NO843689L - Palladium-nikkelbelegg som lar seg lodde og fremgangsmaate ved fremstilling av disse - Google Patents

Palladium-nikkelbelegg som lar seg lodde og fremgangsmaate ved fremstilling av disse

Info

Publication number: NO843689L
Authority: NO; Norway
Prior art keywords: layer; palladium; atomic percent; nickel; wear
Prior art date: 1983-11-15

Application number

NO843689A

Other languages

English (en)

Other versions

NO165250C (no

NO165250B (no

Inventor

Stephen Wayne Updegraff

Original Assignee

Du Pont

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-11-15

Filing date

1984-09-17

Publication date

1985-05-20

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24203230&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NO843689(L) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1984-09-17 Application filed by Du Pont filed Critical Du Pont

1985-05-20 Publication of NO843689L publication Critical patent/NO843689L/no

1990-10-08 Publication of NO165250B publication Critical patent/NO165250B/no

1991-01-16 Publication of NO165250C publication Critical patent/NO165250C/no

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12868—Group IB metal-base component alternative to platinum group metal-base component [e.g., precious metal, etc.]
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12875—Platinum group metal-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)
Electroplating And Plating Baths Therefor (AREA)
Laminated Bodies (AREA)
Parts Printed On Printed Circuit Boards (AREA)
Other Surface Treatments For Metallic Materials (AREA)
Non-Insulated Conductors (AREA)
ing And Chemical Polishing (AREA)
Coating With Molten Metal (AREA)
Lead Frames For Integrated Circuits (AREA)

NO843689A 1983-11-15 1984-09-17 Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat. NO165250C (no)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US06/551,925 US4463060A (en)	1983-11-15	1983-11-15	Solderable palladium-nickel coatings and method of making said coatings

Publications (3)

Publication Number	Publication Date
NO843689L true NO843689L (no)	1985-05-20
NO165250B NO165250B (no)	1990-10-08
NO165250C NO165250C (no)	1991-01-16

Family

ID=24203230

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
NO843689A NO165250C (no)	1983-11-15	1984-09-17	Elektrisk ledende substrat forsynt med et palladiumnikkelbelegg og fremsgangsmaate ved fremstilling av det belagte substrat.

Country Status (13)

Country	Link
US (1)	US4463060A (no)
EP (1)	EP0146152B1 (no)
JP (1)	JPS60106993A (no)
KR (1)	KR890002838B1 (no)
AT (1)	ATE24554T1 (no)
AU (1)	AU549886B2 (no)
BR (1)	BR8405026A (no)
CA (1)	CA1255618A (no)
DE (1)	DE3461834D1 (no)
DK (1)	DK446884A (no)
ES (1)	ES536238A0 (no)
MX (1)	MX162670A (no)
NO (1)	NO165250C (no)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4613069A (en) *	1981-11-23	1986-09-23	The United States Of America As Represented By The Secretary Of The Interior	Method for soldering aluminum and magnesium
US4628165A (en) *	1985-09-11	1986-12-09	Learonal, Inc.	Electrical contacts and methods of making contacts by electrodeposition
US4743346A (en) *	1986-07-01	1988-05-10	E. I. Du Pont De Nemours And Company	Electroplating bath and process for maintaining plated alloy composition stable
US4849303A (en) *	1986-07-01	1989-07-18	E. I. Du Pont De Nemours And Company	Alloy coatings for electrical contacts
US4846941A (en) *	1986-07-01	1989-07-11	E. I. Du Pont De Nemours And Company	Electroplating bath and process for maintaining plated alloy composition stable
DE3881022T2 (de) *	1988-02-25	1993-10-07	Du Pont	Elektroplattierungsbad und Verfahren zum Stabilhalten der Zusammensetzung der plattierten Legierung.
DE68909984T2 (de) *	1988-04-01	1994-04-21	Du Pont	Elektroplattierte Legierungsbeschichtungen, die eine stabile Legierungszusammensetzung aufweisen.
JPH0359972A (ja) *	1989-07-27	1991-03-14	Yazaki Corp	電気接点
JPH0484449A (ja) *	1990-07-27	1992-03-17	Shinko Electric Ind Co Ltd	Ｔａｂテープ
US6060175A (en) *	1990-09-13	2000-05-09	Sheldahl, Inc.	Metal-film laminate resistant to delamination
US5086966A (en) *	1990-11-05	1992-02-11	Motorola Inc.	Palladium-coated solder ball
US5597470A (en) *	1995-06-18	1997-01-28	Tessera, Inc.	Method for making a flexible lead for a microelectronic device
US5749933A (en) *	1996-03-28	1998-05-12	Johns Manville International, Inc.	Apparatus and method for producing glass fibers
SG71046A1 (en)	1996-10-10	2000-03-21	Connector Systems Tech Nv	High density connector and method of manufacture
JP3379412B2 (ja) *	1997-05-30	2003-02-24	松下電器産業株式会社	パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
US7023231B2 (en) *	2004-05-14	2006-04-04	Solid State Measurements, Inc.	Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
WO2008063392A2 (en)	2006-11-09	2008-05-29	Wms Gaming Inc.	Wagering game with pay lines extending through bonus regions
WO2012001134A2 (de)	2010-06-30	2012-01-05	Schauenburg Ruhrkunststoff Gmbh	Verfahren zur abscheidung einer nickel-metall-schicht
WO2012001132A1 (de) *	2010-06-30	2012-01-05	Schauenburg Ruhrkunststoff Gmbh	Tribologisch belastbare edelmetall/metallschichten
JP6973051B2 (ja) *	2017-12-26	2021-11-24	株式会社リコー	液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置
JP7111184B2 (ja) *	2019-01-07	2022-08-02	株式会社村田製作所	濾過フィルタ
US20220354091A1 (en) *	2019-06-21	2022-11-10	Panasonic Intellectual Property Management Co., Ltd.	Animal information management system and animal information management method
CN113699565B (zh) *	2021-09-28	2023-07-04	万明电镀智能科技(东莞)有限公司	高耐蚀性钯镍合金镀层及其电镀方法和钯镍镀层电镀液

