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NO903363D0 - DEVICE WITH A SEMICONDUCTOR COMPONENT. - Google Patents

DEVICE WITH A SEMICONDUCTOR COMPONENT.

Info

Publication number
NO903363D0
NO903363D0 NO903363A NO903363A NO903363D0 NO 903363 D0 NO903363 D0 NO 903363D0 NO 903363 A NO903363 A NO 903363A NO 903363 A NO903363 A NO 903363A NO 903363 D0 NO903363 D0 NO 903363D0
Authority
NO
Norway
Prior art keywords
semiconductor component
semiconductor
component
Prior art date
Application number
NO903363A
Other languages
Norwegian (no)
Other versions
NO903363L (en
Inventor
Nils Bardahl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NO903363D0 publication Critical patent/NO903363D0/en
Publication of NO903363L publication Critical patent/NO903363L/en

Links

Classifications

    • H10W76/40—
    • H10W42/80—
    • H10W76/138—
NO90903363A 1989-07-31 1990-07-30 DEVICE WITH A SEMICONDUCTOR COMPONENT. NO903363L (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3925328 1989-07-31
DE3941041A DE3941041A1 (en) 1989-07-31 1989-12-12 ARRANGEMENT WITH A SEMICONDUCTOR COMPONENT

Publications (2)

Publication Number Publication Date
NO903363D0 true NO903363D0 (en) 1990-07-30
NO903363L NO903363L (en) 1991-02-01

Family

ID=25883577

Family Applications (1)

Application Number Title Priority Date Filing Date
NO90903363A NO903363L (en) 1989-07-31 1990-07-30 DEVICE WITH A SEMICONDUCTOR COMPONENT.

Country Status (4)

Country Link
EP (1) EP0415059A3 (en)
BR (1) BR9003749A (en)
DE (1) DE3941041A1 (en)
NO (1) NO903363L (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10306767A1 (en) * 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Semiconductor module, e.g. for power semiconductor applications, has insulator that is resistant to high temperatures, arranged between package wall and semiconductor device
US10858011B1 (en) * 2018-07-13 2020-12-08 State Farm Mutual Automobile Insurance Company Dynamic safe storage of vehicle content
EP3824497B1 (en) * 2019-07-31 2022-05-04 Hitachi Energy Switzerland AG Power semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CS182611B1 (en) * 1976-03-18 1978-04-28 Pavel Reichel Power semiconducting element
CH601917A5 (en) * 1976-10-27 1978-07-14 Bbc Brown Boveri & Cie
FR2440077A1 (en) * 1978-10-23 1980-05-23 Transformation En Cie Indle Semiconductor power module casing - with metal discs pressed against O=ring by insulating lipped clamp ring
EP0033399B1 (en) * 1980-02-01 1985-04-17 BBC Aktiengesellschaft Brown, Boveri & Cie. Explosion-protected semiconductor component arrangement

Also Published As

Publication number Publication date
EP0415059A2 (en) 1991-03-06
EP0415059A3 (en) 1992-04-01
DE3941041A1 (en) 1991-02-07
BR9003749A (en) 1991-09-03
NO903363L (en) 1991-02-01

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