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NO972200L - Process for heat sealing substrates using aqueous polymeric dispersions - Google Patents

Process for heat sealing substrates using aqueous polymeric dispersions

Info

Publication number
NO972200L
NO972200L NO972200A NO972200A NO972200L NO 972200 L NO972200 L NO 972200L NO 972200 A NO972200 A NO 972200A NO 972200 A NO972200 A NO 972200A NO 972200 L NO972200 L NO 972200L
Authority
NO
Norway
Prior art keywords
heat sealing
substrate
polymeric dispersions
aqueous polymeric
dispersion
Prior art date
Application number
NO972200A
Other languages
Norwegian (no)
Other versions
NO972200D0 (en
Inventor
Roelof Balk
Gerald Wildburg
Juergen Barwich
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Ag filed Critical Basf Ag
Publication of NO972200D0 publication Critical patent/NO972200D0/en
Publication of NO972200L publication Critical patent/NO972200L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/26—Natural polymers, natural resins or derivatives thereof according to C08L1/00 - C08L5/00, C08L89/00, C08L93/00, C08L97/00 or C08L99/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L3/00—Compositions of starch, amylose or amylopectin or of their derivatives or degradation products

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

Ved en fremgangsmåte for varmforsegling av untderlag så som av kartong, metall- eller plastfolier ved belegging av et underlag med en vantdig dispersjon av et polymerisat av olefinisk umettede monomerer og pressing, under oppvarming, av det belagte underlag med et andre underlag som skal sammenbindes med dette, anvendes det som varmforseglings-klebestoff eller -lakk, for belegging, en polymerisatdispersjon som i begynnelsen av, eller under dispersjonspolymerise- ringen^v monomerene er blitt tilsatt et vannløselig eller vanndispergerbart stivel- sesnedbrytningsprodukl. Fremgangsmåten egner seg spesielt til fremstilling av blisterinnpakninger.In a method for heat sealing of sub-layers such as cardboard, metal or plastic foils by coating a substrate with an aqueous dispersion of a polymerisate of olefinically unsaturated monomers and pressing, during heating, the coated substrate with a second substrate to be bonded with this is used as a heat seal adhesive or lacquer, for coating, a polymerization dispersion to which a water-soluble or water-dispersible starch degradation product has been added at the beginning of or during the dispersion polymerization. The method is particularly suitable for the preparation of blister packs.

NO972200A 1996-05-14 1997-05-13 Process for heat sealing substrates using aqueous polymeric dispersions NO972200L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19619465A DE19619465A1 (en) 1996-05-14 1996-05-14 Process for heat sealing substrates using aqueous polymer dispersions

Publications (2)

Publication Number Publication Date
NO972200D0 NO972200D0 (en) 1997-05-13
NO972200L true NO972200L (en) 1997-11-17

Family

ID=7794314

Family Applications (1)

Application Number Title Priority Date Filing Date
NO972200A NO972200L (en) 1996-05-14 1997-05-13 Process for heat sealing substrates using aqueous polymeric dispersions

Country Status (3)

Country Link
EP (1) EP0807672A3 (en)
DE (1) DE19619465A1 (en)
NO (1) NO972200L (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4133193A1 (en) * 1991-10-07 1993-04-08 Basf Ag WAFER POLYMERISATE DISPERSIONS

Also Published As

Publication number Publication date
DE19619465A1 (en) 1997-11-20
EP0807672A2 (en) 1997-11-19
NO972200D0 (en) 1997-05-13
EP0807672A3 (en) 2000-03-22

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