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4100039A (en) *	1976-11-11	1978-07-11	International Business Machines Corporation	Method for plating palladium-nickel alloy
US4284482A (en) *	1980-09-22	1981-08-18	Bell Telephone Laboratories, Incorporated	Palladium treatment procedure
DE3108466C2 (de) *	1981-03-06	1983-05-26	Langbein-Pfanhauser Werke Ag, 4040 Neuss	Verwendung eines Acetylenalkohols in einem Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung
DE3232735C2 (de) *	1981-09-11	1984-04-26	LPW-Chemie GmbH, 4040 Neuss	Verwendung einer als Glanzbildnerzusatz zu Nickelbädern bekannten Verbindung als Korrosionsschutzadditiv

1983
- 1983-11-15 US US06/551,925 patent/US4463060A/en not_active Expired - Lifetime
1984
- 1984-09-17 NO NO843689A patent/NO165250C/no unknown
- 1984-09-19 DK DK446884A patent/DK446884A/da not_active Application Discontinuation
- 1984-09-19 AU AU33295/84A patent/AU549886B2/en not_active Ceased
- 1984-09-20 CA CA000463708A patent/CA1255618A/en not_active Expired
- 1984-09-21 AT AT84201362T patent/ATE24554T1/de not_active IP Right Cessation
- 1984-09-21 EP EP84201362A patent/EP0146152B1/en not_active Expired
- 1984-09-21 DE DE8484201362T patent/DE3461834D1/de not_active Expired
- 1984-09-26 ES ES536238A patent/ES536238A0/es active Granted
- 1984-10-02 MX MX202921A patent/MX162670A/es unknown
- 1984-10-04 BR BR8405026A patent/BR8405026A/pt not_active IP Right Cessation
- 1984-10-09 JP JP59210613A patent/JPS60106993A/ja active Granted
- 1984-10-11 KR KR1019840006282A patent/KR890002838B1/ko not_active Expired

Also Published As

Publication number	Publication date
ES8602971A1 (es)	1985-12-01
KR890002838B1 (ko)	1989-08-04
DE3461834D1 (en)	1987-02-05
AU3329584A (en)	1985-05-30
EP0146152A1 (en)	1985-06-26
KR850004135A (ko)	1985-07-01
ATE24554T1 (de)	1987-01-15
JPS60106993A (ja)	1985-06-12
MX162670A (es)	1991-06-14
CA1255618A (en)	1989-06-13
ES536238A0 (es)	1985-12-01
EP0146152B1 (en)	1986-12-30
AU549886B2 (en)	1986-02-20
JPS623238B2 (no)	1987-01-23
DK446884A (da)	1985-05-16
US4463060A (en)	1984-07-31
DK446884D0 (da)	1984-09-19
BR8405026A (pt)	1985-08-20
NO165250C (no)	1991-01-16
NO165250B (no)	1990-10-08

Publication	Publication Date	Title
NO843689L (no)	1985-05-20	Palladium-nikkelbelegg som lar seg lodde og fremgangsmaate ved fremstilling av disse
DE3476684D1 (en)	1989-03-16	Amorphous transition metal alloy, thin gold coated, electrical contact
US6572420B2 (en)	2003-06-03	Electrical contacts with specialized surface treatments
KR860003362A (ko)	1986-05-23	동 또는 동합금 제품의 자촉식 주석 도금 방법
ES263866U (es)	1982-11-16	"perfil metalico para la realizacion de elementos conductores de doble cara de contacto".
JPS5945754B2 (ja)	1984-11-08	時計用外装部品
JPS57124308A (en)	1982-08-03	Metal-coated glass fiber
Weil et al.	1992	Electroplated coatings
EP0063925A1 (en)	1982-11-03	Electro-plating process and products therefrom
JPS56142886A (en)	1981-11-07	Tin plating method for aluminum alloy
JPS56112496A (en)	1981-09-04	Plating method
ATE80245T1 (de)	1992-09-15	Kontaktwerkstoff.
JPS6448331A (en)	1989-02-22	Terminal member
JPS5560043A (en)	1980-05-06	Sealing parts
GB1461474A (en)	1977-01-13	Electrical connectors and a method of preparing stable electro platings
JPS56104241A (en)	1981-08-19	Gas sensing element
JP2990539B2 (ja)	1999-12-13	電気コンタクト部材
JPS57177970A (en)	1982-11-01	External parts for watch
Blidariu et al.	1984	Deposition of Sn--Pb Alloy Applied to the Electric Contact Technology
Lanam et al.	1983	The Properties of Sputtered Ruthenium Films
Wirz	1987	Mechanical Plating(MP), Mechanical Galvanizing(MG)
JPS6438936A (en)	1989-02-09	Contact piece
JPS5794599A (en)	1982-06-12	Silver plated film and electroplating method
Ruhlicke et al.	1987	Nickel/Palladium/Gold--an Effective Layer Composite Material With High Reliability
Pushpavanam et al.	1989	Corrosion Behaviour of Electrodeposited Platinum