NO891063L - Novolakharpikser av blandede aldehyder og positive fotoresistmaterialer fremstilt fra slike harpikser. - Google Patents
Novolakharpikser av blandede aldehyder og positive fotoresistmaterialer fremstilt fra slike harpikser.Info
- Publication number
- NO891063L NO891063L NO89891063A NO891063A NO891063L NO 891063 L NO891063 L NO 891063L NO 89891063 A NO89891063 A NO 89891063A NO 891063 A NO891063 A NO 891063A NO 891063 L NO891063 L NO 891063L
- Authority
- NO
- Norway
- Prior art keywords
- naphthoquinone
- novolak resin
- mixture
- aldehyde
- diazo
- Prior art date
Links
- 229920003986 novolac Polymers 0.000 title claims abstract description 62
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 43
- 150000001299 aldehydes Chemical class 0.000 title claims description 39
- 239000000463 material Substances 0.000 title description 35
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 102
- 239000000203 mixture Substances 0.000 claims abstract description 72
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000011347 resin Substances 0.000 claims abstract description 63
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 150000002989 phenols Chemical class 0.000 claims abstract description 16
- 239000002243 precursor Substances 0.000 claims abstract description 15
- 150000003934 aromatic aldehydes Chemical class 0.000 claims abstract description 10
- 239000007859 condensation product Substances 0.000 claims abstract description 10
- 239000003504 photosensitizing agent Substances 0.000 claims abstract description 10
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 28
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 22
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 9
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical group [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 claims 8
- 150000002148 esters Chemical group 0.000 claims 4
- 238000009472 formulation Methods 0.000 abstract description 8
- 229930192627 Naphthoquinone Natural products 0.000 abstract description 2
- 150000002791 naphthoquinones Chemical class 0.000 abstract description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 2
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229920001079 Thiokol (polymer) Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 150000005691 triesters Chemical class 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- FPYUJUBAXZAQNL-UHFFFAOYSA-N 2-chlorobenzaldehyde Chemical compound ClC1=CC=CC=C1C=O FPYUJUBAXZAQNL-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- SQJBDVFEXQYNPV-UHFFFAOYSA-N C1(C(C=CC2=CC=CC=C12)=O)=O.OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1O)O Chemical compound C1(C(C=CC2=CC=CC=C12)=O)=O.OC1=C(C(=O)C2=CC=CC=C2)C=CC(=C1O)O SQJBDVFEXQYNPV-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229940118056 cresol / formaldehyde Drugs 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- BHXIWUJLHYHGSJ-UHFFFAOYSA-N ethyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OCC BHXIWUJLHYHGSJ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- -1 naphthoquinone diazide compound Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007539 photo-oxidation reaction Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17547388A | 1988-03-31 | 1988-03-31 | |
| US29782888A | 1988-04-22 | 1988-04-22 | |
| US07/227,404 US4920028A (en) | 1988-03-31 | 1988-08-02 | High contrast high thermal stability positive photoresists with mixed cresol and hydroxybenzaldehyde prepared novolak and photosensitive diazoquinone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| NO891063D0 NO891063D0 (no) | 1989-03-13 |
| NO891063L true NO891063L (no) | 1989-10-02 |
Family
ID=27390543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO89891063A NO891063L (no) | 1988-03-31 | 1989-03-13 | Novolakharpikser av blandede aldehyder og positive fotoresistmaterialer fremstilt fra slike harpikser. |
Country Status (10)
| Country | Link |
|---|---|
| EP (1) | EP0336604B1 (ja) |
| JP (1) | JPH0776254B2 (ja) |
| KR (1) | KR930006913B1 (ja) |
| AT (1) | ATE118225T1 (ja) |
