04-29 IE IE958/81A patent/IE51152B1/en unknown
- 1981-04-29 DK DK189781A patent/DK157727B/en not_active Application Discontinuation
- 1981-04-29 MX MX187116A patent/MX156002A/en unknown
- 1981-04-29 GB GB8113265A patent/GB2075035B/en not_active Expired
- 1981-04-29 NL NL8102128A patent/NL8102128A/en not_active Application Discontinuation
- 1981-04-30 JP JP6615881A patent/JPS56169609A/en active Pending
-
1983
- 1983-08-11 GB GB838321611A patent/GB8321611D0/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NO158991B (en) | 1988-08-15 |
| MX156002A (en) | 1988-06-14 |
| GB8321611D0 (en) | 1983-09-14 |
| PH17044A (en) | 1984-05-17 |
| DK157727B (en) | 1990-02-12 |
| CH649465A5 (en) | 1985-05-31 |
| ES8206560A1 (en) | 1982-08-16 |
| ATA187781A (en) | 1984-03-15 |
| ZA812567B (en) | 1982-11-24 |
| DK189781A (en) | 1981-10-30 |
| BE888599A (en) | 1981-08-17 |
| NO811448L (en) | 1981-10-30 |
| GB2075035A (en) | 1981-11-11 |
| FR2481114B1 (en) | 1984-11-30 |
| IE810958L (en) | 1981-10-29 |
| FR2481114A1 (en) | 1981-10-30 |
| SE8102634L (en) | 1981-10-30 |
| SE450547B (en) | 1987-07-06 |
| BR8102607A (en) | 1982-01-19 |
| AT376125B (en) | 1984-10-10 |
| GB2075035B (en) | 1984-07-25 |
| CA1223696A (en) | 1987-06-30 |
| IE51152B1 (en) | 1986-10-15 |
| AU554532B2 (en) | 1986-08-28 |
| NO158991C (en) | 1988-11-23 |
| NL8102128A (en) | 1981-11-16 |
| DE3116132A1 (en) | 1982-02-04 |
| JPS56169609A (en) | 1981-12-26 |
| AU6991181A (en) | 1981-11-05 |
| ES501695A0 (en) | 1982-08-16 |
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