| AU (1) | AU3235289A (ja) |
| DE (1) | DE68921017T2 (ja) |
| DK (1) | DK155089A (ja) |
| HK (1) | HK158995A (ja) |
| IL (1) | IL89648A (ja) |
| NO (1) | NO891063L (ja) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5182184A (en) * | 1990-02-05 | 1993-01-26 | Morton International, Inc. | Novolak resins of lowered hydroxyl content and high contrast high thermal stability positive photoresists prepared therefrom |
| JPH03253860A (ja) * | 1990-03-05 | 1991-11-12 | Fuji Photo Film Co Ltd | ポジ型フオトレジスト組成物 |
| JPH03294861A (ja) * | 1990-04-13 | 1991-12-26 | Mitsubishi Petrochem Co Ltd | ポジ型フォトレジスト組成物 |
| JPH05323605A (ja) * | 1992-05-27 | 1993-12-07 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
| JP3319092B2 (ja) * | 1993-11-08 | 2002-08-26 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
| EP0660186A1 (en) * | 1993-12-20 | 1995-06-28 | Mitsubishi Chemical Corporation | Photosensitive resin composition and method for forming a pattern using the composition |
| JP3424341B2 (ja) * | 1994-04-11 | 2003-07-07 | 住友化学工業株式会社 | 感光性樹脂組成物 |
| JP3635598B2 (ja) * | 1995-07-13 | 2005-04-06 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| US5709977A (en) * | 1995-07-13 | 1998-01-20 | Fuji Photo Film Co., Ltd. | Positive working photoresist composition |
| JP2006010779A (ja) * | 2004-06-22 | 2006-01-12 | Nagase Chemtex Corp | 有機膜組成物及びレジストパターン形成方法 |
| KR101324645B1 (ko) * | 2006-05-08 | 2013-11-01 | 주식회사 동진쎄미켐 | 포토레지스트 조성물 |
| JP5876976B2 (ja) * | 2009-01-09 | 2016-03-02 | アイカＳｄｋフェノール株式会社 | ノボラック樹脂および熱硬化性樹脂組成物 |
| CN102577712A (zh) * | 2012-03-16 | 2012-07-18 | 广西钦州力顺机械有限公司 | 可于甘蔗蔗种下方施肥的甘蔗种植机 |
| JP6070020B2 (ja) * | 2012-09-28 | 2017-02-01 | 明和化成株式会社 | ノボラック型フェノール樹脂の製造方法、ノボラック型フェノール樹脂、及びフォトレジスト組成物 |
| WO2014069091A1 (ja) * | 2012-10-30 | 2014-05-08 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、保護膜、絶縁膜および電子装置 |
| WO2014104126A1 (ja) | 2012-12-26 | 2014-07-03 | セントラル硝子株式会社 | ヘキサフルオロイソプロパノール基を含むノボラック樹脂およびその製造方法、並びにその組成物 |
| JP6555975B2 (ja) * | 2015-08-07 | 2019-08-07 | 群栄化学工業株式会社 | 新規イミン基含有樹脂 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58134631A (ja) * | 1982-01-08 | 1983-08-10 | Konishiroku Photo Ind Co Ltd | 感光性組成物 |
| JPS62123444A (ja) * | 1985-08-07 | 1987-06-04 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
| JPH0654381B2 (ja) * | 1985-12-24 | 1994-07-20 | 日本合成ゴム株式会社 | 集積回路作製用ポジ型レジスト |
| DE3686032T2 (de) * | 1985-12-27 | 1993-02-18 | Japan Synthetic Rubber Co Ltd | Strahlungsempfindliche positiv arbeitende kunststoffzusammensetzung. |
| JPS62198852A (ja) * | 1986-02-27 | 1987-09-02 | Japan Synthetic Rubber Co Ltd | ポジ型感放射線性樹脂組成物 |
| JPH0654389B2 (ja) * | 1986-06-23 | 1994-07-20 | 日本合成ゴム株式会社 | ポジ型感放射線性樹脂組成物 |
-
1989
- 1989-03-13 NO NO89891063A patent/NO891063L/no unknown
- 1989-03-17 IL IL89648A patent/IL89648A/xx unknown
- 1989-03-22 AT AT89302864T patent/ATE118225T1/de not_active IP Right Cessation
- 1989-03-22 EP EP89302864A patent/EP0336604B1/en not_active Expired - Lifetime
- 1989-03-22 DE DE68921017T patent/DE68921017T2/de not_active Expired - Fee Related
- 1989-03-30 DK DK155089A patent/DK155089A/da not_active IP Right Cessation
- 1989-03-31 JP JP1078689A patent/JPH0776254B2/ja not_active Expired - Fee Related
- 1989-03-31 KR KR1019890004163A patent/KR930006913B1/ko not_active Expired - Fee Related
- 1989-03-31 AU AU32352/89A patent/AU3235289A/en not_active Abandoned
-
1995
- 1995-10-12 HK HK158995A patent/HK158995A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| HK158995A (en) | 1995-10-20 |
| IL89648A0 (en) | 1989-09-28 |
| DK155089A (da) | 1989-10-01 |
| ATE118225T1 (de) | 1995-02-15 |
| EP0336604B1 (en) | 1995-02-08 |
| DE68921017D1 (de) | 1995-03-23 |
| KR890014613A (ko) | 1989-10-24 |
| DK155089D0 (da) | 1989-03-30 |
| JPH0284414A (ja) | 1990-03-26 |
| EP0336604A3 (en) | 1990-07-25 |
| EP0336604A2 (en) | 1989-10-11 |
| AU3235289A (en) | 1989-10-05 |
| NO891063D0 (no) | 1989-03-13 |
| KR930006913B1 (ko) | 1993-07-24 |
| JPH0776254B2 (ja) | 1995-08-16 |
| DE68921017T2 (de) | 1995-06-01 |
| IL89648A (en) | 1993-01-31 |
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